System reliability guidelines

Use these guidelines to ensure that the compute node meets the cooling and system reliability requirements:

• The Lenovo Flex System chassis is not operated without a compute node or node bay filler in each node bay. See Lenovo Flex System chassisfor additional information.
• Each microprocessor socket always contains a heat-sink filler or a microprocessor and heat sink. If the compute node has only one microprocessor, it must be installed in microprocessor socket 1.
• The air baffles are installed over the DIMM connectors.
• The ventilation holes on the compute node are not blocked.
• The compute node CMOS battery is operational. If the CMOS battery becomes defective, replace it immediately.