Install the M.2 backplane assembly
Use this information to install the M.2 backplane assembly.
About this task
Required tools
- Miscellaneous parts kit (03KH873) 
- Conduction plate parts (03KH864) (only damaged parts need to be replaced) 
- M.2 Putty pad kit (03LD666) 
- To identify the gap pad/putty pad location and orientation, see Gap pad and putty pad identification and location. 
- Before replacing the gap pad/putty pad, gently clean the interface plate or the hardware surface with an alcohol cleaning pad. 
- Hold the gap pad/putty pad carefully to avoid deformation. Make sure no screw hole or opening is blocked by the gap pad/putty pad material. 
- Do not use expired putty pad. Check the expiry date on putty pad package. If the putty pads are expired, acquire new ones to properly replace them. 
- Read Installation Guidelines and Safety inspection checklist to ensure that you work safely. 
- Turn off the corresponding DWC tray that you are going to perform the task on. 
- After updating XCC firmware, perform virtual reseat via SMM2 to optimize system, see SMM2 User Guide. 
- Go to Drivers and Software download website for ThinkSystem SD650-I V3 to see the latest firmware and driver updates for your server. 
- Go to Update the firmware for more information on firmware updating tools. 
Procedure
- Install the cross braces. See Install the cross braces. 
- Install the tray cover. See Install the tray cover. 
- Install the tray into the enclosure. See Install a DWC tray in the enclosure. 
- Connect all required external cables to the solution.NoteUse extra force to connect QSFP cables to the solution.
- Check the power LED on each node to make sure it changes from fast blink to slow blink to indicate all nodes are ready to be powered on. 
Demo video







