Replacing a microprocessor and heat sink

Use this information to replace a microprocessor and heat sink.

The following notes describe the type of microprocessor that the server supports and other information that you must consider when you install a microprocessor and heat sink:

• Microprocessors are to be installed only by trained technicians.

  Important: Always use the microprocessor installation tool to install a microprocessor. Failing to use the microprocessor installation tool may damage the microprocessor sockets on the system board. Any damage to the microprocessor sockets may require replacing the system board.

• The server supports up to two Intel Xeon E5-2600 v4 or Intel Xeon E5-2600 v3 series multi-core microprocessors, which are designed for the LGA 2011 socket. See the Lenovo ServerProven website for a list of supported microprocessors.
  Note

  • If your server is preinstalled with Intel Xeon E5-2600 v4 series multi-core microprocessors, do not downgrade the microprocessors to Intel Xeon E5-2600 v3 series.

  • If your server is installed with two Intel Xeon E5-2600 v3 series microprocessors, six dual-rotor fans must be installed for proper cooling.

  • If your server is installed with one or two Intel Xeon E5-2600 v4 series microprocessors with wattage above 135 watt, six dual-rotor fans must be installed for proper cooling when the ambient temperature exceeds 35°C (95°F).

• Do not mix microprocessors with different cores in the same server.
• The first microprocessor must always be installed in microprocessor socket 1 on the system board.
• When one microprocessor is installed, the air baffle must be installed to provide proper system cooling.
• Do not remove the first microprocessor from the system board when you install the second microprocessor.
• When you install the second microprocessor, you must also install additional memory and the fourth fan. See Installing a memory module for details about the installation sequence.
• To ensure proper server operation when you install an additional microprocessor, use microprocessors that have the same QuickPath Interconnect (QPI) link speed, integrated memory controller frequency, core frequency, power segment, internal cache size, and type.
• Mixing microprocessors of different stepping levels within the same server model is supported.
• When mixing microprocessors with different stepping levels within the same server model, you do not have to install the microprocessor with lowest stepping level and features in microprocessor socket 1.
• Both microprocessor voltage regulator modules are integrated on the system board.
• Read the documentation that comes with the microprocessor to determine whether you have to update the server firmware. To download the latest level of server firmware and other code updates for your server, go to the Lenovo Support Portal.
• The microprocessor speeds are automatically set for this server; therefore, you do not have to set any microprocessor frequency-selection jumpers or switches.
• If the thermal-grease protective cover (for example, a plastic cap or tape liner) is removed from the heat sink, do not touch the thermal grease on the bottom of the heat sink or set down the heat sink. For more information about applying or working with thermal grease, see Thermal grease.
  Note

  Removing the heat sink from the microprocessor destroys the even distribution of the thermal grease and requires replacing the thermal grease.
• To order an additional optional microprocessor, contact your sales representative or reseller.

Installation tool has two settings for installing two different sizes of microprocessors. The settings that are marked on the tool are L for smaller low core microprocessors, and H for larger high core microprocessors.

Figure 1. Microprocessor installation tools

To replace a microprocessor and heat sink, complete the following steps:

1. Read the safety information that begins on Safety and Installation guidelines.
2. Turn off the server and peripheral devices and disconnect the power cords and all external cables.
   Attention

   When you handle static-sensitive devices, take precautions to avoid damage from static electricity. For details about handling these devices, see Handling static-sensitive devices.
3. Remove the top cover (see Removing the top cover).
4. Remove the air baffle (see Removing the air baffle).
5. If you are replacing microprocessor 1, remove the memory modules from DIMM connectors 6 and 7. If you are replacing microprocessor 2, remove the memory modules from DIMM connectors 18 and 19. See Removing a memory module for instructions.
6. Rotate the heat sink retention module release lever to the open position.
   Figure 2. Heat-sink lever rotation
   
   
7. Open the microprocessor socket release levers and retainer:
   Figure 3. Microprocessor socket levers and retainer disengagement
   
   
   1. Identify which release lever is labeled as the first release lever to open and open it.
   2. Open the second release lever on the microprocessor socket.
   3. Open the microprocessor retainer.
      Attention

      Do not touch the connectors on the microprocessor and the microprocessor socket.
8. Install the microprocessor on the microprocessor socket:
   1. Touch the static-protective package that contains the new microprocessor to any unpainted on the chassis or any unpainted metal surface on any other grounded rack component; then, carefully remove the microprocessor from the package.
      Note

      Do not touch the microprocessor contacts. Contaminants on the microprocessor contacts, such as oil from your skin, can cause connection failures between the contacts and the socket.
   2. Align the installation tool with the microprocessor socket and lower down the installation tool. The installation tool rests flush on the socket only if properly aligned.
      Figure 4. Installation tool alignment
      
      
   3. Install the microprocessor using the following instructions for your installation tool.
      • Twist the handle of the installation tool assembly counterclockwise to the unlocked position until you can not twist the handle any further; then, lift the installation tool out of the socket.

      Figure 5. Installation tool handle adjustment
      
      

      The following illustrations show the installation tool in the locked and unlocked positions.

      Figure 6. Installation tool
      
      

      Figure 7. Installation tool removal
      
      

      Attention

      • Do not press the microprocessor into the socket.
      • Make sure that the microprocessor is oriented and aligned correctly in the socket before you try to close the microprocessor retainer.
      • Do not touch the thermal material on the bottom of the heat sink or on top of the microprocessor. Touching the thermal material will contaminate it.
9. Remove the cover from the retainer bracket, if one is present. Store the cover in a safe place.
   Figure 8. Socket cover removal
   
   

   Attention

   When you handle static-sensitive devices, take precautions to avoid damage from static electricity. For details about handling these devices, see Handling static-sensitive devices.
10. Close the microprocessor socket release levers and retainer:
    Figure 9. Microprocessor socket levers and retainer engagement
    
    
    1. Close the microprocessor retainer on the microprocessor socket.
    2. Identify which release lever is labeled as the first release lever to close and close it.
    3. Close the second release lever on the microprocessor socket.
11. Install the heat sink.
    Attention

    • Do not set down the heat sink after you remove the plastic cover.
    • Do not touch the thermal grease on the bottom of the heat sink after you remove the plastic cover. Touching the thermal grease will contaminate it. See Thermal grease for more information.
      Figure 10. Thermal grease
      
      
    1. Remove the plastic protective cover from the bottom of the heat sink.
    2. Grasp the heat sink firmly as the following illustration to avoid possible damage to the heat sink.
       Figure 11. Heat sink
       
       
    3. Position the heat sink over the microprocessor. The heat sink is keyed to assist with proper alignment.
       Figure 12. Heat sink installation
       
       
    4. Align and insert the front tab of the heat sink under the retainer bracket tabs.
    5. Align and place the heat sink on top of the microprocessor in the retention bracket, thermal material side down.
    6. Press firmly on the heat sink.
    7. Rotate the heat sink retention module release lever to the closed position and hook it underneath the lock tab.
       Figure 13. Heat sink retention module release lever
       
       
12. Reinstall the air baffle (see Replacing the air baffle).
13. Install the top cover (see Replacing the top cover).
14. Slide the server into the rack.
15. Reconnect the power cords and any cables that you removed.
16. Turn on the peripheral devices and the server.