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Specifications

The following information is a summary of the features and specifications of the server. Depending on the model, some features might not be available, or some specifications might not apply.

Table 1. Specifications
SpecificationDescription
Dimension2U server
300mm chassis
  • Depth:

    • Without bezel: 298.8 mm (11.76 inches)

    • With bezel: 407.3 mm (16.04 inches)

  • Height: 86.5 mm (3.41 inches)

  • Width:

    Without rack latches: 444.6 mm (17.50 inches)

    With rack latches: 480.5 mm (18.92 inches)

360mm chassis
  • Depth:

    • Without bezel: 358.8 mm (14.13 inches)

    • With bezel: 467.3 mm (18.40 inches)

  • Height: 86.5 mm (3.41 inches)

  • Width:

    Without rack latches: 444.6 mm (17.50 inches)

    With rack latches: 480.5 mm (18.92 inches)

Weight

(Varies with configuration)

Maximum:
  • 300mm chassis: 14.84 kg (32.71 lbs)
  • 360mm chassis: 17.45 kg (38.47 lbs)
Processor

(Varies with configuration)

Supports multi-core Intel Xeon processors, with integrated memory controller and Intel Mesh UPI (Ultra Path Interconnect) topology.
  • One processor socket
  • Designed for LGA 4189 sockets
  • Scalable up to 36 cores
  • Supports 6 UPI links at 10.4 GT/s
Heat sink:
  • 1U heat sink supports processors with wattage up to 165 watt.
  • 2U heat sink supports processors with wattage up to 205 watt.
Memory

See Memory module installation rules and order for detailed information about memory configuration and setup.

  • Slots: 10 two-way interleaved slots
  • Memory module types:
    • Double-data-rate 4 (TruDDR4) error correcting code (ECC) 3200 MT/s registered DIMM (RDIMM) or 3DS RDIMM
    • 3DS RDIMM
    • Persistent Memory (PMEM)
  • Capacity (depending on the model)
    • RDIMM: 16 GB, 32 GB, and 64 GB
    • 3DS RDIMM: 128 GB
    • PMEM: 128 GB and 256 GB
      Note
      PMEMs can be mixed with DRAM DIMMs with capacity of more than 16 GB. See PMEM rules for more information.
  • Total Capacity:
    • Minimum: 16 GB
    • Maximum:
      • RDIMM: 512 GB
      • 3DS RDIMM: 1024 GB
      • PMEM + RDIMM in Memory Mode: 1280 GB

For a list of supported memory modules, see https://serverproven.lenovo.com.

Storage expansion
  • Two SATA/NVMe M.2 drives
  • Trayless drives:

    • Zero to two 15mm trayless SAS/SATA/NVMe1 drives (Drive 0, 1)

      or

    • Zero to four 7mm trayless SATA/NVMe1 drives (Drive 0, 1, 2, 3)
  • Hot-swap (optional)2: two 2.5-inch SAS/SATA/NVMe drive bays with front access (Drive 4, 5)

1 Only non-SED NVMe drives are supported.

2 Only non-SED drives are supported.

RAIDThe following options are available for RAID 0, 1, 10:
  • ThinkSystem 4350-8i SAS/SATA 12Gb Adapter (JBOD mode only) (PCIe Slot 6)
  • ThinkSystem RAID 5350-8i PCIe 12Gb Adapter (PCIe Slot 6)
  • Intel Virtual RAID On CPU (VROC) for non-SED SATA/NVMe drives
  • Intel Volume Management Device (VMD) for non-SED NVMe drives
Network
  • One of the following OCP 3.0 Ethernet adapters
    • Intel I350-T4 PCIe 1GbE 4-port RJ45
    • Intel X710-T2L 10GBASE-T 2-port
    • Intel E810-DA2 10/25GbE SFP28 2-port
    • Mellanox ConnectX-6 Lx 10/25GbE SFP28 2-port
Expansion slots

(Varies with configuration)

Up to seven slots:
  • Slot 1 to 2: M.2 Drive 0 and 1

  • Slot 3 to 4 (Riser 2):

    Supports the following:

    • Single-width PCI Express 4.0 x8/x16 (Slot 3, 4)

    • Single-width PCI Express 4.0 x16/x16 (Slot 3, 4)

    • Single/double-width PCI Express 4.0 x16 (Slot 4)

    • Two 2.5-inch hot-swap SAS/SATA/NVMe drives (Drive 4, 5)

  • Slot 5 to 6 (Riser 1):

    Supports the following:

    • Single-width PCI Express 4.0 x16/x8 (Slot 5, 6)

    • Single-width PCI Express 4.0 x16/x16 (Slot 5, 6)

    • Single/double-width PCI Express 4.0 x16 (Slot 5)

      Note
      RAID adapter must be installed in Slot 6.

  • Slot 7: OCP 3.0 Ethernet adapter

Integrated functions
  • Lenovo XClarity Controller (XCC), which provides service processor control and monitoring functions, video controller, and remote keyboard, video, mouse, and remote drive capabilities.
  • One XCC system management port on the front to connect to a systems-management network. This connector is dedicated to the Lenovo XClarity Controller functions and runs at 1 GB speed.
  • Two universal serial bus (USB) 3.1 ports on the front
FansSix (60 mm x 60 mm x 56 mm) trayless system fans with N+1 redundancy support
Operating SystemSupported and certified operating systems include:

  • Microsoft Windows Server

  • VMware ESXi

  • Red Hat Enterprise Linux

  • SUSE Linux Enterprise Server

References:
Electrical input
This server supports up to two units of CFF V4 (reverse fan) power supplies. N+1 redundancy is supported when two units are installed. Following is the list of supported types:
  • 1100-watt Platinum, input power 100-240 Vac
  • 1100-watt Titanium, input power 100-240 Vac
  • 1800-watt Platinum, input power 200-240 Vac
  • 1100-watt -48V dc
CAUTION

  • 240 V dc input (input range: 180-300 V dc) is supported in Chinese Mainland ONLY.

  • Power supply with 240 V dc input cannot support hot-plugging power cord function. Before removing the power supply with dc input, please turn off server or disconnect dc power sources at the breaker panel or by turning off the power source. Then, remove the power cord.
Minimal configuration for debugging
  • One processor
  • One DRAM DIMM in slot 2
  • One power supply
  • Two 15mm trayless drives with RAID (If OS is needed for debugging)
  • Six system fans (Fan 1 to 6)
Ambient temperature managementAdjust ambient temperature when specific components are installed:
  • Keep the ambient temperature to 35°C or lower when:
    • One or more 2.5-inch U.3 7400 PRO 3.84 TB Read Intensive NVMe PCIe 4.0 x4 trayless drives are installed
    • One or more 2.5-inch U.3 7450 PRO 3.84 TB Read Intensive NVMe PCIe 4.0 x4 trayless drives are installed
  • Keep the ambient temperature to 40°C or lower when:
    • NVIDIA A40 or L40 GPU is installed
    • One or more Persistent memory modules are installed
    • One of the following 2.5-inch drives is installed in Riser 2:
      • U.3 7400 PRO 3.84TB Read Intensive NVMe PCIe 4.0 x4 Hot-swap drive
      • U.3 7450 MAX 3.2TB Mixed Use NVMe PCIe 4.0 x4 Hot-swap drive
      • U.3 7450 PRO 3.84TB Read Intensive NVMe PCIe 4.0 x4 Hot-swap drive
      • U.2 Multi Vendor 3.2TB Mixed Use NVMe PCIe 4.0 x4 Hot-swap drive
    • The system comes in the following configuration:
      • 360mm chassis
      • Two risers installed with 0, 1, 2 or 3 half-length adapters installed
      • Eight 128GB DIMMs are installed
      Note
      When four half length adapters are installed in this configuration, ambient temperature requirement is 45°C or lower.
Acoustical noise emissionsThe server has the following acoustic noise emissions declaration:
  • Sound pressure level (LpAm)
    • Idling: 43.3 dBA (Minimal), 47.4 dBA (Typical), 47.4 dBA (GPU rich)
    • Operating: 55.3 dBA (Minimal), 55.3 dBA (Typical), 65.2 dBA (GPU rich)
Note
  • These sound levels were measured in controlled acoustical environments according to procedures specified by ISO7779 and are reported in accordance with ISO 9296.
  • The declared acoustic sound levels are based on the following configurations, which may change depending on configuration/conditions
    • Minimal: 300mm Chassis, 1x 185W/32cores CPU, 8x 16GB RDIMM, 4x 960G SATA SSD, 2x M.2 5300 SATA 480GB, 2x Intel E810-DA2, 2 x 1100W PSU
    • Typical: 300mm Chassis, 1x 185W/32cores CPU, 8x 16GB RDIMM, 2x U.2 P5500 1.92TB NVMe, 2x M.2 5300 SATA 480GB, 2x NVIDIA A2 16GB PCIe Gen4 Passive GPU, 1x Mellanox CX6 LX 10/25G, 2 x 1100W PSU
    • GPU rich: 360mm Chassis, 1x 165W/28 cores CPU, 8x 16GB RDIMM, 2x U.2 P5500 1.92TB NVMe, 2x M.2 5300 SATA 480GB, 2x NVIDIA A30 24GB PCIe Gen4 Passive GPU, 1x Mellanox CX6 LX 10/25G, 2 x 1800W PSU
EnvironmentThinkEdge SE450 complies with ASHARE Class A3 specifications. Depending on the hardware configuration, some models comply with ASHARE Class A4 specifications. System performance may be impacted when operating temperature is outside AHSARE A3 specification.
  • Air temperature:
    • Operating
      • ASHARE Class A2: 10°C to 35°C (50°F to 95°F); the maximum ambient temperature decreases by 1°C for every 300 m (984 ft) increase in altitude above 900 m (2,953 ft).
      • ASHARE Class A3: 5°C to 40°C (41°F to 104°F); the maximum ambient temperature decreases by 1°C for every 175 m (574 ft) increase in altitude above 900 m (2,953 ft).
      • ASHARE Class A4: 5°C to 45°C (41°F to 113°F); the maximum ambient temperature decreases by 1°C for every 125 m (410 ft) increase in altitude above 900 m (2,953 ft).
      • NEBS Level 31:
        • Operating Temperature: 5°C to 40°C. Humidity: 5%~85% RH, Non-condensing.
        • Maximum rate of change(°C /hr) should ≤ 20 Humidity transition rate should ≤10%/hr.
        • High Altitude Operating temperature 1829m (6000ft) to 3960m (13000ft): 5- 35°C

        • Short Term Operating Temp2: -5°C to 55°C.

    • Server off: -10°C to 60°C (°F to °F)
    • Shipment/storage: -40°C to 70°C (-40°F to 158°F)
Environment
  • Maximum altitude: 3,000 m (10,000 ft)
  • Relative Humidity (non-condensing):
    • Operating
      • ASHRAE Class A2: 8% to 80%; maximum dew point: 21°C (70°F)
      • ASHRAE Class A3: 8% to 85%; maximum dew point: 24°C (75°F)
      • ASHRAE Class A4: 8% to 90%; maximum dew point: 24°C (75°F)
      • NEBS Level 3: 5%~85% RH, Non-condensing

  • Particulate contamination

    Attention
    Airborne particulates and reactive gases acting alone or in combination with other environmental factors such as humidity or temperature might pose a risk to the server. For information about the limits for particulates and gases, see Particulate contamination.
Note

  • The server is designed for standard data center environment and recommended to be placed in industrial data center.

  • SE450 supports use of a dust filter that is installed inside the security bezel. The dust filler has a Minimum Efficiency Rating Value (MERV) of 2, per ASHRAE Standard 52.2-2017.
  • Shock and vibration specifications
    The following information is a summary of the shock and vibration specifications of the server. Depending on the model, some features might not be available, or some specifications might not apply.
  • Particulate contamination
    Attention: Airborne particulates (including metal flakes or particles) and reactive gases acting alone or in combination with other environmental factors such as humidity or temperature might pose a risk to the device that is described in this document.
1 Configuration:
  • Chassis: 300mm chassis
  • Processor: 28-core 165W with standard 2U heat sink
  • Memory: eight 64GB 3200MHz RDIMMs
  • M.2: Two 480GB M.2 drives with SATA-RAID
  • Internal storage: Four 960GB SATA drives
  • PCIe adapters: Intel N810-DA2 (Slot 5), Intel ACC100 (Slot 3, 4, 6)
  • No OCP
  • 2x 1100W -48VDC power supplies
2 Short-term conditions: period of no more than 96 consecutive hours and a total of not more than 15 days in 1 year. (This refers to a total of 360 hours in any given year, but no more than 15 occurrences during that 1- year period.)