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Thermal rules for server with 9005 series processors

This topic provides thermal rules for the server with 9005 series processors.

Abbreviations used in tables below are defined as follows:
  • Max.Temp.: Maximum ambient temperature at sea level

  • FIO = riser 5 + front OCP

  • S/S: SAS/SATA

  • Any: AnyBay

  • S: standard

  • P: performance

  • A: advanced

  • NA: not applicable

  • Y: yes

  • Y* in the Middle bays or Rear bays column: yes (when no Gen5 7.68 TB or larger capacity NVMe drive or no Gen4 P5336 15.36 TB/30.72 TB/61.44 TB NVMe drive is installed)

  • N: no

  • DWCM: Direct Water Cooling Module

Processor groups are defined as follows:
  • Group D: 9015, 9115

  • Group B: 9135, 9335, 9255

  • Group A: 9355(P), 9535, 9365, 9455(P)

  • Group E1: 9555(P), 9565, 9645, 9655(P), 9745, 9825, 9845

  • Group E2: 9375F, 9475F, 9575F

  • Group E3: 9175F, 9275F

Standard configurations

This section provides thermal information for standard configurations.

Front baysMax. Temp.ProcessorHeat sinkAir baffleFan typeSupport ≥ 64 GB DIMM
  • 8 x 2.5"

  • 16 x 2.5"

  • 8 x 3.5"

  • FIO

  • 8 x2.5"+FIO

35°CGroup B, D2U SSSN
Group B, A, D2U SSPY
Group E12U ASPY
Group B, A, D, EDWCMSSY3
30°CGroup E12U PSPY
Group E2, E32U ASPY
25°CGroup E22U PSPY
Note
  1. When a part with active optical cable (AOC) is installed and the rate of the part is greater than 25 GB, the ambient temperature must be limited to 30°C or lower.

  2. When the following parts are installed, the ambient temperature must be limited to 35°C or lower.

    • PCIe network interface cards (NICs) at a rate greater than or equal to 100 GB

    • Parts with AOC and at a rate of 25 GB

  3. When standard fans are used, the max. supported ambient temperature is 30°C; when performance fans are used, the max. supported ambient temperature is 35°C.

Storage configurations with DWCM

This section provides thermal information for storage configurations with DWCM.

Front baysMiddle baysRear baysMax. Temp.ProcessorHeat sinkAir baffleFan typeSupport ≥ 64 GB DIMM
  • 24 x 2.5"

  • 16 x 2.5" + FIO

  • 12 x 3.5"

NN35°CGroup B, A, D, EDWCMSSY1
N/Y 2N/Y 235°CGroup B, A, D, EDWCMSPY
Note
  1. When standard fans are used, the max. supported ambient temperature is 30°C; when performance fans are used, the max. supported ambient temperature is 35°C.

  2. The ambient temperature is limited to 30°C when the following NVMe drives are installed in middle or rear drive bays:
    • Gen5 7.68 TB or larger capacity

    • Gen4 P5336 15.36T/30.72T/61.44T NVMe

Storage configurations without DWCM

This section provides thermal information for storage configurations without DWCM.

Front baysMiddle baysRear baysMax. Temp.ProcessorHeat sinkAir baffleFan typeSupport ≥ 64 GB DIMM
  • 24 x 2.5"

  • 16 x 2.5" + FIO

NN30°CGroup B, D2U SSSN
NN30°CGroup A2U PSSN
NN30°CGroup B, D2U SSPY
NN30°CGroup A2U PSPY
NN30°CGroup E1, E22U ASPY
NY*30°CGroup D2U SSPN
NY*30°CGroup B, A2U PSPN
Y*N30°CGroup B, A, D2U PN/APN
Y*Y*30°CGroup B, D2U PN/APN
NN25°CGroup E12U PSPY
NN25°CGroup E2, E32U ASPY
NY25°CGroup D2U SSPY
NY25°CGroup B, A2U PSPY
NY25°CGroup E32U ASPY
YN/Y25°CGroup B, A, D2U PNAPY
  • 12 x 3.5"

NN30°CGroup B, D2U SSPY
NN30°CGroup A2U PSPY
NN30°CGroup E1, E22U ASPY
NY*30°CGroup D2U SSPN
NY*30°CGroup B, A2U PSPN
Y*N30°CGroup B, A, D2U PN/APN
Y*Y*30°CGroup B, D2U PN/APN
NN25°CGroup E12U PSPY
NN25°CGroup E32U ASPY
NY25°CGroup D2U SSPN
NY25°CGroup B, A2U PSPN
NY25°CGroup E32U ASPN
YN/Y25°CGroup B, A, D2U PNAPN
Note
  1. The ambient temperature is limited to 30°C when the following NVMe drives are installed in middle or rear drive bays:
    • Gen5 7.68 TB or larger capacity

    • P5336 15.36TB or larger capacity

  2. When a part with active optical cable (AOC) is installed and the rate of the part is greater than 25 GB, the ambient temperature must be limited to 30°C or lower.

  3. When the following parts are installed, the ambient temperature must be limited to 35°C or lower.

    • PCIe network interface cards (NICs) at a rate greater than or equal to 100 GB

    • Parts with AOC and at a rate of 25 GB

GPU configurations

This section provides thermal information for GPU configurations.

Note
  • For GPU configurations, group E1 processors are defined as follows: 9555(P), 9565, 9645, 9655(P), 9745, 9825, 9845, 9475F, 9575F.

  • Performance fans are required for servers with GPU adapters.

  • Half-height half-length (HHHL) single-wide (SW) GPU: A2, L4

  • DW GPU: A16, A30, A40, L40, L40S, A100, RTX A2000, RTX A4500, RTX A6000, RTX 4500 Ada, RTX 6000 Ada, H100, H100 NVL, AMD MI210

Front baysMax. Temp.ProcessorHeat sinkAir baffleMax. GPU Qty.
SWDW (A2000)DW (A40/L40)350W DWOther DW
  • 8 x 2.5"

  • 8 x 3.5"

  • FIO

30°CGroup B, D2U SS83NANANA
Group A2U PS83NANANA
Group B, A, D2U PGPUNANA333
25°CGroup E12U PS63NANANA
Group E12U PGPUNANA2 (slot 2/5)2 (slot 2/5)2 (slot 2/5)
  • 16 x 2.5"

  • 8 x 2.5" + FIO

30°CGroup B, D2U SS83NANANA
Group A2U PS83NANANA
Group B, A, D2U PGPUNANA2 (slot 2/5)2 (slot 2/5)3
25°CGroup E12U PS63NANANA
Group E12U PGPUNANA2 (slot 2/5)2 (slot 2/5)2 (slot 2/5)
  • 24 x 2.5"

  • 16 x 2.5" + FIO

25°CGroup B, D2U SS63NANANA
Group A2U PS63NANANA
Group B, A, D2U PGPUNANA2 (slot 2/5)2 (slot 2/5)2 (slot 2/5)