Thermal rules for server with 9005 series processors

This topic provides thermal rules for the server with 9005 series processors.

Abbreviations used in tables below are defined as follows:

Max.Temp.: Maximum ambient temperature at sea level
FIO = riser 5 + front OCP
S/S: SAS/SATA
Any: AnyBay
S: standard
P: performance
A: advanced
NA: not applicable
Y: yes
Y* in the Middle bays or Rear bays column: yes (when no Gen5 7.68 TB or larger capacity NVMe drive or no Gen4 P5336 15.36 TB/30.72 TB/61.44 TB NVMe drive is installed)
N: no
DWCM: Direct Water Cooling Module

Processor groups are defined as follows:

Standard configurations

This section provides thermal information for standard configurations.

Front bays	Max. Temp.	Processor	Heat sink	Air baffle	Fan type	Support ≥ 64 GB DIMM
8 x 2.5" 16 x 2.5" 8 x 3.5" FIO 8 x2.5"+FIO	35°C	Group B, D	2U S	S	S	N
		Group B, A, D	2U S	S	P	Y
		Group E¹	2U A	S	P	Y
		Group B, A, D, E	DWCM	S	S	Y^{note 3}
	30°C	Group E¹	2U P	S	P	Y
	30°C	Group E², E³	2U A	S	P	Y
	25°C	Group E²	2U P	S	P	Y

Note

When a part with active optical cable (AOC) is installed and the rate of the part is greater than 25 GB, the ambient temperature must be limited to 30°C or lower.
When the following parts are installed, the ambient temperature must be limited to 35°C or lower.
- PCIe network interface cards (NICs) at a rate greater than or equal to 100 GB
- Parts with AOC and at a rate of 25 GB
When standard fans are used, the max. supported ambient temperature is 30°C; when performance fans are used, the max. supported ambient temperature is 35°C.

This section provides thermal information for storage configurations without DWCM.

Front bays	Middle bays	Rear bays	Max. Temp.	Processor	Heat sink	Air baffle	Fan type	Support ≥ 64 GB DIMM
24 x 2.5" 16 x 2.5" + FIO	N	N	30°C	Group B, D	2U S	S	S	N
	N	N	30°C	Group A	2U P	S	S	N
	N	N	30°C	Group B, D	2U S	S	P	Y
	N	N	30°C	Group A	2U P	S	P	Y
	N	N	30°C	Group E¹, E²	2U A	S	P	Y
	N	Y^{note 1}	30°C	Group D	2U S	S	P	N
	N	Y^{note 1}	30°C	Group B, A	2U P	S	P	N
	Y^{note 1}	N	30°C	Group B, A, D	2U P	N/A	P	N
	Y^{note 1}	Y^{note 1}	30°C	Group B, D	2U P	N/A	P	N
	N	N	25°C	Group E¹	2U P	S	P	Y
	N	N	25°C	Group E², E³	2U A	S	P	Y
	N	Y	25°C	Group D	2U S	S	P	Y
	N	Y	25°C	Group B, A	2U P	S	P	Y
	N	Y	25°C	Group E³	2U A	S	P	Y
	Y	N/Y	25°C	Group B, A, D	2U P	NA	P	Y
12 x 3.5"	N	N	30°C	Group B, D	2U S	S	P	Y
	N	N	30°C	Group A	2U P	S	P	Y
	N	N	30°C	Group E¹, E²	2U A	S	P	Y
	N	Y*	30°C	Group D	2U S	S	P	N
	N	Y*	30°C	Group B, A	2U P	S	P	N
	Y*	N	30°C	Group B, A, D	2U P	N/A	P	N
	Y*	Y*	30°C	Group B, D	2U P	N/A	P	N
	N	N	25°C	Group E¹	2U P	S	P	Y
	N	N	25°C	Group E³	2U A	S	P	Y
	N	Y	25°C	Group D	2U S	S	P	N
	N	Y	25°C	Group B, A	2U P	S	P	N
	N	Y	25°C	Group E³	2U A	S	P	N
	Y	N/Y	25°C	Group B, A, D	2U P	NA	P	N

Note

The ambient temperature is limited to 30°C when the following NVMe drives are installed in middle or rear drive bays:
- Gen5 7.68 TB or larger capacity
- P5336 15.36TB or larger capacity
When a part with active optical cable (AOC) is installed and the rate of the part is greater than 25 GB, the ambient temperature must be limited to 30°C or lower.
When the following parts are installed, the ambient temperature must be limited to 35°C or lower.
- PCIe network interface cards (NICs) at a rate greater than or equal to 100 GB
- Parts with AOC and at a rate of 25 GB
The maximum ambient temperature is limited to 25°C when the following drives are installed:
- PS1030 6.4TB or larger capacity
- PS1010 7.68TB or larger capacity

This section provides thermal information for storage configurations with DWCM.

Front bays	Middle bays	Rear bays	Max. Temp.	Processor	Heat sink	Air baffle	Fan type	Support ≥ 64 GB DIMM
24 x 2.5" 16 x 2.5" + FIO 12 x 3.5"	N	N	35°C	Group B, A, D, E	DWCM	S	S	Y^{note 1}
24 x 2.5" 16 x 2.5" + FIO 12 x 3.5"	N/Y ^{note 2}	N/Y ^{note 2}	35°C	Group B, A, D, E	DWCM	S	P	Y

Note

When standard fans are used, the max. supported ambient temperature is 30°C; when performance fans are used, the max. supported ambient temperature is 35°C.
The ambient temperature is limited to 30°C when the following NVMe drives are installed in middle or rear drive bays:
- Gen5 7.68 TB or larger capacity
- Gen4 P5336 15.36T/30.72T/61.44T NVMe
The maximum ambient temperature is limited to 25°C when the following drives are installed:
- PS1030 6.4TB or larger capacity
- PS1010 7.68TB or larger capacity

This section provides thermal information for GPU configurations.

Note

For GPU configurations, group E¹ processors are defined as follows: 9555(P), 9565, 9645, 9655(P), 9745, 9825, 9845, 9475F, 9575F.
Performance fans are required for servers with GPU adapters.

Half-height half-length (HHHL) single-wide (SW) GPU: A2, L4
DW GPU: A16, A30, A40, L40, L40S, A100, RTX A2000, RTX A4500, RTX A6000, RTX 4500 Ada, RTX 6000 Ada, H100, H100 NVL, AMD MI210

Front bays	Max. Temp.	Processor	Heat sink	Air baffle	Max. GPU Qty.
Front bays	Max. Temp.	Processor	Heat sink	Air baffle	SW	DW (A2000)	DW (A40/L40)	350W DW	Other DW
8 x 2.5" 8 x 3.5" FIO	30°C	Group B, D	2U S	S	8	3	NA	NA	NA
		Group A	2U P	S	8	3	NA	NA	NA
		Group B, A, D	2U P	GPU	NA	NA	3	3	3
	25°C	Group E¹	2U P	S	6	3	NA	NA	NA
	25°C	Group E¹	2U P	GPU	NA	NA	2 (slot 2/5)	2 (slot 2/5)	2 (slot 2/5)
16 x 2.5" 8 x 2.5" + FIO	30°C	Group B, D	2U S	S	8	3	NA	NA	NA
		Group A	2U P	S	8	3	NA	NA	NA
		Group B, A, D	2U P	GPU	NA	NA	2 (slot 2/5)	2 (slot 2/5)	3
	25°C	Group E¹	2U P	S	6	3	NA	NA	NA
	25°C	Group E¹	2U P	GPU	NA	NA	2 (slot 2/5)	2 (slot 2/5)	2 (slot 2/5)
24 x 2.5" 16 x 2.5" + FIO	25°C	Group B, D	2U S	S	6	3	NA	NA	NA
		Group A	2U P	S	6	3	NA	NA	NA
		Group B, A, D	2U P	GPU	NA	NA	2 (slot 2/5)	2 (slot 2/5)	2 (slot 2/5)

This section provides thermal information for GPU configurations.

Note

For GPU configurations, group E¹ processors are defined as follows: 9555(P), 9565, 9645, 9655(P), 9745, 9825, 9845, 9475F, 9575F.
Performance fans are required for servers with GPU adapters.

Half-height half-length (HHHL) single-wide (SW) GPU: A2, L4
DW GPU: A16, A30, A40, L40, L40S, A100, RTX A2000, RTX A4500, RTX A6000, RTX 4500 Ada, RTX 6000 Ada, H100, H100 NVL, AMD MI210

Front bays	Max. Temp.	Processor	Heat sink	Air baffle	Max. GPU Qty.
Front bays	Max. Temp.	Processor	Heat sink	Air baffle	SW	DW (A2000)	Other DW
8 x 2.5" 8 x 3.5" FIO 16 x 2.5" 8 x 2.5" + FIO 24 x 2.5" 16 x 2.5" + FIO	35°C	Group B, A, D, E¹	DWCM	S	7	7	NA
8 x 2.5" 8 x 3.5" FIO 16 x 2.5" 8 x 2.5" + FIO	35°C	Group B, A, D, E¹	DWCM	GPU	NA	NA	3^{note 1}
24 x 2.5" 16 x 2.5" + FIO	35°C	Group B, A, D, E¹	DWCM	GPU	NA	NA	3^{note 2}

Note

When three 300W or 350W GPU adapters are installed, the maximum ambient temperature is limited to 30°C in 8 x 2.5", 8 x 3.5", 16 x 2.5", FIO or FIO + 8 x 2.5" ;configuration.
In 24 x 2.5" or FIO + 16 x 2.5" configuration, the maximum ambient temperature is limited to 30°C when three 300W GPU adapters are installed; the maximum ambient temperature is limited to 25°C when three 350W GPU adapters are installed.

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