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Features and specifications

Use this information to view specific information about the compute node, such as compute node hardware features and the dimensions of the compute node.

Note
  1. Power, cooling, and chassis systems management are provided by the Flex System chassis.
  2. The operating system in the compute node must provide USB support for the compute node to recognize and use USB media drives and devices. The Flex System chassis uses USB for internal communication with these devices.

The following table is a summary of the features and specifications of the Flex System x222 Compute Node.

Table 1. Features and specifications.

Two column table that contains compute node features and specifications

Features and specifications
Microprocessor: Up to two multi-core IntelXeon microprocessors each for the upper and lower compute nodes
  • Error-correcting code (ECC) protection on the L2 cache
  • Microprocessor built-in self-test (BIST) during power-on self-test (POST)
  • Processor presence detection
Note
Use the Setup utility to determine the type, speed, and serial number of each microprocessor.
Integrated functions:
  • Renesas SH7757 (IMM2) baseboard management controller (BMC) with integrated VGA controller
  • Emulex BE3 dual-port 10 Gigabit Ethernet controller
  • Light path diagnostics
  • Automatic server restart (ASR)
  • One LSI S/W SATA controller per compute node with support for RAID level-0 or RAID level-11
  • One external USB port per compute node
  • Support for two internal USB ports per compute node
  • Serial over LAN (SOL)
  • Wake on LAN (WOL)
  • Wake on PCI (PME) capability
  • Built-in monitoring for temperature, voltage, and hard disk drives
  • Advanced Configuration and Power Interface (ACPI)
Memory:
  • 12 dual inline memory module (DIMM) connectors per compute node
  • Type: Low-profile (LP), ECC protected, double-data rate (DDR3) DRAM
  • Supports 4 GB, 8 GB, 16 GB, and 32 GB DIMMs with up to 384 GB of total memory on each system board when two microprocessors are installed
  • Support for RDIMMs and LRDIMMs
  • Vital product data (VPD) and parity testing on memory
Drives:
  • Supports one simple-swap, small form factor (SFF) Slim HS Serial ATA (SATA) hard disk drive per compute node.
  • Optional support for solid state drives (SSDs): one 2.5-inch SSD per compute node or up to two 1.8-inch hot-swap SSDs per compute node (with optional SSD mounting sleeve).
Predictive Failure Analysis (PFA) alerts:
  • Microprocessors
  • Memory
  • Hard disk drives

Upgradeable firmware: All firmware is field upgradeable.

Size:
  • Height: 55.5 mm (2.19 in)
  • Depth: 492.7 mm (19.38 in)
  • Width: 217.35 mm (8.56 in)
  • Maximum weight: 8.2 kg (18 lb)
Environment: The Flex System x222 Compute Node complies with ASHRAE class A3 specifications.
  • Power on2:
    • Temperature: 5°C - 40°C (41°F - 104°F)2
    • Humidity, non-condensing: -12°C dew point (10.4°F) and 8% - 85% relative humidity4,5
    • Maximum dew point: 24°C (75°F)
    • Maximum altitude: 3048 m (10,000 ft)
    • Maximum rate of temperature change: 5°C/hr (41°F/hr )6
  • Power off7:
    • Temperature: 5°C to 45°C (41°F - 113°F)
    • Relative humidity: 8% - 85%
    • Maximum dew point: 27°C (80.6°F)
  • Storage (non-operating):
    • Temperature: 1°C to 60°C (33.8°F - 140°F)
    • Altitude: 3050 m (10,006 ft)
    • Relative humidity: 5% - 80%
    • Maximum dew point: 29°C (84.2°F)
  • Shipment (non-operating)8:
    • Temperature: -40°C to 60°C (-40°F - 140°F)
    • Altitude: 10,700 m (35,105 ft)
    • Relative humidity: 5% - 100%
    • Maximum dew point: 29°C (84.2°F)9
  • Particulate contamination
    Attention
    Airborne particulates and reactive gases acting alone or in combination with other environmental factors such as humidity or temperature might pose a risk to the compute node. For information about the limits for particulates and gases, see Particulate contamination.
Security:
  • Fully compliant with NIST 800-131A. The security cryptography mode set by the managing device (CMM or Flex System Manager management node) determines the security mode in which the compute node operates.
  1. The on-board ServeRAID C100 (software RAID) controller supports only SATA drives and solid state drives (SSD); SAS drives are not supported. The booting and use of internal drives with VMware is also not supported. The RAID feature is not supported by some earlier versions of Flex System x222 Compute Node firmware.
  2. Chassis is powered on.
  3. A3 - Derate maximum allowable temperature 1°C/175 m above 950 m.
  4. The minimum humidity level for class A3 is the higher (more moisture) of the -12°C dew point and the 8% relative humidity. These intersect at approximately 25°C. Below this intersection (~25°C), the dew point (-12°C) represents the minimum moisture level; above the intersection, relative humidity (8%) is the minimum.
  5. Moisture levels lower than 0.5°C DP, but not lower -10°C DP or 8% relative humidity, can be accepted if appropriate control measures are implemented to limit the generation of static electricity on personnel and equipment in the data center. All personnel and mobile furnishings and equipment must be connected to ground via an appropriate static control system. The following items are considered the minimum requirements:
    1. Conductive materials (conductive flooring, conductive footwear on all personnel who go into the datacenter; all mobile furnishings and equipment will be made of conductive or static dissipative materials).
    2. During maintenance on any hardware, a properly functioning wrist strap must be used by any personnel who contacts IT equipment.
  6. 5°C/hr for data centers employing tape drives and 20°C/hr for data centers employing disk drives.
  7. Chassis is removed from original shipping container and is installed but not in use, for example, during repair, maintenance, or upgrade.
  8. The equipment acclimation period is 1 hour per 20°C of temperature change from the shipping environment to the operating environment.
  9. Condensation, but not rain, is acceptable.