Gap pad, putty pad, and PCM identification and location
Follow the information in this section to identify shape, location, replacing scenarios, and instruction on the gap pad, putty pad, and PCM used in SC777 V4.
See the following for information of various gap pad, putty pad, and PCM used in SC777 V4:
Water loop putty pads and gap pads
Figure 1. Water loop putty pads and gap pads


| Pad number | Pad type | Scenario requiring pad replacing | Pad attaching location |
|---|---|---|---|
| 1 | Putty pad | Replace the putty pads whenever the water loop is removed. | Water loop |
| 2 | Gap pad | Replace the pads when damaged or missing. | |
| 3 | Gap pad (only for system installed with E3.S switch board) | Replace the pads when damaged or missing. |
GB200-NVL4 putty pad on plastic jig
Figure 2. GB200-NVL4 putty pad on plastic jig


| Pad number | Pad type | Scenario requiring pad replacing | Pad attaching location |
|---|---|---|---|
| 1 | Putty pad on plastic jig | Replace the putty pads whenever the GPU cold plate is removed from the tray. | On the GB200-NVL4 board |
GB200-NVL4 PCM for MCIO Configuration
Figure 3. GB200-NVL4 PCM for MCIO Configuration


| Pad number | Pad type | Scenario requiring pad replacing | Pad attaching location |
|---|---|---|---|
| 1 | PCM | Replace the PCM whenever the GPU cold plate is removed from the tray. | On the GB200-NVL4 board |
GB200-NVL4 PCM for Dual CX8 mezzanine module configuration
Figure 4. GB200-NVL4 PCM for Dual CX8 mezzanine module configuration


| Pad number | Pad type | Scenario requiring pad replacing | Pad attaching location |
|---|---|---|---|
| 1 | PCM | Replace the PCM whenever the GPU cold plate is removed from the tray. | On the GB200-NVL4 board and CX8 mezzanine module. |
GB200-NVL4 putty pad for Dual CX8 mezzanine module configuration
Figure 5. GB200-NVL4 putty pad for Dual CX8 mezzanine module configuration


| Pad number | Pad type | Scenario requiring pad replacing | Pad attaching location |
|---|---|---|---|
| 1 | Putty pad | Replace the putty pads whenever the GPU cold plate is removed from the tray. | On the CX8 mezzanine module. |
ConnectX-7 200 adapter putty pads
Figure 6. ConnectX-7 200 adapter putty pads


| Pad number | Pad type | Scenario requiring pad replacing | Pad attaching location |
|---|---|---|---|
| 1 | Putty pad | Replace the putty pads whenever the ConnectX-7 200 riser assembly is removed. | ConnectX-7 200 interface plate |
ConnectX-7 400 adapter putty pads
Figure 7. ConnectX-7 400 adapter putty pads


| Pad number | Pad type | Scenario requiring pad replacing | Pad attaching location |
|---|---|---|---|
| 1 | Putty pad | Replace the putty pads whenever the ConnectX-7 400 riser assembly is removed. | ConnectX-7 400 interface plate |
ConnectX-8 XDR adapter putty pads
Figure 8. ConnectX-8 XDR adapter putty pads


| Pad number | Pad type | Scenario requiring pad replacing | Pad attaching location |
|---|---|---|---|
1 | Putty pad | Replace the pads whenever the ConnectX-8 XDR riser assembly is removed. | ConnectX-8 XDR interface plate |
OSFP adapter putty pads
Figure 9. OSFP adapter putty pads


| Pad number | Pad type | Scenario requiring pad replacing | Pad attaching location |
|---|---|---|---|
| 1 | Putty pad | Replace the pads whenever the OSFP riser assembly is removed. | OSFP interface plate |
E3.S drive putty pads

| Pad number | Pad type | Scenario requiring pad replacing | Pad attaching location |
|---|---|---|---|
| Putty pad | Replace the pad when damaged or missing. | Water loop |
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