Removing the system-board components for base-assembly replacement

Use this information to remove the system-board components as part of the procedure to replace the base assembly.

Notes

This procedure should be performed only by trained service technicians.
The base assembly includes the chassis and system board.
If possible, back up all compute node settings, including the settings for any options installed in the compute node. You can backup and restore system settings using the Advanced Setup Utility (ASU) (see the Advanced Settings Utility (ASU) for Lenovo x86 servers website for information and instructions).

Before you remove the system-board components, complete the following steps:

Read Safety and Installation guidelines.
If the compute node is installed in a Lenovo Flex System chassis, remove it (see Removing a compute node from a chassis for instructions).
Carefully lay the compute node on a flat, static-protective surface, orienting the compute node with the bezel pointing toward you.
Obtain the following items for use during the replacement procedure (see Parts listing, Types 7196 and 4258):
- Alcohol wipes
- Thermal grease
- RFID tag (required only if the compute node came with a RFID tag attached to the bezel)

Important

When you replace the base assembly, you must update the compute node with the latest firmware or restore the preexisting firmware. Make sure that you have the latest firmware or a copy of the preexisting firmware before you proceed. See Updating firmware and device drivers for more information.

See System-board layouts for more information about the locations of the connectors, jumpers, and LEDs on the system board.

To remove the components from the system-board assembly, complete the following steps:

Remove the cover (see Removing the compute node cover).
Remove all of the installed components in the following list from the system-board assembly; then, place them on a static-protective surface or install them on the new system-board assembly.
- Center partition (see Removing the center partition).
- DIMMs and air baffles (see Removing a DIMM).
- eXFlash DIMMs (see Removing an eXFlash DIMM).
- Fabric connectors (see Removing a fabric connector).
- Hard disk drive cage and backplane assemblies (see Removing the hard disk drive cage and backplane assembly).
- Hard disk drives and hard disk drive bay fillers (see Removing a hot-swap hard disk drive).
- I/O expansion adapters (see Removing an I/O expansion adapter).
- Microprocessors and heat sinks. Use the microprocessor installation tool that comes with the CRU kit to remove each microprocessor from the system-board assembly and install each one immediately in the new system-board assembly (see Removing a microprocessor and heat sink and Installing a microprocessor and heat sink).
- Solid state drives (see Removing a solid state drive).
- Solid state drive cage and backplane (see Removing the solid state drive cage and backplane).
- Solid state drive mounting sleeves (see Removing the solid state drive mounting sleeve).
- USB flash drives (see Removing the USB flash drive).
Remove the left- and right-bezels (see Removing the bezel).

If you are instructed to return the base assembly, follow all packaging instructions, and use any packaging materials for shipping that are supplied to you.

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