Parts list
Use the parts list to identify each of the components that are available for your server.
For more information about ordering the parts shown in Figure 1, go to:
Tier 1 customer replaceable unit (CRU): Replacement of Tier 1 CRUs is your responsibility. If Lenovo installs a Tier 1 CRU at your request with no service agreement, you will be charged for the installation.
Tier 2 customer replaceable unit (CRU): You may install a Tier 2 CRU yourself or request Lenovo to install it, at no additional charge, under the type of warranty service that is designated for your server.
Field replaceable unit (FRU): FRUs must be installed only by trained service technicians.
Consumable and Structural parts: Purchase and replacement of consumable and structural parts (components, such as a cover or bezel) is your responsibility. If Lenovo acquires or installs a structural component at your request, you will be charged for the service.
Index | Description | Tier 1 CRU | Tier 2 CRU | FRU | Consumable and Structural parts |
---|---|---|---|---|---|
For more information about ordering the parts shown in Figure 1, go to: | |||||
1 | Top cover | √ | |||
2 | Air baffle | √ | |||
3 | LOM adapter | √ | |||
4 | Riser 1 bracket (two low profile) | √ | |||
5 | Riser 2 bracket (one low profile) | √ | |||
6 | Riser 1 bracket (one low-profile and one full-height half-length) | √ | |||
7 | Serial port module | √ | |||
8 | Riser card | √ | |||
9 | System board | √ | |||
10 | Low-profile PCIe adapter | √ | |||
11 | ML2 adapter | √ | |||
12 | Full-height half-length PCIe adapter | √ | |||
13 | M.2 backplane | √ | |||
14 | M.2 retainer | √ | |||
15 | M.2 drive | √ | |||
16 | Chassis with eight 2.5-inch drive bays | √ | |||
17 | Power supply | √ | |||
18 | Power supply filler | √ | |||
19 | Security bezel | √ | |||
20 | Chassis with four 3.5-inch drive bays | √ | |||
21 | Front I/O assembly for server models with 3.5-inch drive bays | √ | |||
22 | Front I/O assembly for server models with 2.5-inch drive bays | √ | |||
23 | System fan | √ | |||
24 | RAID super capacitor module | √ | |||
25 | 2.5-inch drive filler | √ | |||
26 | 2.5-inch hot-swap drive | √ | |||
27 | 3.5-inch drive filler | √ | |||
28 | 3.5-inch simple-swap drive | √ | |||
29 | 3.5-inch hot-swap drive | √ | |||
30 | CMOS battery (CR2032) | √ | |||
31 | Backplane for eight hot-swap 2.5-inch drives | √ | |||
32 | Simple-swap drive backplate assembly | √ | |||
33 | Backplane for four hot-swap 3.5-inch drives | √ | |||
34 | TCM/TPM adapter (for Chinese Mainland only) | √ | |||
35 | DIMM | √ | |||
36 | Processor | √ | |||
37 | Processor heat sink | √ |