Thermal rules for server with 9005 series processors

This topic provides thermal rules for the server with 9005 series processors.

Abbreviations used in tables below are defined as follows:

Max.Temp.: Maximum ambient temperature at sea level
FIO = riser 5 + front OCP
S/S: SAS/SATA
Any: AnyBay
S: standard
P: performance
A: advanced
NA: not applicable
Y: yes
Y* in the Middle bays or Rear bays column: yes (when no Gen5 7.68 TB or larger capacity NVMe drive or no Gen4 P5336 15.36 TB/30.72 TB/61.44 TB NVMe drive is installed)
N: no
DWCM: Direct Water Cooling Module

Processor groups are defined as follows:

Group D: 9015, 9115
Group B: 9135, 9335, 9255
Group A: 9355(P), 9535, 9365, 9455(P)
Group E¹: 9555(P), 9565, 9645, 9655(P), 9745, 9825, 9845
Group E²: 9375F, 9475F, 9575F
Group E³: 9175F, 9275F

Standard configurations

This section provides thermal information for standard configurations.

Front bays	Max. Temp.	Processor	Heat sink	Air baffle	Fan type	Support ≥ 64 GB DIMM
8 x 2.5" 16 x 2.5" 8 x 3.5" FIO 8 x2.5"+FIO	35°C	Group B, D	2U S	S	S	N
		Group B, A, D	2U S	S	P	Y
		Group E¹	2U A	S	P	Y
		Group B, A, D, E	DWCM	S	S	Y
	30°C	Group E¹	2U P	S	P	Y
	30°C	Group E², E³	2U A	S	P	Y
	25°C	Group E²	2U P	S	P	Y

Note

When a part with active optical cable (AOC) is installed and the rate of the part is greater than 25 GB, the ambient temperature must be limited to 30°C or lower.
When the following parts are installed, the ambient temperature must be limited to 35°C or lower.
- PCIe network interface cards (NICs) at a rate greater than or equal to 100 GB
- Parts with AOC and at a rate of 25 GB

Storage configurations with DWCM

This section provides thermal information for storage configurations with DWCM.

Front bays	Middle bays	Rear bays	Max. Temp.	Processor	Heat sink	Air baffle	Fan type	Support ≥ 64 GB DIMM
24 x 2.5" 16 x 2.5" + FIO 12 x 3.5"	N	N	35°C	Group B, A, D, E	DWCM	S	S	Y
N/Y	N/Y	35°C	Group B, A, D, E ^{note 1}	DWCM	S	P	Y

Front bays

Middle bays

Rear bays

Max. Temp.

Processor

Heat sink

Air baffle

Fan type

Support ≥ 64 GB DIMM

24 x 2.5"

16 x 2.5" + FIO

12 x 3.5"

35°C

Group B, A, D, E

DWCM

N/Y

35°C

Group B, A, D, E ^{note 1}

DWCM

Storage configurations without DWCM

This section provides thermal information for storage configurations without DWCM.

Middle bays	Rear bays	Max. Temp.	Processor	Heat sink	Air baffle	Fan type	Support ≥ 64 GB DIMM
N	N	30°C	Group B, D	2U S	S	S	N
N	N	30°C	Group A	2U P	S	S	N
N	N	30°C	Group B, D	2U S	S	P	Y
N	N	30°C	Group A	2U P	S	P	Y
N	N	30°C	Group E¹, E²	2U A	S	P	Y
N	Y*	30°C	Group D	2U S	S	P	N
N	Y*	30°C	Group B, A	2U P	S	P	N
Y*	N	30°C	Group B, A, D	2U P	N/A	P	N
Y*	Y*	30°C	Group B, D	2U P	N/A	P	N
N	N	25°C	Group E¹	2U P	S	P	Y
N	N	25°C	Group E², E³	2U A	S	P	Y
N	Y	25°C	Group D	2U S	S	P	Y
N	Y	25°C	Group B, A	2U P	S	P	Y
N	Y	25°C	Group E³	2U A	S	P	Y
Y	N/Y	25°C	Group B, A, D	2U P	NA	P	Y
N	N	30°C	Group B, D	2U S	S	P	Y
N	N	30°C	Group A	2U P	S	P	Y
N	N	30°C	Group E¹, E²	2U A	S	P	Y
N	Y*	30°C	Group D	2U S	S	P	N
N	Y*	30°C	Group B, A	2U P	S	P	N
Y*	N	30°C	Group B, A, D	2U P	N/A	P	N
Y*	Y*	30°C	Group B, D	2U P	N/A	P	N
N	N	25°C	Group E¹	2U P	S	P	Y
N	N	25°C	Group E², E³	2U A	S	P	Y
N	Y	25°C	Group D	2U S	S	P	N
N	Y	25°C	Group B, A	2U P	S	P	N
N	Y	25°C	Group E³	2U A	S	P	N
Y	N/Y	25°C	Group B, A, D	2U P	NA	P	N

Note

The ambient temperature is limited to 30°C when the following NVMe drives are installed in middle or rear drive bays:
- Gen5 7.68 TB or larger capacity
- P5336 15.36TB or larger capacity
When a part with active optical cable (AOC) is installed and the rate of the part is greater than 25 GB, the ambient temperature must be limited to 30°C or lower.
When the following parts are installed, the ambient temperature must be limited to 35°C or lower.
- PCIe network interface cards (NICs) at a rate greater than or equal to 100 GB
- Parts with AOC and at a rate of 25 GB

GPU configurations

This section provides thermal information for GPU configurations.

Half-height half-length (HHHL) single-wide (SW) GPU: A2, L4
DW GPU: A16, A30, A40, L40, L40S, A100, RTX A2000, RTX A4500, RTX A6000, RTX 4500 Ada, RTX 6000 Ada, H100, H100 NVL, AMD MI210

Front bays	Max. Temp.	Processor	Heat sink	Air baffle	Fan type	Max. GPU Qty.
Front bays	Max. Temp.	Processor	Heat sink	Air baffle	Fan type	SW	DW (A2000)	DW (A40/L40)	350W DW	Other DW
8 x 2.5" 8 x 3.5" FIO	30°C	Group B, D	2U S	S	P	8	3	NA	NA	NA
		Group A	2U P	S	P	8	3	NA	NA	NA
		Group B, A, D	2U P	GPU	P	NA	NA	3	3	3
		Group E¹	2U P	S	P	6	3	NA	NA	NA
		Group E¹	2U P	GPU	P	NA	NA	2 (slot 2/5)	2 (slot 2/5)	2 (slot 2/5)
16 x 2.5" 8 x 2.5" + FIO	30°C	Group B, D	2U S	S	P	8	3	NA	NA	NA
		Group A	2U P	S	P	8	3	NA	NA	NA
		Group B, A, D	2U P	GPU	P	NA	NA	2 (slot 2/5)	2 (slot 2/5)	3
	25°C	Group E¹	2U P	S	P	6	3	NA	NA	NA
	25°C	Group E¹	2U P	GPU	P	NA	NA	2 (slot 2/5)	2 (slot 2/5)	2 (slot 2/5)
24 x 2.5" 16 x 2.5" + FIO	25°C	Group B, D	2U S	S	P	6	3	NA	NA	NA
		Group A	2U P	S	P	6	3	NA	NA	NA
		Group B, A, D	2U P	GPU	P	NA	NA	2 (slot 2/5)	2 (slot 2/5)	2 (slot 2/5)

Note

In GPU configurations with 24 x 2.5" or 16 x 2.5" + FIO front bays or GPU configurations with Group E¹ processors, a part with AOC and at a rate greater than 25 GB cannot be installed on slot 3, and the following parts are not supported:

Broadcom 57416 10GBASE-T 2-port OCP
Broadcom 57454 10GBASE-T 4-port OCP

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Thermal rules for server with 9005 series processors

Standard configurations​

Storage configurations with DWCM​

Storage configurations without DWCM​

GPU configurations​

Standard configurations

Storage configurations with DWCM

Storage configurations without DWCM

GPU configurations