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Environmental specifications

Summary of the environmental specifications of solution. Depending on the model, some features might not be available, or some specifications might not apply.

Note

  • Up to six SD665-N V3 trays can be installed in the DW612S 6U enclosure. For more information on the number of trays in the enclosure, see GPU power and maximum number of trays in the enclosure.

  • SD665-N V3 tray contains one compute node on the right and one GPU node on the left (when viewed from front of the DW612S enclosure)

  • The GPU node contains the NVIDIA HGX H100 4-GPU board and the network board (4 Connect-X 7).

Acoustical noise emissions
SD665-N V3 Tray:
  • Sound power level (LWAd):
    • Idle: 6.7 Bel
    • Operation: 9.0 Bel
Note

  • These levels were measured in controlled acoustical environments according to procedures specified by ISO 7779, and are reported in accordance with ISO 9296.

  • The declared acoustic noise levels are based on specified configurations with 9 air-cooling PSUs in the DW612S 6U enclosure, and may change depending on configuration/condition changes.

  • Government regulations (such as those prescribed by OSHA or European Community Directives) may govern noise level exposure in the workplace and may apply to you and your server installation. The actual sound pressure levels in your installation depend upon a variety of factors, including the number of racks in the installation; the size, materials, and configuration of the room; the noise levels from other equipment; the room ambient temperature, and employee's location in relation to the equipment. Further, compliance with such government regulations depends on a variety of additional factors, including the duration of employees' exposure and whether employees wear hearing protection. Lenovo recommends that you consult with qualified experts in this field to determine whether you are in compliance with the applicable regulations.

Environment
  • Air temperature requirements:

    • Operating:

      • ASHRAE class A2: 10°C - 35°C (50°F - 95°F); when the altitude exceeds 900 m (2953 ft), the maximum ambient temperature value decreases by 1°C (1.8°F) with every 300 m (984 ft) of altitude increase.

    • Powered off: 5°C - 45°C (41°F - 113°F)

    • Shipping/storage: -40°C - 60°C (-40°F - 140°F)

  • Relative humidity (non-condensing):

    • Operating: ASHRAE Class A2: 8% - 80%, maximum dew point : 21°C (70°F)

    • Shipment/storage: 8% - 90%

  • Maximum altitude: 3048 m (10 000 ft)

Note
The solution is designed for standard data center environment and recommended to be placed in industrial data center.
Water requirements
6900W (200-208 Vac) DWC power supply

  • Water temperature:

    • ASHRAE class W+: up to 50°C (122°F)

  • Maximum pressure: 4.4 bars

  • Minimum water flow rate:1.0 liters per minute per power supply

    • For inlet water temperatures up to 45°C (113°F), 1.0 liters per minute per power supply

    • For inlet water temperatures between 45°C - 50°C (113°F - 122°F), 1.5 liters per minute per power supply

7200W (220-240 Vac and 240 Vdc) DWC power supply

  • Water temperature:

    • ASHRAE class W+: up to 50°C (122°F)

  • Maximum pressure: 4.4 bars

  • Minimum water flow rate:1.5 liters per minute per power supply

    • For inlet water temperatures up to 45°C (113°F), 1.5 liters per minute per power supply

    • For inlet water temperatures between 45°C - 50°C (113°F - 122°F), 2.0 liters per minute per power supply

SD665-N V3 tray and DW612S enclosure are supported in the following environment:

  • Water requirements

    • Water temperature: up to 45°C (113°F), 5 lpm per tray

      • CPUs up to 400W TDP

      • DIMMs up to 96GB capacity

      • GPUs up to 700W TDP

      • NVIDIA network card up to 800Gb/sec

    • Water temperature: up to 40°C (104°F), 4 lpm per tray

      • CPUs up to 400W TDP

      • DIMMs up to 96GB capacity

      • GPUs up to 700W TDP

      • NVIDIA network card up to 800Gb/sec

  • Water requirement exceptions:

    • Water temperature: ASHRAE W32, up to 32°C (89.6°F)

      • 128 GB DIMMs

    • Water temperature: up to 40°C (104°F) with 5 LPM with 4 trays

      • AMD® EPYCTM 9554 64C and 9554P 64C processors.

    • Water temperature: up to 35°C (95°F) with 5 LPM with 4 trays

      • AMD® EPYCTM 9374F 32C, 9274F 24C, 9174F 16C, and 9474F 48C processors.

  • Maximum pressure: 4.4 bars

  • Water flow rates:

    • Water flow rate for 45°C (113°F): 20 liters per minute (lpm) per enclosure, assuming 5.0 liters per tray with 4 trays per enclosure.

    • Water flow rate for 40°C (104°F): 16 liters per minute (lpm) per enclosure, assuming 4.0 liters per tray with 4 trays per enclosure.

    • Water flow rate for 35°C (95°F): 17.5 liters per minute (lpm) per enclosure, assuming 3.5 liters per tray with 5 trays per enclosure.

    • Water flow rate for 35°C (95°F): 21 liters per minute (lpm) per enclosure, assuming 3.5 liters per tray with 6 trays per enclosure.

    1 tray consists of 1 compute node and 1 GPU node.

Note
The water required to initially fill the system side cooling loop must be reasonably clean, bacteria-free water (<100 CFU/ml) such as de-mineralized water, reverse osmosis water, de-ionized water, or distilled water. The water must be filtered with an in-line 50 micron filter (approximately 288 mesh). The water must be treated with anti-biological and anti-corrosion measures.
  • Particulate contamination
    Attention: Airborne particulates (including metal flakes or particles) and reactive gases acting alone or in combination with other environmental factors such as humidity or temperature might pose a risk to the device that is described in this document.