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Specifications

The following information is a summary of the features and specifications of the compute node. Depending on the model, some features might not be available, or some specifications might not apply.

Table 1. Specifications
SpecificationDescription
Size
  • Height: 55.5 mm (2.2 in)
  • Depth: 492.7 mm (19.4 in)
  • Width: 215.5 mm (8.5 in)
WeightApproximately 4.7 kg (10.4 lb) to 7.0 kg (15.5 lb), depending on your configuration.
Processor (depending on the model)Processor: Up to two multi-core Intel Xeon processors.
Note

  • Use the Setup utility to determine the type and speed of the processors in the compute node.

  • When using Intel Xeon Gold 6126T 12C 125W 2.6 GHz Processor, Intel Xeon Gold 6144 8C 150W 3.5 GHz Processor, Intel Xeon Gold 6146 12C 165W 3.2 GHz Processor, Intel Xeon Platinum 8160T 24C 150W 2.1 GHz Processor, or Intel Xeon Platinum 6244 8C 150W 3.6 GHz Processor, please note the following:

    • The ambient temperature should be less than 30°C.

    • When operating above 30°C or in the event of a fan failure, the server will continue to function as long as all the component’s temperature requirements are met. However, the performance may be reduced.

    • The noise level will be significantly higher than the base models.

For a list of supported processors, see: Lenovo ServerProven website

Memory

See Memory module installation rules and order for detailed information about memory configuration and setup.

  • Minimum: 8 GB

  • Maximum:

    • 6.9 TB with DC Persistent Memory Module (DCPMM)

  • Type:

    • Error correcting code (ECC), Low-profile (LP) double-data rate (DDR4) RDIMM, LRDIMM, and 3DS RDIMM (mixing is not supported)

    • DC Persistent Memory Module (DCPMM)

  • Supports (depending on the model):

    • 8 GB, 16 GB, 32 GB, and 64 GB RDIMM

    • 64 GB LRDIMM

    • 128 GB 3DS RDIMM

    • 128 GB, 256 GB, and 512 GB DCPMM

  • Slots: 24 dual inline memory module (DIMM) connectors that support up to:

    • 24 DRAM DIMMs
    • 12 DRAM DIMMs and 12 DCPMMs

For a list of supported DIMMs, see: Lenovo ServerProven website

Note

List of supported memory module is different for 1st generation (Skylake) and 2nd generation (Cascade Lake) Intel Xeon processors. Make sure to install compatible memory modules to avoid system error.

2.5-inch drive/backplane
  • Supports up to two small form factor (SFF) drive bays. Drive bay can be either SATA only, SAS/SATA, or NVMe/SATA, depending on the model.
  • Supported 2.5-inch drives:
    • Serial Attached SCSI (SAS)/Serial Advanced Technology Attachment (SATA) hot-swap hard disk drives/solid-state drives
    • Non-Volatile Memory Express (NVMe) solid-state drives
M.2 drive/backplaneThinkSystem M.2 with Mirroring Enablement Kit contains dual M.2 backplane supports up to two identical M.2 drives.
Supports 3 different physical sizes of M.2 drives:

  • 42 mm (2242)

  • 60 mm (2260)

  • 80 mm (2280)

Note
ThinkSystem M.2 Enablement Kit contains single M.2 backplane is only supported in pre-configured models.
RAID adapter

  • RAID 530-4i adapter

  • RAID 930-4i-2GB adapter

Integrated functions
  • One baseboard management controller (BMC) with integrated VGA controller (XClarity Controller or XCC)
  • Light path diagnostics
  • Automatic server restart (ASR)
  • Additional RAID levels supported when an optional RAID controller is installed
  • One external USB 3.2 Gen 1 port
  • Serial over LAN (SOL)
  • Wake on LAN (WOL) when an optional I/O adapter with WOL capability is installed.
Minimum configuration for debugging

  • One processor in processor socket 1

  • One memory DIMM in slot 5

Predictive failure analysis (PFA) alerts
  • Processors
  • Memory
  • Drives
SecurityFully compliant with NIST 800-131A. The security cryptography mode set by the managing device (CMM or Lenovo XClarity Administrator) determines the security mode in which the compute node operates.
EnvironmentThe ThinkSystem SN550 compute node complies with ASHRAE Class A2 specifications. Depending on the hardware configuration, some models comply with ASHRAE Class A3 specifications. System performance may be impacted when operating temperature is outside ASHRAE A2 specification or fan failed condition. The Lenovo ThinkSystem SN550 compute node is supported in the following environment:
  • Air temperature:
    • Operating:
      • ASHRAE Class A2: 10°C - 35°C (50°F - 95°F); decrease the maximum ambient temperature by 1°C for every 300 m (984 ft) increase in altitude above 900 m (2,953 ft)
      • ASHRAE Class A3: 5°C - 40°C (41°F - 104°F); decrease the maximum ambient temperature by 1°C for every 175 m (574 ft) increase in altitude above 900 m (2,953 ft)
    • Compute node off: 5°C to 45°C (41°F to 113°F)
    • Shipment/Storage: -40°C to 60°C (-40°F to 140°F)
  • Maximum altitude: 3,050 m (10,000 ft)
  • Relative Humidity (non-condensing):
    • Operating:
      • ASHRAE Class A2: 8% - 80%, maximum dew point: 21°C (70°F)
      • ASHRAE Class A3: 8% - 85%, maximum dew point: 24°C (75°F)
    • Shipment/Storage: 8% - 90%
  • Particulate contamination
    Attention
    Airborne particulates and reactive gases acting alone or in combination with other environmental factors such as humidity or temperature might pose a risk to the server. For information about the limits for particulates and gases, see Particulate contamination.
Note
The server is designed for standard data center environment and recommended to be placed in industrial data center.
Operating systemsSupported and certified operating systems:

  • Microsoft Windows Server

  • VMware ESXi

  • Red Hat Enterprise Linux

  • SUSE Linux Enterprise Server

References:

Acoustical noise emissions

Note

  • The declared acoustic noise level are based on specified configurations and they may change depending on configuration/condition changes.

  • The declared acoustic noise levels may increase greatly, if high-power components are installed such as high-power NICs, high-power processors and GPUs.

  • Particulate contamination
    Attention: Airborne particulates (including metal flakes or particles) and reactive gases acting alone or in combination with other environmental factors such as humidity or temperature might pose a risk to the device that is described in this document.