Install a processor and heat sink
This task has instructions for installing an assembled processor and heat sink, known as a processor-heat-sink module (PHM). This task requires a Torx T30 driver. This procedure must be executed by a trained technician.
About this task
Read Installation guidelines to ensure that you work safely.
Power off the server and disconnect all power cords for this task.
Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-sensitive components in their static-protective packages until installation, and handling these devices with an electrostatic-discharge wrist strap or other grounding system.
Each processor socket must always contain a cover or a PHM. When removing or installing a PHM, protect empty processor sockets with a cover.
Do not touch the processor socket or processor contacts. Processor-socket contacts are very fragile and easily damaged. Contaminants on the processor contacts, such as oil from your skin, can cause connection failures.
Do not allow the thermal grease on the processor or heat sink to come in contact with anything. Contact with any surface can compromise the thermal grease, rendering it ineffective. Thermal grease can damage components, such as the electrical connectors in the processor socket.
Remove and install only one PHM at a time. If the system board supports multiple processors, install the PHMs starting with the first processor socket.
Figure 1. Processor locations on system board
The heat sink, processor, and processor carrier for your system might be different from those shown in the illustrations.
PHMs are keyed for the socket where they can be installed and for their orientation in the socket.
See Lenovo ServerProven website for a list of processors supported for your server. All processors on the system board must have the same speed, number of cores, and frequency.
Before you install a new PHM or replacement processor, update your system firmware to the latest level. See Update the firmware.
Installing an additional PHM can change the memory requirements for your system. See Technical rules for memory modules for a list of processor-to-memory relationships.
The following illustration shows the components of the PHM.
1 Heat sink | 9 Clips to secure processor in carrier |
2 Processor identification label | 10 Carrier triangular mark |
3 Heat sink triangular mark | 11 Processor ejector handle |
4 Nut and wire bail retainer | 12 Processor heat spreader |
5 Torx T30 nut | 13 Thermal grease |
6 Anti-tilt wire bail | 14 Processor contacts |
7 Processor carrier | 15 Processor triangular mark |
8 Clips to secure carrier to heat sink |
Procedure
After you finish
Reinstall the air baffle. See Install the air baffle.
Reinstall all the flash power modules. See Install a flash power module.
Reinstall the server cover. See Install the server cover.
Reinstall the hot-swap redundant power supply. See Install the hot-swap power supply.
Complete the parts replacement. See Complete the parts replacement.
Demo video