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Server features and specifications

Use this information for an overview of the server features and specifications.

The following information is a summary of the features and specifications of the server. Depending on the model, some features might not be available, or some specifications might not apply.

Microprocessor (depending on the model):
  • Supports up to two Intel Xeon E5-2600 v4 series multi-core microprocessors (one installed)
  • Level-3 cache
  • Two QuickPath Interconnect (QPI) links speed up to 9.6 GT per second
Note
  1. Use the Setup utility to determine the type and speed of the microprocessors in the server
  2. For a list of supported microprocessors, see the Lenovo ServerProven website.
Memory:
  • Sixteen DIMM connectors per node (eight per microprocessor)
  • Support RDIMM, 8 GB/16 GB/32 GB memory capacities.
  • Types: PC4-19200 (dual-rank), 2400 MHz, ECC, DDR4 registered DIMMs only.
  • Connectors: Four dual inline memory module (DIMM) connectors.
Hard disk drive expansion bays (depending on the model):

Supports twenty-four 2.5-inch hot-swap SAS/SATA hard disk drive bays (per chassis, total of 4 nodes).

Attention
As a general consideration, do not mix standard 512-byte and advanced 4-KB format drives in the same RAID array because it might lead to potential performance issues.
PCI expansion slots:

Supports three PCI interface slots: low-profile half-length, OCP type mezzanine, and customized mezzanine adapter.

Power supply (depending on the model):

Supports two hot-swap AC power supplies.

  • 1200-watt power supply
  • 1600-watt power supply
  • 1+1 redundant
Important
Do not mix 1200-watt and 1600-watt power supply for use.
RAID controllers (depending on the model):
  • JBOD mode
Integrated functions:
  • TMM, which consolidates multiple management functions in a single chip
  • One System Management RJ-45 port to connect to a systems management network. This system management connector is dedicated to the TMM functions, which consolidates multiple management functions in a single chip
  • Two Universal Serial Bus (USB) ports on the rear on each node
  • Integrated SATA controller in PCH
  • One VGA port
Video controller (integrated into TMM chip):
  • ASPEED
  • SVGA compatible video controller
  • Avocent Digital Video Compression
  • Video memory is not expandable
Note
Maximum video resolution is 1920 x 1200 at 60 Hz.
Size:
2U chassis
  • Height: 87 mm (3.43 inches)
  • Depth: 835 mm (32.9 inches)
  • Width: 442 mm (17.40 inches)
  • Weight:
    • Minimum configuration (with one node): 22.4 kg (49 lbs)
    • Maximum configuration (with four nodes): 36.9 kg (81 lbs)
Node
  • Height: 41 mm (1.62 inches)
  • Depth: 572 mm (22.51 inches)
  • Width: 171 mm (6.74 inches)
  • Weight:
    • Minimum weight: 2.4 kg (5 lb)
    • Maximum weight: 3.7 kg (8 lb)
Acoustical noise emissions:

With the maximum configuration of two microprocessors installed, full memory installed, full hard disk drives installed, and two power supplies installed:

  • Operation: 6.8 bels
  • Idle: 6.2 bels
Environment:
The Converged HX Series complies with ASHRAE class A2 specifications
  • Power on1:
    • Temperature: 10°C - 35°C (50°F - 95°F) up to 950 m (3,117ft). Above 950 m, de-rated maximum air temperature 1°C / 300m 2
    • Humidity, non-condensing: 20% - 80% relative humidity 3
    • Maximum dew point: 21°C (70°F)
    • Maximum altitude: 3050 m (10,000 ft) & 10°C - 28°C (50°F - 82°F)
    • Maximum rate of temperature change: 5°C/hr (41°F/hr) for tape drive, 20°C/hr (68°F/hr) for HDDs 4
  • Power off5:
    • Temperature: 5°C to 45°C (41°F - 113°F)
    • Relative humidity: 8% - 80%
    • Maximum dew point: 27°C (80.6°F)
  • Storage (non-operating)::
    • Temperature: 1°C to 60°C (33.8°F - 140°F)
    • Altitude: 3050 m (10,000 ft)
    • Relative humidity: 5% - 80%
    • Maximum dew point: 29°C (84.2°F)
  • Shipment (non-operating)
    • Temperature: -40°C to 60°C (-40°F - 140°F)
    • Altitude: 10700 m (35105 ft)
    • Relative humidity: 5% - 100%
    • Maximum dew point: 29°C (84.2°F)
Fan fails mode:
When any fan fails and ambient temperature is above 27°C, system performance may be degraded and have an event log indicated.
Heat output (based on 1600–Watts):

Approximate heat output:

  • Minimum configuration: 604.1 BTU per hour (177 watts)
  • Maximum configuration: 6051.3 BTU per hour (1773 watts)
Electrical input:
  • Sine-wave input (50-60 Hz) required
  • Input voltage high range:
    • Minimum: 200 V AC
    • Maximum: 240 V AC
  • Input kilovolt-amperes (kVA), approximately:
    • Minimum: 0.153 kVA
    • Maximum: 1.544 kVA
Attention
  1. Chassis is powered on.
  2. A2 - Derate maximum allowable temperature 1°C/300 m above 950 m.
  3. Moisture levels lower than 0.5°C DP, but not lower -10 °C DP or 8% relative humidity, can be accepted if appropriate control measures are implemented to limit the generation of static electricity on personnel and equipment in the data center. All personnel and mobile furnishings and equipment must be connected to ground via an appropriate static control system. The following items are considered the minimum requirements:
    1. Conductive materials (conductive flooring, conductive footwear on all personnel that go into the datacenter, all mobile furnishings and equipment will be made of conductive or static dissipative materials).
    2. During maintenance on any hardware, a properly functioning wrist strap must be used by any personnel who contacts IT equipment.
  4. 5°C/hr for data centers employing tape drives and 20°C/hr for data centers employing disk drives.
  5. Chassis is removed from original shipping container and is installed but not in use, for example, during repair, maintenance, or upgrade.
1 Racks are measured in vertical increments of 4.45 cm (1.75 inches) each. Each increment is called a "U." A 1-U-high device is 1.75 inches tall