Server features and specifications

Microprocessor (depending on the model):

• Supports up to two Intel Xeon™ E5-2600 v3 series multi-core microprocessors (one installed)
• Two QuickPath Interconnect (QPI) links speed up to 9.6 GT per second

Note

• Use the Setup utility program to determine the type and speed of the microprocessors.
• For a list of supported microprocessors, see the Lenovo ServerProven website.

Memory (depending on the model):

• Minimum: 4 GB
• Maximum: 1.5 TB
  • 384 GB using registered DIMMs (RDIMMs)
  • 1.5 TB using load reduction DIMMs (LRDIMMs)
• Type:
  • PC4-17000 (DDR4-2133), operating speed depends on memory population
  • Single-rank, dual-rank, or quad-rank
  • Registered DIMM (RDIMM) or load reduced DIMM (LRDIMM)
• Slots: 24 dual inline
• Supports (depending on the model):
  • 4 GB, 8 GB, and 16 GB registered DIMMs
  • 32 GB and 64 GB load reduction DIMM

Integrated functions:

• Integrated management module 2.1 (IMM2.1), which consolidates multiple management functions in a single chip.
• Broadcom BCM5719 Quad Port Gigabit Ethernet controller with Wake on LAN support
• Eight Universal Serial Bus (USB) (depending on the model)
  • Three front of the chassis (Two 2.0 ports and one 3.0 port)
  • Four rear of the chassis (Two 2.0 ports and two 3.0 ports)
  • One internal 3.0 port used for Hypervisor USB key
• Four network ports (four 1 Gb Ethernet ports on the system)
• Supports one optional ML2 network daughter card
• One System Management RJ-45 on the rear to connect to a systems management network. This system management connector is dedicated to the integrated management module 2.1 (IMM2.1) functions.
• Optional serial port

Hard disk drive expansion bays (depending on the model):

• 2.5-inch models:
  • Supports up to sixteen 2.5-inch simple-swap SAS/SATA hard disk drive bays.
  • Supports up to twenty-six 2.5-inch hot-swap SAS/SATA hard disk drive bays .
• 3.5-inch models:
  • Supports up to eight 3.5-inch simple-swap SAS/SATA hard disk drive bays.
  • Supports up to fourteen 3.5-inch hot-swap and two 2.5-inch hot-swap SAS/SATA hard disk drive bays.

Attention

As a general consideration, do not mix standard 512-byte and advanced 4-KB format drives in the same RAID array because it may lead to potential performance issues.

SATA optical drives (optional):

• DVD-ROM
• Multi-burner

RAID controllers (depending on the model):

• A ServeRAID M1215 SAS/SATA adapter that provides RAID 0, 1, and 10 with optional FoD RAID 5/50 and SED (Self Encrypting Drive) upgrade.
• A ServeRAID M5210 SAS/SATA adapter that provides RAID 0, 1, and 10. Optional upgrade:
  • RAID 5/50 (1 GB Cache) with optional FoD RAID 6/60 and SED upgrade
  • RAID 5/50 (1 GB Flash) with optional FoD RAID 6/60 and SED upgrade
  • RAID 5/50 (2 GB Flash) with optional FoD RAID 6/60 and SED upgrade
  • RAID 5/50 (4 GB Flash) with optional FoD RAID 6/60 and SED upgrade
  • FoD RAID 6/60 Upgrade
  • FoD Zero Cache/RAID 5/50
  • FoD Performance Accelerator
  • FoD SSD Caching Enabler

Video controller (integrated into integrated management module 2.1 (IMM2.1)):

• Matrox G200eR2
  Note

  The maximum video resolution is 1600 x 1200 at 75 Hz.
  • SVGA compatible video controller
  • DDR3 528 MHz SDRAM video memory controller
  • Avocent Digital Video Compression
  • 16 MB of video memory (not expandable)

Size (2U):

• Height: 86.5 mm (3.406 in.)
• Depth: EIA flange to rear - 755 mm (29.724 in.), Overall - 800 mm (31.496 in.)
• Width: With top cover - 445.6 mm (17.543 in.), With EIA - 482.0 mm (18.976 in.)
• Weight: approximately 28 kg (62 lb) to 34 kg (75 lb) depending upon configuration

PCI expansion slots:

Riser-card assembly 1

• Type 1
  • Slot 1: PCI Express 3.0 x8 (full-height, full-length)
  • Slot 2: PCI Express 3.0 x8 (full-height, full-length)
  • Slot 3: PCI Express 3.0 x8 (full-height, half-length)
• Type 2
  • Slot 1: PCI Express 3.0 x8 (full-height, full-length)
  • Slot 2: PCI Express 3.0 x8 (full-height, full-length)
  • Slot 3: ML2
• Type 3
  • Slot 1: PCI Express 3.0 x16 (full-height, full-length)
  • Slot 2: Not available
  • Slot 3: PCI Express 3.0 x8 (full-height, half-length)
• Type 4
  • Slot 1: PCI Express 3.0 x16 (full-height, full-length)
  • Slot 2: Not available
  • Slot 3: ML2

PCI expansion slots 4

• Slot 4: PCI Express 3.0 x8 (Low-profile)

PCI expansion slots 5

• Slot 5: PCI Express 3.0 x16 (Low-profile)

Riser-card assembly 2

• Type 5
  • Slot 6: PCI Express 3.0 x8 (full-height, full-length)
  • Slot 7: PCI Express 3.0 x8 (full-height, full-length)
  • Slot 8: PCI Express 3.0 x8 (full-height, half-length)
• Type 6
  • Slot 6: PCI Express 3.0 x16 (full-height, full-length)
  • Slot 7: Not available
  • Slot 8: PCI Express 3.0 x8 (full-height, half-length)

Electrical input:

Sine-wave AC input (50/60 Hz) required

• For 550W/750W/900W AC Platinum power supplies:
  • Input voltage low range:
    • Minimum: 100 Vac
    • Maximum: 127 Vac
  • Input voltage high range:
    • Minimum: 200 Vac
    • Maximum: 240 Vac
• For 750W/1300W Titanium and 1500W Platinum power supplies:
  • Input voltage range:
    • Minimum: 200 Vac
    • Maximum: 240 Vac

DC input required

• For 900W DC power supply
  • Input voltage range:
    • Minimum: -48 Vdc
    • Maximum: -60 Vdc

Maximum Input kilovolt-amperes (kVA), approximately:

• The Minimum Configuration: 0.093 kVA
• The Maximum Configuration: 1.967 kVA

Note

1. Power consumption and heat output vary depending on the number and type of optional features installed and the power-management optional features in use.
2. The noise emission level stated is the declared (upper limit) sound power level, in bels, for a random sample of machines. All measurements are made in accordance with ISO 7779 and reported in conformance with ISO 9296. Actual sound-pressure levels in a given location might exceed the average values stated because of room reflections and other nearby noise sources. The noise emission level stated in the declared (upper limit) sound-power level, in bels, for a random sample of system.

Hot-swap fans:

• One microprocessor: 4 dual-motor hot-swap fans
• Two microprocessors: 6 dual-motor hot-swap fans

Power supply:

• Up to two hot-swap power supplies for redundancy support
  • 550-watt ac 80 PLUS Platinum
  • 750-watt ac 80 PLUS Platinum
  • 750-watt ac 80 PLUS Titanium
  • 900-watt ac 80 PLUS Platinum
  • 900-watt dc
  • 1300-watt ac 80 PLUS Titanium
  • 1500-watt ac 80 PLUS Platinum

Note

1. Power supplies and redundant power supplies in the server must be with the same power rating, wattage or level.
2. You may use the Power Configurator utility to determine current system power consumption. For more information and to download the utility, go to the IBM Power Configurator website.

Acoustical noise emissions:

• Sound power, idling: 6.4 bels maximum
• Sound power, operating: 6.6 bels maximum

Note

1. The noise emission level stated is the declared (upper limit) sound power level, in bels, for a random sample of machines. All measurements are made in accordance with ISO 7779 and reported in conformance with ISO 9296.
2. The PCIe options supported in this system vary greatly in function, power draw, and required cooling. Any increase in cooling required by these options will result in increased fan speed and produced sound power level. The actual sound pressure levels measured in your installation depend upon a variety of factors, including the number of racks in the installation; the size, materials, and configuration of the room; the noise levels from other equipment; the room ambient temperature and pressure, and employees' location in relation to the equipment.

Heat output:

Approximate heat output:

• Minimum configuration: 525.45 Btu per hour (AC 154 watts)
• Maximum configuration: 6667 Btu per hour (AC 1954 watts)

Environment:

The Lenovo Converged HX Series compute node complies with ASHRAE class A3 specifications.

Power on:

• Temperature: 5°C - 40°C (41°F - 104°F) up to 950mm (3,117ft). Above 950m, de-rated maximum air temperature is 1C / 175m.
• Humidity, non-condensing: -12°C dew point (10.4°F) and 8% - 85% relative humidity.
• Maximum dew point: 24°C (75°F)
• Maximum altitude: 3050 m (10,000 ft) and 5°C - 28°C (41°F - 82°F)
• Maximum rate of temperature change: 5°C/hr (41°F/hr) for tape drive, 20°C/hr (68°F/hr) for HDDs

Power off:

• Temperature: 5°C to 45°C (41°F - 113°F)
• Relative humidity: 8% - 85%
• Maximum dew point: 27°C (80.6°F)

Storage (non-operating):

• Temperature: 1°C to 60°C (33.8°F - 140°F)
• Altitude: 3050 m (10,000 ft)
• Relative humidity: 5% - 80%
• Maximum dew point: 29°C (84.2°F)

Shipment (non-operating):

• Temperature: -40°C to 60°C (-40°F - 140°F)
• Altitude: 10,700 m (35,105 ft)
• Relative humidity: 5% - 100%
• Maximum dew point: 29°C (84.2°F)

Attention:

• Design to ASHRAE Class A3, ambient of 40°C, with relaxed support:
  • Support cloud like workload with no performance degradation acceptable (Turbo-Off)
  • Under no circumstance, can any combination of worst case workload and configuration result in system shutdown or design exposure at 40°C
• Chassis is powered on.
• A3 - Derate maximum allowable temperature 1°C/175 m above 950 m.
• The minimum humidity level for class A3 is the higher (more moisture) of the -12°C dew point and the 8% relative humidity. These intersect at approximately 25°C. Below this intersection (~25°C) the dew point (-12°C) represents the minimum moisture level, while above it relative humidity (8%) is the minimum.
• Moisture levels lower than 0.5°C DP, but not lower -10 °C DP or 8% relative humidity, can be accepted if appropriate control measures are implemented to limit the generation of static electricity on personnel and equipment in the data center. All personnel and mobile furnishings and equipment must be connected to ground via an appropriate static control system. The following items are considered the minimum requirements:
  • Conductive materials (conductive flooring, conductive footwear on all personnel that go into the datacenter, all mobile furnishings and equipment will be made of conductive or static dissipative materials).
  • During maintenance on any hardware, a properly functioning wrist strap must be used by any personnel who contacts IT equipment.
• 5°C/hr for data centers employing tape drives and 20°C/hr for data centers employing disk drives.
• Chassis is removed from original shipping container and is installed but not in use, for example, during repair, maintenance, or upgrade.
• The equipment acclimation period is 1 hour per 20°C of temperature change from the shipping environment to the operating environment.
• Condensation is acceptable, but not rain

Particulate contamination: airborne particulates and reactive gases acting alone or in combination with other environmental factors such as humidity or temperature might pose a risk to the server. For information about the limits for particulates and gases, see Particulate contamination.