Thermal rules for server with 9004 series processors

This topic provides thermal rules for the server with 9004 series processors.

Abbreviations used in tables below are defined as following:

Processor groups are defined as follows:

Standard configurations

This section provides thermal information for standard configurations.

Front bays	Support riser 3	Max. Temp.	Processor	Heat sink	Air baffle	Fan type	Support DIMMs >= 96 GB
8 x 2.5" FIO	Y	45°C	Group B	2U P	S	P	N
	Y	35°C	Group B	2U S	S	S	N^{note 1}
	Y	35°C	Group B, A	2U S	S	P	Y
	Y	35°C	Group E	2U A	S	P	Y
	Y	30°C	Group E	2U P	S	P	Y
16 x 2.5" FIO	Y	45°C	Group B	2U P	S	P	N
	Y	35°C	Group B	2U S	S	S	N^{note 1}
	Y	35°C	Group B, A	2U S	S	P	Y
	Y	35°C	Group E	2U A	S	P	Y
	Y	30°C	Group E	2U P	S	P	Y
8 x 3.5"	Y	45°C	Group B	2U P	S	P	N
	Y	35°C	Group B	2U S	S	S	N^{note 1}
	Y	35°C	Group B, A	2U S	S	P	Y
	Y	35°C	Group E	2U A	S	P	Y
	Y	30°C	Group B, A	2U S	S	P	Y
	Y	30°C	Group E	2U P	S	P	Y
8 x 2.5" 16 x 2.5" 8 x 3.5"	N	35°C	Group B	2U S	S	S x 4	N^{note 1}
8 x 2.5" 16 x 2.5" 8 x 3.5"	N	30°C	Group B, A	2U S	S	P x 4	Y

Note

Apart from supported configurations listed above, ThinkSystem 128GB TruDDR5 5600MHz (2Rx4) RDIMM-A is also supported in this configuration.
When a part with active optical cable (AOC) is installed and the rate of the part is greater than 25 GB, the ambient temperature must be limited to 30°C or lower.
When the following parts are installed, the ambient temperature must be limited to 35°C or lower.
- PCIe network interface cards (NICs) at a rate greater than or equal to 100 GB
- Parts with AOC and at a rate of 25 GB

This section provides thermal information for storage configurations.

Front bays	Middle bays	Rear bays	Max. Temp.	Processor	Heat sink	Air baffle	Fan type	Support DIMMs >= 96 GB^{note 1,2}
24 x 2.5" 16 x 2.5" + FIO	NA	NA	30°C	Group B	2U S	S	S	N
	NA	NA	30°C	Group B	2U S	S	P	Y
	NA	NA	30°C	Group A	2U P	S	P	Y
	NA	NA	30°C	Group E^{note 3}	2U P	S	P	Y
	NA	NA	25°C	Group E	2U P	S	P	Y
	NA	Y^{note 4}	30°C	Group B, A	2U P	S	P	N
	Y^{note 4}	NA	30°C	Group B, A	2U P	NA	P	N
	Y^{note 4}	Y^{note 4}	30°C	Group B	2U P	NA	P	N
	NA	Y	25°C	Group B, A	2U P	S	P	Y
	Y	NA	25°C	Group B, A	2U P	NA	P	Y
	Y	Y	25°C	Group B, A	2U P	NA	P	Y
12 x 3.5"	NA	NA	30°C	Group B	2U S	S	P	Y
	NA	NA	30°C	Group A	2U P	S	P	Y
	NA	NA	30°C	Group E	2U A	S	P	Y
	NA	NA	25°C	Group E^{note 3}	2U P	S	P	Y
	NA	Y^{note 4}	30°C	Group B, A	2U P	S	P	N
	Y^{note 4}	NA	30°C	Group B, A	2U P	NA	P	N
	Y^{note 4}	Y^{note 4}	30°C	Group B	2U P	NA	P	N
	NA	Y	25°C	Group B, A	2U P	S	P	Y
	Y	NA	25°C	Group B, A	2U P	NA	P	Y
	Y	Y	25°C	Group B, A	2U P	NA	P	Y

Note

ThinkSystem 128GB TruDDR5 4800MHz (2S2Rx4) 3DS RDIMM-A v2 is supported in all configurations listed above, except for when using standard fans.
ThinkSystem 128GB TruDDR5 5600MHz (2Rx4) RDIMM-A is supported in all configurations listed above.
For storage configurations, group E processors are limited to AMD EPYC 9754/9734/9654(P)/9554(P)/9174F processors.
The following NVMe drives are not supported:
- Gen5 7.68 TB or larger capacity
- P5336 15.36TB or larger capacity
When a part with active optical cable (AOC) is installed and the rate of the part is greater than 25 GB, the ambient temperature must be limited to 30°C or lower.

This section provides thermal information for the GPU configuration.

Half-height half-length (HHHL) single-wide (SW) GPU: A2, L4
DW GPU: A16, A30, A40, L40, L40S, A100, RTX A2000, RTX A4500, RTX A6000, RTX 4500 Ada, RTX 6000 Ada, H100, H100 NVL, AMD MI210

Front bays	Max. Temp.	Processor	Heat sink	Air baffle	Fan type	Max. GPU Qty.
Front bays	Max. Temp.	Processor	Heat sink	Air baffle	Fan type	SW (A2/L4)	DW (A2000)	DW (A40/L40)	DW (Others)^{note 2, 3}	DW (H100/L40S)
8 x 2.5"	30°C	Group B	2U S	S	P	8	3	NA	NA	NA
		Group A	2U P	S	P	8	3	NA	NA	NA
		Group B, A	2U P	GPU	P	NA	NA	3	3	3
16 x 2.5"	30°C	Group B	2U S	S	P	8	3	NA	NA	NA
		Group A	2U P	S	P	8	3	NA	NA	NA
		Group B, A	2U P	GPU	P	NA	NA	2 (slot 2/5)	3	2 (slot 2/5)
8 x 3.5"	30°C	Group B	2U S	S	P	8	3	NA	NA	NA
		Group A	2U P	S	P	8	3	NA	NA	NA
		Group B, A	2U P	GPU	P	NA	NA	3	3	3
24 x 2.5"	25°C	Group B	2U S	S	P	6	3	NA	NA	NA
		Group A	2U P	S	P	6	3	NA	NA	NA
		Group B, A	2U P	GPU	P	NA	NA	NA	2 (slot 2/5)	2 (slot 2/5)
8 x 2.5" 16 x 2.5" 8 x 3.5"	25°C	Group B	2U S	S	P	6	3	NA	NA	NA
		Group A, E^{note 1}	2U P	S	P	6	3	NA	NA	NA
		Group B, A, E^{note 1}	2U P	GPU	P	NA	NA	NA	2 (slot 2/5)	NA

Note

For GPU configurations, group E processors are limited to AMD EPYC 9754/9734/9654(P)/9554(P)/9174F processors.
When RTX 4500 Ada or RTX 6000 Ada is installed, the maximum ambient temperature is limited to 30°C in 8 x 2.5", 16 x 2.5", 24 x 2.5" or 8 x 3.5" configuration.
When H100 NVL is installed, the maximum ambient temperature is limited to 25°C in 8 x 2.5", 16 x 2.5" or 8 x 3.5" configuration with group B, A processors installed.
When a part with active optical cable (AOC) is installed and the rate of the part is greater than 25 GB, the ambient temperature must be limited to 30°C or lower.

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