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Technical specifications

Summary of the technical specifications of server. Depending on the model, some features might not be available, or some specifications might not apply. The latest specifications information is always available at Lenovo Press website.

Supports fourth-generation AMD® EPYCTM processors, with 5nm process technology.
  • One processors with the new LGA 6096 (SP5) socket
  • Up to 96 Zen4 cores (192 threads)
  • Up to 4 xGMI3 links at up to 32 GT/s
  • Thermal Design Power (TDP): up to 360 watts

For a list of supported processors, see Lenovo ServerProven website.


See Memory module installation rules and order for detailed information about memory configuration and setup.

  • Slots: 12 memory module (DIMM) slots
  • Memory module type: TruDDR5 RDIMM 16 GB (1Rx8), 32 GB (1Rx4), 64 GB (2Rx4)
  • Capacity:
    • Minimum: 16 GB (1 x 16 GB RDIMM)
    • Maximum: 0.75 TB (12 x 64 GB RDIMM)
  • Speed: 4800 MT/s

For a list of supported memory modules, see Lenovo ServerProven website.

Internal drives
  • Front drive bays:

    • Up to 16 x 2.5-inch hot-swap SAS/SATA/NVMe drives

    • Up to 12 x 3.5-inch hot-swap SAS/SATA drives

Expansion slots
  • Up to six PCIe slots

  • One OCP module slot

PCIe slot availability is based on riser selection. See Rear view and PCIe slots and PCIe adapters.

Storage controller
  • ThinkSystem RAID 940-8i 4GB Flash PCIe Gen4 12Gb Adapter

  • ThinkSystem RAID 940-16i 4GB Flash PCIe Gen4 12Gb Adapter

  • ThinkSystem RAID 940-16i 8GB Flash PCIe Gen4 12Gb Adapter


For more information about the RAID/HBA adapters, see Lenovo ThinkSystem RAID Adapter and HBA Reference.

Integrated functions and I/O connectors
  • Lenovo XClarity Controller (XCC), which provides service processor control and monitoring functions, video controller, and remote keyboard, video, mouse, and remote drive capabilities.
  • Front connectors:

    • One VGA connector (optional)

    • One USB 3.1 Gen 1 (5 Gbps) connector

    • One USB 2.0 connector

    • One external diagnostics connector

  • Rear connectors:

    • One VGA connector

    • Three USB 3.1 Gen 1 (5 Gbps) connectors

    • One XCC system management port

    • Two or four Ethernet connectors on the OCP module (optional)

  • OCP module

System fan
  • Supported fan types:
    • Standard fan 6038 (single-rotor, 17000 RPM)

    • Performance fan 6056 (dual-rotor, 21000 RPM)

  • Fan redundancy: N + 1 redundancy, one redundant fan rotor

    • Without riser 3: four hot-swap system fans (one redundant fan rotor)

    • With riser 3: six hot-swap system fans (one redundant fan rotor)

  • Single-rotor hot-swap fans cannot be mixed with dual-rotor hot-swap fans.

  • The redundant cooling by the fans in the server enables continued operation if one rotor of a fan fails.

Power supplies
The server supports up to two power supplies for redundancy.
Power supply200–240 V ac240 V dc

ThinkSystem V3 1100W (230Vac) Titanium Hot-Swap Power Supply

ThinkSystem 1800W (230V) v2 Platinum Hot-Swap Power Supply

  • 240 V dc input (input range: 180-300 V dc) is supported in Chinese Mainland ONLY.

  • Power supply with 240 V dc input cannot support hot plugging power cord function. Before removing the power supply with dc input, please turn off server or disconnect dc power sources at the breaker panel or by turning off the power source. Then, remove the power cord.

Minimal configuration for debugging
  • One processor
  • One memory module in slot 7
  • One power supply
  • One HDD/SSD drive (if OS is needed for debugging)
  • Five system fans
Operating systems
Supported and certified operating systems:
  • Microsoft Windows Server

  • VMware ESXi