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Enclosure Specifications

A summary of the features and specifications of the enclosure.

Note

One DW612 Enclosure could contain six SD650 V2/SD650-N V2 trays.

Table 1. Enclosure specifications
SpecificationDescription
Dimension6U enclosure
  • Height: 263.3 mm (10.37 inches)
  • Depth: 930.6 mm (36.64 inches)
  • Width: 447 mm (17.6 inches)
  • Weight:

    • Empty enclosure (with midplane and cables): approximately 23.6 kg (52.04 lbs)

    • Fully configured (stand-alone):

      • Enclosure with six SD650 V2 trays: approximately 156.54 kg (345.17 lbs)

      • Enclosure with six SD650-N V2 trays: approximately 168.94 kg (372.51 lbs)

Power supplySD650 V2 tray:

Supports six hot-swap ac power supplies (conditionally upgradable to nine with ThinkSystem 2400W (230V) v4 Platinum hot-swap power supply, see PSU configuration).

  • Input voltage: 200-240 Vac

  • Wattage:

    • 1800W

    • 2400W

SD650-N V2 tray:

Supports six hot-swap ac power supplies (conditionally upgradable to nine power supplies, see PSU configuration).

  • Input voltage: 200-240 Vac

  • Wattage: 2400W

    Note

    SD650-N V2 tray supports ThinkSystem 2400W (230V) v4 Platinum hot-swap power supply Delta only. All the installed power supply units must be ThinkSystem 2400W (230V) v4 Platinum hot-swap power supply Delta.

CAUTION
Power supplies and redundant power supplies in the enclosure must be with the same brand, power rating, wattage or efficiency level.
System Management Module 2 (SMM2)

Hot-swappable

See System Management Module 2 (SMM2) for more details about SMM2.

Acoustical noise emissions
  • SD650 V2 sound power level (LWAd):
    • Idle: 6.5 Bel
    • Operation: 7.6 Bel
  • SD650-N V2 sound power level (LWAd):
    • Idle: 7.0 Bel
    • Operation: 9.5 Bel
Note

  • These levels were measured in controlled acoustical environments according to procedures specified by ISO 7779, and are reported in accordance with ISO 9296.

  • The declared acoustic noise levels are based on specified configurations, and may change depending on configuration/condition changes.

  • The declared acoustic noise levels may increase greatly if high-power components are installed, such as high-power NICs and high-power M.2.

Heat outputApproximate heat output:
  • SD650 V2
    • Minimum configuration (with one minimal configuration tray): 4003.5 BTU per hour (1275 watts)
    • Maximum configuration (with six maximal configuration trays): 23480.92 BTU per hour (7478 watts)
  • SD650-N V2
    • Minimum configuration (with one minimal configuration tray): 7790.34 BTU per hour (2481 watts)
    • Maximum configuration (with six maximal configuration trays): 44986.78 BTU per hour (14327 watts)
Electrical input
  • Sine-wave input (50-60 Hz) required

  • Input voltage range:

    • Minimum: 200 Vac
    • Maximum: 240 Vac
Water requirement

  • Water Temperature:

    • SD650 V2 tray: ASHRAE class W4: 2°C - 50°C (35.6°F - 122°F) with the following exceptions:

      • With processors of 205W or higher: 2°C - 45°C (35.6°F - 113°F)

      • With M.2 drives: 2°C - 45°C (35.6°F - 113°F)

      • With Intel® Xeon® Platinum 8368Q processor: 2°C - 35°C (35.6°F - 95°F)

    • SD650-N V2 tray: ASHRAE class W4: 2°C - 45°C (35.6°F - 113°F)

      • For 80 GB NVIDIA HGX™ A100 4-GPU: ASHRAE class W3: 2°C - 40°C (35.6°F - 104°F)

      • With Intel® Xeon® Platinum 8368Q processor: 2°C - 35°C (35.6°F - 95°F)

  • Maximum pressure: 4.4 bars

  • Minimum water flow rate:

    • SD650 V2 tray: 6.0 liters per minute per enclosure, assuming 1.0 lpm per compute tray with 6 trays per enclosure (1 tray consists of 2 compute nodes)

      • For processors below 205W: 6.0 liters per minute per enclosure, assuming 1.0 lpm per compute tray with 6 trays per enclosure

      • For processors above 205W: 7.5 liters per minute per enclosure, assuming 1.25 lpm per compute tray with 6 trays per enclosure

    • SD650-N V2 tray with 40/80 GB NVIDIA HGX™ A100 4-GPU: 21.0 liters per minute per enclosure, assuming 3.5 lpm per compute tray with 6 trays per enclosure (1 tray consists of 1 compute node and 1 GPU node)

Note
The water required to initially fill the system side cooling loop must be reasonably clean, bacteria- free water (<100 CFU/ml) such as de-mineralized water, reverse osmosis water, de-ionized water, or distilled water. The water must be filtered with an in-line 50 micron filter (approximately 288 mesh). The water must be treated with anti-biological and anti-corrosion measures.
Environment
The SD650 V2 tray, the SD650-N V2 tray and DW612 Enclosure are supported in the following environment:
  • Air temperature requirements:

    • Operating: ASHRAE class A2: 10°C - 35°C (50°F - 95°F); when the altitude exceeds 900 m (2953 ft), the maximum ambient temperature value decreases by 1°C (1.8°F) with every 300 m (984 ft) of altitude increase.

    • Powered off: 5°C - 45°C (41°F - 113°F)

    • Shipping/storage: -40°C - 60°C (-40°F - 140°F)

    To use the 240 GB M.2 drive, the following conditions must be met:

    • If inlet water temperature is 45°C, then the ambient air temperature cannot exceed 27°C.

    • If inlet water temperature is 30°C, then the ambient air temperature cannot exceed 35°C.

  • Relative humidity (non-condensing):
    • Operating: ASHRAE Class A2: 8% - 80%, maximum dew point : 21°C (70°F)
    • Shipment/storage: 8% - 90%

  • Maximum altitude: 3048 m (10 000 ft)

  • Particulate contamination:

    Airborne particulates and reactive gases acting alone or in combination with other environmental factors such as humidity or temperature might pose a risk to the solution. For information about the limits for particulates and gases, see Particulate contamination.

Note
The solution is designed for standard data center environment and recommended to be placed in industrial data center.