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Thermal rules

This topic provides thermal rules for the server.

Abbreviations used in tables below are defined as following:
  • TDP: Thermal Design Power

  • S/S: SAS/SATA

  • Max.Temp.: Maximum ambient temperature at sea level

  • Any: AnyBay

  • S: standard

  • P: performance

  • NA: none

  • Y: yes

  • N: no

Processor groups are defined as follows:
  • Group B: 200 W ≤ TDP ≤ 240 W

  • Group A: 260 W < TDP ≤ 300 W

  • Group E: 320 W ≤ TDP ≤ 400 W

Standard configurations

This section provides thermal information for standard configurations.

Front baysSupport riser 3Max. Temp.ProcessorHeat sinkAir baffleFan typeSupport DIMMs >= 96 GB
  • 8 x 2.5"

  • FIO

Y45°CGroup B2U PSPN
Y35°CGroup B2U SSSN
Y35°CGroup B, A2U SSPY
Y30°CGroup E2U PSPY
  • 16 x 2.5"

  • FIO

Y45°CGroup B2U PSPN
Y35°CGroup B2U SSSN
Y35°CGroup B, A2U SSPY
Y30°CGroup E2U PSPY

8 x 3.5"

Y45°CGroup B2U PSPN
Y35°CGroup B2U SSSN
Y35°CGroup B, A2U SSPY
Y30°CGroup B, A2U SSPY
Y30°CGroup E2U PSPY
  • 8 x 2.5"

  • 16 x 2.5"

  • 8 x 3.5"

N35°CGroup B2U SSS x 4N
N30°CGroup B, A2U SSP x 4Y
Note
  • When a part with active optical cable (AOC) is installed and the rate of the part is greater than 25 GB, the ambient temperature must be limited to 30°C or lower.

  • When the following parts are installed, the ambient temperature must be limited to 35°C or lower.

    • PCIe network interface cards (NICs) at a rate greater than or equal to 100 GB

    • Parts with AOC and at a rate of 25 GB

Storage configurations

This section provides thermal information for storage configurations.

Front baysMiddle baysRear baysMax. Temp.ProcessorHeat sinkAir baffleFan typeSupport DIMMs >= 96 GB
  • 24 x 2.5"

  • 16 x 2.5" + FIO

NANA30°CGroup B2U SSSN
NANA30°CGroup B2U SSPY
NANA30°CGroup A2U PSPY
NANA30°CGroup Enote2U PSPY
NANA25°CGroup E2U PSPY
NAYnote30°CGroup B, A2U PSPN
YnoteNA30°CGroup B, A2U PNAPN
YnoteYnote30°CGroup B2U PNAPN
NAY25°CGroup B, A2U PSPY
YNA25°CGroup B, A2U PNAPY
YY25°CGroup B, A2U PNAPY

12 x 3.5"

NANA30°CGroup B2U SSPY
NANA30°CGroup A2U PSPY
NANA25°CGroup Enote2U PSPY
NAY30°CGroup B, A2U PSPN
YNA30°CGroup B, A2U PNAPN
YY30°CGroup B2U PNAPN
25°CGroup B, A2U PNAPY
Note
  • When a part with active optical cable (AOC) is installed and the rate of the part is greater than 25 GB, the ambient temperature must be limited to 30°C or lower.

  • For storage configurations, group E processors are limited to AMD EPYC 9754/9734/9654(P)/9554(P)/9174F processors.

  • When the server is equipped with middle and/or rear drives, the supported maximum ambient temperature is 25°C with Gen5 7.68 TB or larger capacity NVMe drives installed.

GPU configuration

This section provides thermal information for the GPU configuration.

  • Half-height half-length (HHHL) single-wide (SW) GPU: A2

  • DW GPU: A16, A30, A40, L40, A100, A2000, A4500, A6000, H100, AMD MI210

Front baysMax. Temp.ProcessorHeat sinkAir baffleFan typeMax. GPU Qty.
SW (A2)DW (A2000)DW (A40/L40)DW (Others)DW (H100)

8 x 2.5"

30°CGroup B2U SSP83NANANA
Group A2U PSP83NANANA
Group B, A2U PGPUPNANA333

16 x 2.5"

30°CGroup B2U SSP83NANANA
Group A2U PSP83NANANA
Group B, A2U PGPUPNANA2 (slot 2/5)32 (slot 2/5)

8 x 3.5"

30°CGroup B2U SSP83NANANA
Group A2U PSP83NANANA
Group B, A2U PGPUPNANA333

24 x 2.5"

25°CGroup B2U SSP63NANANA
Group A2U PSP63NANANA
Group B, A2U PGPUPNANANA2 (slot 2/5)2 (slot 2/5)
  • 8 x 2.5"

  • 16 x 2.5"

  • 8 x 3.5"

25°CGroup B2U SSP63NANANA
Group A, Enote2U PSP63NANANA
Group B, A, Enote2U PGPUPNANANA2 (slot 2/5)NA
Note
  • When a part with active optical cable (AOC) is installed and the rate of the part is greater than 25 GB, the ambient temperature must be limited to 30°C or lower.

  • For GPU configurations, group E processors are limited to AMD EPYC 9754/9734/9654(P)/9554(P)/9174F processors.