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Environmental specifications

Summary of the environmental specifications of server. Depending on the model, some features might not be available, or some specifications might not apply.

Acoustical noise emissions
The server has the following acoustic noise emissions declaration:
  • Sound power level (LWAd)
    • Idling:
      • Typical: 7.1 Bel
      • Storage rich: 7.1 Bel
      • GPU: 8.0 Bel
    • Operating:
      • Typical: 8.0 Bel
      • Storage rich: 8.0 Bel
      • GPU: 9.2 Bel
  • Sound pressure level (LpAm):
    • Idling:
      • Typical: 52 dBA
      • Storage rich: 52.5 dBA
      • GPU: 63.6 dBA
    • Operating:
      • Typical: 63.6 dBA
      • Storage: 63.6 dBA
      • GPU: 75 dBA
Note
  • These sound levels were measured in controlled acoustical environments according to procedures specified by ISO7779 and are reported in accordance with ISO 9296.
  • The declared acoustic sound levels are based on the specified configurations, which may change depending on configuration/conditions.
    • Typical configuration: four 250W CPUs, thirty-two 64GB RDIMMs, eight SAS HDDs, RAID 940-8i, Intel X710-T2L 10GBASE-T 2-port OCP, two 1100W PSUs.
    • GPU configuration: four 205W CPUs, four H100 GPUs, thirty-two 64GB RDIMMs, twenty-four SAS HDDs, RAID 940-16i, Intel X710-T2L 10GBASE-T 2-port OCP, two 1800W PSUs.
    • Storage rich configuration: four 205W CPUs, thirty-two 64GB RDIMMs, twenty-four SAS HDDs, RAID 940-8i, Intel X710-T2L 10GBASE-T 2-port OCP, two 2600W PSUs.
  • Government regulations (such as those prescribed by OSHA or European Community Directives) may govern noise level exposure in the workplace and may apply to you and your server installation. The actual sound pressure levels in your installation depend upon a variety of factors, including the number of racks in the installation; the size, materials, and configuration of the room; the noise levels from other equipment; the room ambient temperature, and employee's location in relation to the equipment. Further, compliance with such government regulations depends on a variety of additional factors, including the duration of employees' exposure and whether employees wear hearing protection. Lenovo recommends that you consult with qualified experts in this field to determine whether you are in compliance with the applicable regulations.
Ambient temperature management
Adjust ambient temperature when specific components are installed:
  • The ambient temperature must be limited to 45°C or lower if the server has 48 drives and any of the following components:
    • CPU with 270W or lower TDP (except 6434H)
    • Memory module with 64 GB or lower capacity
  • The ambient temperature must be limited to 35°C or lower if the server has 48 drives and any of the following components:
    • CPU with 350W or lower TDP with standard heat sink
    • Memory module with 256 GB or lower capacity
    • ConnectX-6 Dx 100GbE QSFP56 2-port with Active Optic Cable
    • ConnectX-6 HDR 200GbE QSFP56 2-port with Active Optic Cable
    • ConnectX-7 NDR200 QSFP 2-port without Active Optic Cable
    • ConnectX-7 NDR400 OSFP 1-port without Active Optic Cable
    • ConnectX-7 NDR200 QSFP 2-port with Active Optic Cable, and CPU with 270W or lower TDP is installed.
    • ConnectX-7 NDR400 OSFP 1-port with Active Optic Cable, and CPU with 270W or lower TDP is installed.
  • The ambient temperature must be limited to 30°C or lower if the server has 48 drives and any of the following components:
    • CPU with 350W or lower TDP with performance heat sink
    • GPU adapter
    • ConnectX-7 NDR200 QSFP 2-port with Active Optic Cable
    • ConnectX-7 NDR400 OSFP 1-port with Active Optic Cable
Environment

ThinkSystem SR860 V3 complies with ASHRAE Class A2 specifications with most configurations, and depending on the hardware configuration, also complies with ASHRAE Class A3, and Class A4 specifications. System performance may be impacted when operating temperature is outside ASHRAE A2 specification.

Depending on the hardware configuration, ThinkSystem SR860 V3 server also complies with ASHRAE Class H1 specification. System performance may be impacted when operating temperature is outside ASHRAE H1 specification.

  • Air temperature:
    • Operating
      • ASHRAE Class H1: 5°C to 25°C (41°F to 77°F); the maximum ambient temperature decreases by 1°C for every 500 m (1640 ft) increase in altitude above 900 m (2,953 ft).
      • ASHRAE Class A2: 10°C to 35°C (50°F to 95°F); the maximum ambient temperature decreases by 1°C for every 300 m (984 ft) increase in altitude above 900 m (2,953 ft).
      • ASHRAE Class A3: 5°C to 40°C (41°F to 104°F); the maximum ambient temperature decreases by 1°C for every 175 m (574 ft) increase in altitude above 900 m (2,953 ft).
      • ASHRAE Class A4: 5°C to 45°C (41°F to 113°F); the maximum ambient temperature decreases by 1°C for every 125 m (410 ft) increase in altitude above 900 m (2,953 ft).
    • Server off: 5°C to 45°C (41°F to 113°F)
    • Shipment/storage: -40°C to 60°C (-40°F to 140°F)
  • Maximum altitude: 3,050 m (10,000 ft)
  • Relative Humidity (non-condensing):
    • Operating
      • ASHRAE Class H1: 8% to 80%; maximum dew point: 17°C (62.6°F)
      • ASHRAE Class A2: 8% to 80%; maximum dew point: 21°C (70°F)
      • ASHRAE Class A3: 8% to 85%; maximum dew point: 24°C (75°F)
      • ASHRAE Class A4: 8% to 90%; maximum dew point: 24°C (75°F)
    • Shipment/storage: 8% to 90%
  • Particulate contamination
    Attention
    Airborne particulates and reactive gases acting alone or in combination with other environmental factors such as humidity or temperature might pose a risk to the server. For information about the limits for particulates and gases, see Particulate contamination.
Note
The server is designed for standard data center environment and recommended to be placed in industrial data center.
  • Particulate contamination
    Attention: Airborne particulates (including metal flakes or particles) and reactive gases acting alone or in combination with other environmental factors such as humidity or temperature might pose a risk to the device that is described in this document.