The following information is a summary of the features and specifications of the server. Depending on the model, some features might not be available, or some specifications might not apply.
Table 1. Specifications, Type 7D8J and 7D8K
Specification
Description
Dimension
4U server
Width: 170 mm (6.7 inches)
Height: 376 mm (14.8 inches)
Height without stands: 370 mm (14.6 inches)
Depth: 315.4 mm (12.4 inches)
Weight (depending on the configuration)
Maximum: 9.4 kg (20.7 lb)
Processor
This server supports one of the following Intel® processors:
Xeon® E3–23XX processor without integrated graphics feature does not support the KVM redirection functions; GPU is required when such processor is installed. If a processor with integrated graphics feature and a GPU are installed in the system, the integrated graphics feature and the DisplayPorts will be disabled.
Memory
Slots: four DIMM slots (two channels, two DIMMs per channel)
Lenovo XClarity Provisioning Manager Lite (optional).
TPM 2.0 embedded
Note
Make sure the power is on when executing remote access and power policy setup.
Ignore the warning message “Unrecoverable PS/2 or USB keyboard failure,” because the system does not support PS/2 devices.
Some Lenovo systems management applications, including XClarity Administrator, XClarity Controller, XClarity Energy Manager, and XClarity Essentials, are not supported by ST50 V2.
Hard-disk drives or solid-state drives can be installed in the same server but are not supported in the same RAID array.
Graphics processing unit (GPU) adapter
The following option GPU adapter is available for this server:
ThinkSystem NVIDIA Quadro T1000 8GB PCIe Active GPU
Must be installed in PCIe expansion slot 1
This GPU adapter supports 8K resolution.
It is recommend to use certified display adapter cables.
Fans
This server supports up to three fans:
When processor TDP is lower than 95 watts
One front fan
One rear fan (only when drive bay 3 is installed)
One processor heat sink fan
When processor TDP is 95 watts
One front fan
One processor heat sink fan
Electrical input
This server supports one of the following non-hot-swap, non-redundant power supplies:
Fixed ATX 300 watt Single-Output Gold
Input power 115Vac or 230Vac
This power supply does not support Intel Xeon® E3–2388G and E3–2378.
Fixed ATX 500 watt Multi-Output Platinum
Input power 115Vac or 230Vac
Minimal configuration for debugging
One processor
One 8 GB ECC UDIMM in slot 1
One power supply
One 3.5-inch drive in drive bay 1
Power cord
One system front fan
Acoustical noise emissions
Sound power level (LWAd):
Idling
Typical: 3.5 Bel
Maximum: 5.0 Bel
Operating
Typical: 5.4 Bel
Maximum: 5.4 Bel
Sound pressure level (LpAm):
Idling
Typical: 25 dBA
Maximum: 37 dBA
Operating
Typical: 40 dBA
Maximum: 40 dBA
Note
These sound levels were measured in controlled acoustical environments according to procedures specified by ISO 7779 and are reported in accordance with ISO 9296.
The declared acoustic sound levels are based on the following configurations, which may change depending on configuration/conditions:
Minimum configuration: 443 BTU, 130 W (in BTU per hour and watts)
Maximum configuration: 754 BTU, 221 W (in BTU per hour and watts)
Environment
ThinkSystem ST50 V2 complies with ASHRAE Class A2 specifications.
Air temperature:
Operating
ASHRAE Class A2: 10°C to 35°C (50°F to 95°F); the maximum ambient temperature decreases by 1°C for every 300 m (984 ft) increase in altitude above 900 m (2,953 ft).
Server off: -10°C to 60°C (14°F to 140°F)
Shipment/storage: -20°C to 60°C (-4°F to 140°F)
Maximum altitude: 3,050 m (10,000 ft)
Relative Humidity (non-condensing):
Operating
ASHRAE Class A2: 8% to 80%; maximum dew point: 21°C (70°F)
Shipment/storage: 8% to 90%
Particulate contamination
Attention
Airborne particulates and reactive gases acting alone or in combination with other environmental factors such as humidity or temperature might pose a risk to the server. For information about the limits for particulates and gases, see Particulate contamination.
Particulate contamination Attention: Airborne particulates (including metal flakes or particles) and reactive gases acting alone or in combination with other environmental factors such as humidity or temperature might pose a risk to the device that is described in this document.