Install the M.2 backplane assembly
Use this information to install the M.2 backplane assembly.
About this task
Required tools
Miscellaneous parts kit (03KH873)
Conduction plate parts (03KH864) (only damaged parts need to be replaced)
M.2 Putty pad kit (03LD666)
To identify the gap pad/putty pad location and orientation, see Gap pad and putty pad identification and location.
Before replacing the gap pad/putty pad, gently clean the interface plate or the hardware surface with an alcohol cleaning pad.
Hold the gap pad/putty pad carefully to avoid deformation. Make sure no screw hole or opening is blocked by the gap pad/putty pad material.
Do not use expired putty pad. Check the expiry date on putty pad package. If the putty pads are expired, acquire new ones to properly replace them.
Read Installation Guidelines and Safety inspection checklist to ensure that you work safely.
Turn off the corresponding DWC tray that you are going to perform the task on.
After updating XCC firmware, perform virtual reseat via SMM2 to optimize system, see SMM2 User Guide.
Go to Drivers and Software download website for ThinkSystem SD650-I V3 to see the latest firmware and driver updates for your server.
Go to Update the firmware for more information on firmware updating tools.
Procedure
Install the cross braces. See Install the cross braces.
Install the tray cover. See Install the tray cover.
Install the tray into the enclosure. See Install a DWC tray in the enclosure.
- Connect all required external cables to the solution.NoteUse extra force to connect QSFP cables to the solution.
Check the power LED on each node to make sure it changes from fast blink to slow blink to indicate all nodes are ready to be powered on.
Demo video