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Parts list

Identify each of the components that is available for your system with the parts list.

For more information about ordering parts:

  1. Go to Lenovo Data Center Support and navigate to the support page for your node or chassis.

  2. Click Parts.

  3. Enter the serial number to view a listing of parts for your system.

It is highly recommended that you check the power summary data for your server using Lenovo Capacity Planner before purchasing any new parts.

Note

Depending on the model, your server components might look slightly different from the illustration.

The parts listed in the following tables are identified as one of the following:

  • T1: Tier 1 customer replaceable unit (CRU). Replacement of Tier 1 CRUs is your responsibility. If Lenovo installs a Tier 1 CRU at your request with no service agreement, you will be charged for the installation.

  • T2: Tier 2 customer replaceable unit (CRU). You may install a Tier 2 CRU yourself or request Lenovo to install it, at no additional charge, under the type of warranty service that is designated for your server.

  • F: Field replaceable unit (FRU). FRUs must be installed only by trained service technicians.

  • C: Consumable and Structural parts. Purchase and replacement of consumable and structural parts is your responsibility. If Lenovo acquires or installs a structural component at your request, you will be charged for the service.

Chassis components

Figure 1. Chassis components
Chassis components

Description

Type

1 Chassis

T2

2 Node tray rear filler

T1

3 Chassis midplane

T2

4 PSU cage

T1

5 CRPS power supply unit

T2

6 PSU filler

T1

7 Chassis rear shipping brackets (left and right)

T1

8 Node tray front filler

T1

9 Chassis front EIA brackets (left and right)

T1

Node components

Figure 2. Node components
Chassis components

Description

Type

Description

Type

1Top cover

T1

21System board

F

2PCIe riser filler

T1

22Firmware and RoT security module

F

3PCIe riser

F

23Node tray

F

4PCIe adapter

T1

24
  • OCP 3.0 module

  • ThinkSystem OCP 4 to 1 Management Port Consolidation Adapter

T1

5GPU PCIe filler (non-vented)

T1

252.5-inch drive filler

T1

6PCIe filler (vented)

T1

267 mm 2.5-inch drive

T1

7GPU air duct

T1

2715 mm 2.5-inch drive

T1

8Internal CFF RAID adapter

T1

282.5-inch drive cage

T2

9Internal adapter bracket

T1

292.5-inch drive backplane

T1

10Power distribution board

T2

30Air baffle (front or rear)

T1

11Rear I/O module

T1

31Fan cage

T1

12Power bus bar

T1

32Fan

T1

13Cable ducts

T1

33Flash power module

T1

142U performance heat sink and processor carrier

F

34CMOS battery (CR2032)

C

15Side brackets

F

35Screws

T1

162U standard heat sink and processor carrier

F

36External diagnostics handset

T1

17Memory module

T1 or F*

37MicroSD card

T1

18Processor

F

38Cables and transceivers

T1

19M.2 drive

T1

39OCP filler

T1

20M.2 drive retainer

T1

 

 

Note

* FRU: When 2U performance PHM are installed, the memory modules in memory slots 9-16 are FRU.