Thermal rules
This topic provides thermal rules for the server.
TDP: Thermal Design Power
S/S: SAS/SATA
Max.Temp.: Maximum ambient temperature at sea level
Any: AnyBay
S: standard
P: performance
NA: none
Y: yes
N: no
Group B: 200 W ≤ TDP ≤ 240 W
Group A: 260 W < TDP ≤ 300 W
Group E: 320 W ≤ TDP ≤ 400 W
Standard configurations
This section provides thermal information for standard configurations.
| Front bays | Support riser 3 | Max. Temp. | Processor | Heat sink | Air baffle | Fan type | Support DIMMs >= 96 GB |
|---|---|---|---|---|---|---|---|
| Y | 45°C | Group B | 2U P | S | P | N |
| Y | 35°C | Group B | 2U S | S | S | N | |
| Y | 35°C | Group B, A | 2U S | S | P | Y | |
| Y | 30°C | Group E | 2U P | S | P | Y | |
| Y | 45°C | Group B | 2U P | S | P | N |
| Y | 35°C | Group B | 2U S | S | S | N | |
| Y | 35°C | Group B, A | 2U S | S | P | Y | |
| Y | 30°C | Group E | 2U P | S | P | Y | |
8 x 3.5" | Y | 45°C | Group B | 2U P | S | P | N |
| Y | 35°C | Group B | 2U S | S | S | N | |
| Y | 35°C | Group B, A | 2U S | S | P | Y | |
| Y | 30°C | Group B, A | 2U S | S | P | Y | |
| Y | 30°C | Group E | 2U P | S | P | Y | |
| N | 35°C | Group B | 2U S | S | S x 4 | N |
| N | 30°C | Group B, A | 2U S | S | P x 4 | Y |
When a part with active optical cable (AOC) is installed and the rate of the part is greater than 25 GB, the ambient temperature must be limited to 30°C or lower.
When the following parts are installed, the ambient temperature must be limited to 35°C or lower.
PCIe network interface cards (NICs) at a rate greater than or equal to 100 GB
Parts with AOC and at a rate of 25 GB
Storage configurations
This section provides thermal information for storage configurations.
| Front bays | Middle bays | Rear bays | Max. Temp. | Processor | Heat sink | Air baffle | Fan type | Support DIMMs >= 96 GBnote |
|---|---|---|---|---|---|---|---|---|
| NA | NA | 30°C | Group B | 2U S | S | S | N |
| NA | NA | 30°C | Group B | 2U S | S | P | Y | |
| NA | NA | 30°C | Group A | 2U P | S | P | Y | |
| NA | NA | 30°C | Group Enote | 2U P | S | P | Y | |
| NA | NA | 25°C | Group E | 2U P | S | P | Y | |
| NA | Ynote | 30°C | Group B, A | 2U P | S | P | N | |
| Ynote | NA | 30°C | Group B, A | 2U P | NA | P | N | |
| Ynote | Ynote | 30°C | Group B | 2U P | NA | P | N | |
| NA | Y | 25°C | Group B, A | 2U P | S | P | Y | |
| Y | NA | 25°C | Group B, A | 2U P | NA | P | Y | |
| Y | Y | 25°C | Group B, A | 2U P | NA | P | Y | |
12 x 3.5" | NA | NA | 30°C | Group B | 2U S | S | P | Y |
| NA | NA | 30°C | Group A | 2U P | S | P | Y | |
| NA | NA | 25°C | Group Enote | 2U P | S | P | Y | |
| NA | Y | 30°C | Group B, A | 2U P | S | P | N | |
| Y | NA | 30°C | Group B, A | 2U P | NA | P | N | |
| Y | Y | 30°C | Group B | 2U P | NA | P | N | |
| 25°C | Group B, A | 2U P | NA | P | Y |
When a part with active optical cable (AOC) is installed and the rate of the part is greater than 25 GB, the ambient temperature must be limited to 30°C or lower.
For storage configurations, group E processors are limited to AMD EPYC 9754/9734/9654(P)/9554(P)/9174F processors.
When the server is equipped with middle and/or rear drives, the supported maximum ambient temperature is 25°C with Gen5 7.68 TB or larger capacity NVMe drives installed.
ThinkSystem 128GB TruDDR5 4800MHz (2S2Rx4) 3DS RDIMM-A v2 is supported in all configurations listed above, except for when using standard fans.
GPU configuration
This section provides thermal information for the GPU configuration.
Half-height half-length (HHHL) single-wide (SW) GPU: A2, L4
DW GPU: A16, A30, A40, L40, L40S, A100, A2000, A4500, A6000, H100, AMD MI210
| Front bays | Max. Temp. | Processor | Heat sink | Air baffle | Fan type | Max. GPU Qty. | ||||
|---|---|---|---|---|---|---|---|---|---|---|
| SW (A2/L4) | DW (A2000) | DW (A40/L40) | DW (Others) | DW (H100/L40S) | ||||||
8 x 2.5" | 30°C | Group B | 2U S | S | P | 8 | 3 | NA | NA | NA |
| Group A | 2U P | S | P | 8 | 3 | NA | NA | NA | ||
| Group B, A | 2U P | GPU | P | NA | NA | 3 | 3 | 3 | ||
16 x 2.5" | 30°C | Group B | 2U S | S | P | 8 | 3 | NA | NA | NA |
| Group A | 2U P | S | P | 8 | 3 | NA | NA | NA | ||
| Group B, A | 2U P | GPU | P | NA | NA | 2 (slot 2/5) | 3 | 2 (slot 2/5) | ||
8 x 3.5" | 30°C | Group B | 2U S | S | P | 8 | 3 | NA | NA | NA |
| Group A | 2U P | S | P | 8 | 3 | NA | NA | NA | ||
| Group B, A | 2U P | GPU | P | NA | NA | 3 | 3 | 3 | ||
24 x 2.5" | 25°C | Group B | 2U S | S | P | 6 | 3 | NA | NA | NA |
| Group A | 2U P | S | P | 6 | 3 | NA | NA | NA | ||
| Group B, A | 2U P | GPU | P | NA | NA | NA | 2 (slot 2/5) | 2 (slot 2/5) | ||
| 25°C | Group B | 2U S | S | P | 6 | 3 | NA | NA | NA |
| Group A, Enote | 2U P | S | P | 6 | 3 | NA | NA | NA | ||
| Group B, A, Enote | 2U P | GPU | P | NA | NA | NA | 2 (slot 2/5) | NA | ||
When a part with active optical cable (AOC) is installed and the rate of the part is greater than 25 GB, the ambient temperature must be limited to 30°C or lower.
For GPU configurations, group E processors are limited to AMD EPYC 9754/9734/9654(P)/9554(P)/9174F processors.