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Environmental specifications

Summary of the environmental specifications of server. Depending on the model, some features might not be available, or some specifications might not apply.

Acoustical noise emissions​

Acoustical noise emissions

The server has the following acoustic noise emissions declaration:

  • Sound power level (LWAd)

    • Idling: 6.9 Bel (Typical), 7.4 Bel (Max.)

    • Operating 1: 6.9 Bel (Typical), 7.4 Bel (Max.)

    • Operating 2: 7.5 Bel (Typical), 8.3 Bel (Max.)

  • Sound pressure level (LpAm):

    • Idling: 51.2 dBA (Typical), 57.1 dBA (Max.)

    • Operating 1: 51.2 dBA (Typical), 57.1 dBA (Max.)

    • Operating 2: 57.1 dBA (Typical), 65.8 dBA (Max.)

Note

  • These sound levels were measured in controlled acoustical environments according to procedures specified by ISO7779 and are reported in accordance with ISO 9296.

  • Idle mode is the steady state in which the server is powered on but not operating any intended function. Operating mode 1 is 50% of CPU TDP. Operating Mode 2 is 100% of CPU TDP.

  • The declared acoustic sound levels are based on the below-specified configurations, which may change depending on configuration/conditions.

    With two SD550 V3 nodes installed in the chassis

    • Typical: two 330-watt processors, sixteen 32 GB DIMMs, two GPU adapters, two 1GB OCP modules, and two 1300-watt CRPS PSUs

    • Maximum: four 350-watt processors, thirty-two 64 GB DIMMs, twelve 2.5-inch drives, two 1GB OCP modules, four GPU adapters, two CFF RAID adapters, and three 2700-watt CRPS PSUs

  • Government regulations (such as those prescribed by OSHA or European Community Directives) may govern noise level exposure in the workplace and may apply to you and your server installation. The actual sound pressure levels in your installation depend upon a variety of factors, including the number of racks in the installation; the size, materials, and configuration of the room; the noise levels from other equipment; the room ambient temperature, and employee's location in relation to the equipment. Further, compliance with such government regulations depends on a variety of additional factors, including the duration of employees' exposure and whether employees wear hearing protection. Lenovo recommends that you consult with qualified experts in this field to determine whether you are in compliance with the applicable regulations.

Ambient temperature management​

Ambient temperature management

Adjust ambient temperature when specific components are installed.

Note
  • To avoid throttling, make sure to adopt passive Direct Attach cables when network adapters with 100GbE or higher speed are installed.
  • Depending on the configuration, the processors require different types of heat sink.

    1. The front processor (processor 1) always requires a standard heat sink.

    2. For the rear processor (processor 2):

      • with TDP lower than 250 watt: requires a 2U standard heat sink.

      • with TDP higher than 250 watt: requires a 2U performance heat sink.

Keep the ambient temperature to 35°C or lower with the following configurations.

  • One 350-watt TDP processor with:
    • Up to eight 128 GB DIMMs
    • Up to two M.2 drives
    • One OCP module
    • One of the following:
      1. Up to six 2.5-inch drives

      2. Up to two 2.5-inch drives with one PCIe or GPU adapter

  • Two 350-watt TDP Processors (Processor 2 with performance heat sink) with:
    • Up to sixteen 64 GB DIMMs
    • Up to two M.2 drives
    • One OCP module
    • Up to two 2.5-inch drives
  • Two 300-watt TDP processors (Processor 2 with performance heat sink) or 250-watt TDP processors with:
    • Up to sixteen 96 GB DIMMs
    • Up to six 2.5-inch drives
    • Up to two PCIe adapters
    • Up to two M.2 drives
    • One OCP module

Keep the ambient temperature to 30°C or lower with the following system configurations.

  • Two 350-watt TDP Processors (Processor 2 with performance heat sink) with:
    • Up to sixteen 96 GB DIMMs
    • Up to six 2.5-inch drives
    • Up to two PCIe adapters
    • Up to two M.2 drives
    • One OCP module
  • Two 300-watt TDP processors (Processor 2 with performance heat sink) or 250-watt TDP processors with:
    • Up to six 2.5-inch drives
    • Up to two M.2 drives
    • One OCP module
    • One of the following:
      1. Up to sixteen 128 GB DIMMs with up to two PCIe adapters
      2. Up to sixteen 96 GB DIMMs with up to two GPU adapters

Keep the ambient temperature to 25°C or lower with the following system configuration.

  • Two 350-watt TDP Processors (Processor 2 with performance heat sink) with:
    • Up to six 2.5-inch drives
    • Up to two M.2 drives
    • One OCP module
    • One of the following:
      1. Up to sixteen 128 GB DIMMs with up to two PCIe adapters
      2. Up to sixteen 96 GB DIMMs with up to two GPU adapters

Environment​

Environment

ThinkSystem SD550 V3 complies with ASHRAE Class A2 specifications. System performance may be impacted when operating temperature is outside AHSRAE A2 specification.

Depending on the hardware configuration, SD550 V3 also complies with ASHRAE Class H1 specification. System performance may be impacted when operating temperature is outside ASHRAE H1 specification.

  • Air temperature:

    • Operating

      • ASHRAE Class A2: 10°C to 35°C (50°F to 95°F); the maximum ambient temperature decreases by 1°C for every 300 m (984 ft) increase in altitude above 900 m (2,953 ft).

      • ASHRAE Class H1: 5°C to 25°C (41°F to 77°F); the maximum ambient temperature decreases by 1°C for every 300 m (984 ft) increase in altitude above 900 m (2,953 ft).

    • Server off: 5°C to 45°C (41°F to 113°F)

    • Shipment/storage: -40°C to 60°C (-40°F to 140°F)

  • Maximum altitude: 3,050 m (10,000 ft)

  • Relative Humidity (non-condensing):

    • Operating

      • ASHRAE Class A2: 8% to 80%; maximum dew point: 21°C (70°F)

      • ASHRAE Class H1: 8% to 80%; maximum dew point: 17°C (62.6°F)

    • Shipment/storage: 8% to 90%

  • Particulate contamination

    Attention

    Airborne particulates and reactive gases acting alone or in combination with other environmental factors such as humidity or temperature might pose a risk to the server. For information about the limits for particulates and gases, see Particulate contamination.

Note

The server is designed for standard data center environment and recommended to be placed in industrial data center.

  • Particulate contamination
    Attention: Airborne particulates (including metal flakes or particles) and reactive gases acting alone or in combination with other environmental factors such as humidity or temperature might pose a risk to the device that is described in this document.