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Environmental specifications

Summary of the environmental specifications of solution. Depending on the model, some features might not be available, or some specifications might not apply.

Note

  • The 6U enclosure supports up to six trays.

  • Each tray contains two nodes; one left node and one right node (when viewed from front of enclosure).

  • SD650-I V3 tray contains one compute node and one GPU node.

Acoustical noise emissions
SD650-I V3 Tray:
  • SD650-I V3 sound power level (LWAd):
    • Idle: 6.7 Bel
    • Operation: 8.5 Bel
Note

  • These levels were measured in controlled acoustical environments according to procedures specified by ISO 7779, and are reported in accordance with ISO 9296.

  • The declared acoustic noise levels are based on specified configurations (one enclosure with 9 PSUs), and may change depending on configuration/condition changes.

  • Government regulations (such as those prescribed by OSHA or European Community Directives) may govern noise level exposure in the workplace and may apply to you and your server installation. The actual sound pressure levels in your installation depend upon a variety of factors, including the number of racks in the installation; the size, materials, and configuration of the room; the noise levels from other equipment; the room ambient temperature, and employee's location in relation to the equipment. Further, compliance with such government regulations depends on a variety of additional factors, including the duration of employees' exposure and whether employees wear hearing protection. Lenovo recommends that you consult with qualified experts in this field to determine whether you are in compliance with the applicable regulations.

Environment
  • Air temperature requirements:

    • Operating:

      • ASHRAE class A2: 10°C - 35°C (50°F - 95°F); when the altitude exceeds 900 m (2953 ft), the maximum ambient temperature value decreases by 1°C (1.8°F) with every 300 m (984 ft) of altitude increase.

    • Powered off: 5°C - 45°C (41°F - 113°F)

    • Shipping/storage: -40°C - 60°C (-40°F - 140°F)

  • Relative humidity (non-condensing):

    • Operating: ASHRAE Class A2: 8% - 80%, maximum dew point : 21°C (70°F)

    • Shipment/storage: 8% - 90%

  • Maximum altitude: 3048 m (10 000 ft)

Note
The solution is designed for standard data center environment and recommended to be placed in industrial data center.
Water requirements
6900W (200-208 Vac) DWC power supply

  • Water temperature:

    • ASHRAE class W+: up to 50°C (122°F) inlet temperature to the rack

  • Maximum pressure: 4.4 bars

  • Minimum water flow rate:1.0 liters per minute per power supply

    • For inlet water temperatures up to 45°C (113°F), 1.0 liters per minute per power supply

    • For inlet water temperatures between 45°C - 50°C (113°F - 122°F), 1.5 liters per minute per power supply

7200W (220-240 Vac and 240 Vdc) DWC power supply

  • Water temperature:

    • ASHRAE class W+: up to 50°C (122°F) inlet temperature to the rack

  • Maximum pressure: 4.4 bars

  • Minimum water flow rate:1.5 liters per minute per power supply

    • For inlet water temperatures up to 45°C (113°F), 1.5 liters per minute per power supply

    • For inlet water temperatures between 45°C - 50°C (113°F - 122°F), 2.0 liters per minute per power supply

SD650-I V3

  • Water temperature:

    • ASHRAE class W45: up to 45°C (113°F) inlet temperature to the rack

      • For Intel® Data Center GPU Max Series up to 600W and processors up to 350W

    • ASHRAE class W27: up to 27°C (80.6°F) inlet temperature to the rack

      • For Intel® Data Center GPU Max Series up to 600W and:

        • Intel® Xeon® Platinum 6458Q/8470Q processors

        • Intel® Xeon® CPU Max 9480/9470 processors

      • Intel® Xeon® 8593Q processor

      • Intel® Xeon® 6558Q processor

    • ASHRAE class W32: up to 32°C (89.6°F) inlet temperature to the rack

      • For Intel® Data Center GPU Max Series up to 600W and Intel® Xeon® CPU Max 9468/9460/9462 processors

  • Maximum pressure: 4.4 bars

  • Minimum water flow rate:

    • SD650-I V3 tray with Intel® Data Center GPU Max Series up to 600W and Intel® Xeon® processor up to 350W: 21.0 liters per minute per enclosure, assuming 3.5 lpm per tray with 6 trays per enclosure

    • For Intel® Xeon® 8593Q processor: 21 liters per minute per enclosure, assuming 3.5 liters per minute per compute tray with 6 trays per enclosure.

Note
The water required to initially fill the system side cooling loop must be reasonably clean, bacteria-free water (<100 CFU/ml) such as de-mineralized water, reverse osmosis water, de-ionized water, or distilled water. The water must be filtered with an in-line 50 micron filter (approximately 288 mesh). The water must be treated with anti-biological and anti-corrosion measures.
  • Particulate contamination
    Attention: Airborne particulates (including metal flakes or particles) and reactive gases acting alone or in combination with other environmental factors such as humidity or temperature might pose a risk to the device that is described in this document.