Thermal rules for server with 9004 series processors
This topic provides thermal rules for the server with 9004 series processors.
TDP: Thermal Design Power
S/S: SAS/SATA
Max.Temp.: Maximum ambient temperature at sea level
Any: AnyBay
S: standard
P: performance
A: advanced
NA: none
Y: yes
N: no
DWCM: Direct Water Cooling Module
Group B: 200 W ≤ TDP ≤ 240 W
Group A: 260 W < TDP ≤ 300 W
Group E: 320 W ≤ TDP ≤ 400 W
Standard configurations without DWCM
This section provides thermal information for standard configurations.
| Front bays | Support riser 3 | Max. Temp. | Processor | Heat sink | Air baffle | Fan type | Support DIMMs >= 96 GB |
|---|---|---|---|---|---|---|---|
| Y | 45°C | Group B | 2U P | S | P | N |
| Y | 35°C | Group B | 2U S | S | S | Nnote 1 | |
| Y | 35°C | Group B, A | 2U S | S | P | Y | |
| Y | 35°C | Group E | 2U A | S | P | Y | |
| Y | 30°C | Group E | 2U P | S | P | Y | |
| N | 35°C | Group B | 2U S | S | S x 4 | Nnote 1 |
| N | 30°C | Group B, A | 2U S | S | P x 4 | Y |
Apart from supported configurations listed above, ThinkSystem 128GB TruDDR5 5600MHz (2Rx4) RDIMM-A is also supported in this configuration.
When a part with active optical cable (AOC) is installed and the rate of the part is greater than 25 GB, the ambient temperature must be limited to 30°C or lower.
When the following parts are installed, the ambient temperature must be limited to 35°C or lower.
PCIe network interface cards (NICs) at a rate greater than or equal to 100 GB
Parts with AOC and at a rate of 25 GB
Standard configurations with DWCM
This section provides thermal information for standard configurations.
| Front bays | Support riser 3 | Max. Temp. | Processor | Heat sink | Air baffle | Fan type | Support DIMMs >= 96 GB |
|---|---|---|---|---|---|---|---|
| N | 35°C | Group B, A, E | DWCM | S | Snote 1 | Y |
When standard fans are used, the maximum ambient temperature is limited to 30°C; when performance fans are used, the maximum ambient temperature is limited to 35°C。
Storage configurations without DWCM
This section provides thermal information for storage configurations.
| Front bays | Middle bays | Rear bays | Max. Temp. | Processor | Heat sink | Air baffle | Fan type | Support DIMMs >= 96 GBnote 1,2 |
|---|---|---|---|---|---|---|---|---|
| NA | NA | 30°C | Group B | 2U S | S | S | N |
| NA | NA | 30°C | Group A | 2U P | S | S | N | |
| NA | NA | 30°C | Group B | 2U S | S | P | Y | |
| NA | NA | 30°C | Group A, Enote 3 | 2U P | S | P | Y | |
| NA | Ynote 4 | 30°C | Group B, A | 2U P | S | P | N | |
| Ynote 4 | NA | 30°C | Group B, A | 2U P | NA | P | N | |
| Ynote 4 | Ynote 4 | 30°C | Group B | 2U P | NA | P | N | |
| NA | Y | 25°C | Group B, A | 2U P | S | P | Y | |
| Y | NA | 25°C | Group B, A | 2U P | NA | P | Y | |
| Y | Y | 25°C | Group B, A | 2U P | NA | P | Y | |
12 x 3.5" | NA | NA | 30°C | Group B | 2U S | S | P | Y |
| NA | NA | 30°C | Group A | 2U P | S | P | Y | |
| NA | NA | 30°C | Group E note 3 | 2U A | S | P | Y | |
| NA | NA | 25°C | Group Enote 3 | 2U P | S | P | Y | |
| NA | Ynote 4 | 30°C | Group B, A | 2U P | S | P | N | |
| Ynote 4 | NA | 30°C | Group B, A | 2U P | NA | P | N | |
| Ynote 4 | Ynote 4 | 30°C | Group B | 2U P | NA | P | N | |
| NA | Y | 25°C | Group B, A | 2U P | S | P | Y | |
| Y | NA | 25°C | Group B, A | 2U P | NA | P | Y | |
| Y | Y | 25°C | Group B, A | 2U P | NA | P | Y |
ThinkSystem 128GB TruDDR5 4800MHz (2S2Rx4) 3DS RDIMM-A v2 is supported in all configurations listed above, except for when using standard fans.
ThinkSystem 128GB TruDDR5 5600MHz (2Rx4) RDIMM-A is supported in all configurations listed above.
For storage configurations, group E processors are limited to AMD EPYC 9754/9734/9654(P)/9554(P)/9174F processors.
- The following NVMe drives are not supported:
Gen5 7.68 TB or larger capacity
P5336 15.36TB or larger capacity
When a part with active optical cable (AOC) is installed and the rate of the part is greater than 25 GB, the ambient temperature must be limited to 30°C or lower.
- The maximum ambient temperature is limited to 25°C when the following drives are installed:
PS1030 6.4TB or larger capacity
PS1010 7.68TB or larger capacity
Storage configurations with DWCM
This section provides thermal information for storage configurations.
| Front bays | Middle bays | Rear bays | Max. Temp. | Processor | Heat sink | Air baffle | Fan type | Support DIMMs >= 96 GBnote 1,2 |
|---|---|---|---|---|---|---|---|---|
| NA | NA | 35°C | Group A, Enote 3 | DWCM | S | S | Y |
| NA | Ynote 4 | S | P | Y | ||||
| Ynote 4 | NA | NA | P | Y | ||||
| Ynote 4 | Ynote 4 | NA | P | Y | ||||
| NA | Y | 30°C | S | P | Y | |||
| Y | NA | NA | P | Y | ||||
| Y | Y | NA | P | Y |
In 24 x 2.5" or 16 x 2.5" + FIO configuration, standard fans support 30°C when 256 GB memories used and performance fans support 35°C when 256 GB memories used.
In 12 x 3.5" configuration, standard fans don’t support 256 GB memories; performance fans support 25°C when 256 GB memories used and performance fans support 35°C when other memories used.
For storage configurations, group E processors are limited to AMD EPYC 9754/9734/9654(P)/9554(P)/9174F processors.
- The following NVMe drives are not supported:
Gen5 7.68 TB or larger capacity
P5336 15.36TB or larger capacity
When a part with active optical cable (AOC) is installed and the rate of the part is greater than 25 GB, the ambient temperature must be limited to 30°C or lower.
- The maximum ambient temperature is limited to 25°C when the following drives are installed:
PS1030 6.4TB or larger capacity
PS1010 7.68TB or larger capacity
GPU configuration without DWCM
This section provides thermal information for the GPU configuration.
Half-height half-length (HHHL) single-wide (SW) GPU: A2, L4
DW GPU: A16, A30, A40, L40, L40S, A100, RTX A2000, RTX A4500, RTX A6000, RTX 4500 Ada, RTX 6000 Ada, H100, H100 NVL, AMD MI210
| Front bays | Max. Temp. | Processor | Heat sink | Air baffle | Fan type | Max. GPU Qty. | ||||
|---|---|---|---|---|---|---|---|---|---|---|
| SW (A2/L4) | DW (A2000) | DW (A40/L40) | DW (Others)note 2, 3 | DW (H100/L40S) | ||||||
8 x 2.5" | 30°C | Group B | 2U S | S | P | 8 | 3 | NA | NA | NA |
| Group A | 2U P | S | P | 8 | 3 | NA | NA | NA | ||
| Group B, A | 2U P | GPU | P | NA | NA | 3 | 3 | 3 | ||
16 x 2.5" | 30°C | Group B | 2U S | S | P | 8 | 3 | NA | NA | NA |
| Group A | 2U P | S | P | 8 | 3 | NA | NA | NA | ||
| Group B, A | 2U P | GPU | P | NA | NA | 2 (slot 2/5) | 3 | 2 (slot 2/5) | ||
8 x 3.5" | 30°C | Group B | 2U S | S | P | 8 | 3 | NA | NA | NA |
| Group A | 2U P | S | P | 8 | 3 | NA | NA | NA | ||
| Group B, A | 2U P | GPU | P | NA | NA | 3 | 3 | 3 | ||
24 x 2.5" | 25°C | Group B | 2U S | S | P | 6 | 3 | NA | NA | NA |
| Group A | 2U P | S | P | 6 | 3 | NA | NA | NA | ||
| Group B, A | 2U P | GPU | P | NA | NA | NA | 2 (slot 2/5) | 2 (slot 2/5) | ||
| 25°C | Group B | 2U S | S | P | 6 | 3 | NA | NA | NA |
| Group A, Enote 1 | 2U P | S | P | 6 | 3 | NA | NA | NA | ||
| Group B, A, Enote 1 | 2U P | GPU | P | 6 | 3 | 2 (slot 2/5) | 2 (slot 2/5) | 2 (slot 2/5) | ||
For GPU configurations, group E processors are limited to AMD EPYC 9754/9734/9654(P)/9554(P)/9174F processors.
When RTX 4500 Ada or RTX 6000 Ada is installed, the maximum ambient temperature is limited to 30°C in 8 x 2.5", 16 x 2.5", 24 x 2.5" or 8 x 3.5" configuration.
When H100 NVL is installed, the maximum ambient temperature is limited to 25°C in 8 x 2.5", 16 x 2.5" or 8 x 3.5" configuration with group B, A processors installed.
When a part with active optical cable (AOC) is installed and the rate of the part is greater than 25 GB, the ambient temperature must be limited to 30°C or lower.
GPU configuration with DWCM
This section provides thermal information for the GPU configuration.
Half-height half-length (HHHL) single-wide (SW) GPU: A2, L4
DW GPU: A16, A30, A40, L40, L40S, A100, RTX A2000, RTX A4500, RTX A6000, RTX 4500 Ada, RTX 6000 Ada, H100, H100 NVL, AMD MI210
| Front bays | Max. Temp. | Processor | Heat sink | Air baffle | Fan type | Max. GPU Qty. | ||
|---|---|---|---|---|---|---|---|---|
| SW | DW (A2000) | Other DW | ||||||
| 35°C | Group B, A, E1 | DWCM | S | p | 7 | 7 | NA |
| 35°C | Group B, A, E1 | DWCM | GPU | p | NA | NA | 3note 2 |
| 35°C | Group B, A, E1 | DWCM | GPU | p | NA | NA | 3note 3 |
For GPU configurations, group E processors are limited to AMD EPYC 9754/9734/9654(P)/9554(P)/9174F processors.
When three 300W or 350W GPU adapters are installed, the maximum ambient temperature is limited to 30°C in 8 x 2.5", 8 x 3.5", 16 x 2.5", FIO or FIO + 8 x 2.5" configuration.
In 24 x 2.5" or FIO + 16 x 2.5" configuration, the maximum ambient temperature is limited to 30°C when three 300W GPU adapters are installed; the maximum ambient temperature is limited to 25°C when three 350W GPU adapters are installed.
When ThinkSystem 128GB TruDDR5 4800MHz (2S2Rx4) 3DS RDIMM-A v1 is installed, the maximum ambient temperature is Limited to 30 °C; ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM-A v1 is not supported.