Parts list
Identify each of the components that is available for your server with the parts list.
Go to Lenovo Data Center Support and navigate to the support page for your server.
Click .
Enter the serial number to view a listing of parts for your server.
It is highly recommended that you check the power summary data for your server using Lenovo Capacity Planner before purchasing any new parts.
T1: Tier 1 customer replaceable unit (CRU). Replacement of Tier 1 CRUs is your responsibility. If Lenovo installs a Tier 1 CRU at your request with no service agreement, you will be charged for the installation.
T2: Tier 2 customer replaceable unit (CRU). You may install a Tier 2 CRU yourself or request Lenovo to install it, at no additional charge, under the type of warranty service that is designated for your server.
F: Field replaceable unit (FRU). FRUs must be installed only by trained service technicians.
C: Consumable and Structural parts. Purchase and replacement of consumable and structural parts (components, such as a filler or bezel) is your responsibility. If Lenovo acquires or installs a structural component at your request, you will be charged for the service.
Enclosure components
| Description | Type |
|---|---|
For more information about ordering parts:
| |
| 1 Front shipping bracket | T1 |
| 2 Networking dust filter | T1 |
| 3 Rack dust filter | T1 |
| 4 2U2N enclosure | F |
| 5 Rear shipping bracket | T1 |
| 6 Node filler | C |
Node components
| Description | Type | Description | Type |
|---|---|---|---|
For more information about ordering parts:
| |||
| 1 PCIe adapter | F | 31 Wireless adapter | F |
| 2 PCIe low-profile filler | C | 32 Chassis | F |
| 3 Rear dust filter | T1 | 33 x86 WLAN module | F |
| 4 Top cover | T1 | 34 XCC WLAN and Bluetooth module | F |
| 5 Top cover (supporting geotracking) | T1 | 35 Bluetooth antenna with cable | F |
| 6 Processor air baffle | F | 36 Bluetooth antenna filler | C |
| 7 Air flow sensor board | F | 37 1GbE I/O module board | F |
| 8 Enclosure bracket | T1 | 38 M.2 drive | T2 |
| 9 Processor heat sink | F | 39 M.2 drive heat sink | F |
| 10 System board | F | 40 10/25GbE I/O module board | F |
| 11 CMOS battery (CR2032) | C | 41 Bottom cover for 1GbE I/O module | T1 |
| 12 MicroSD card | T1 | 42 7mm drive filler | C |
| 13 Memory module | T2 | 43 7mm hot-swap drive | T1 |
| 14 Memory module tool | T1 | 44 Bottom cover for 10/25GbE I/O module | T1 |
| 15 Rear operator panel | F | 45 Riser cage (PCIe+7mm drive) | F |
| 16 PMB air baffle | T1 | 46 Riser cage (M.2+7mm drive) | F |
| 17 Intrusion switch with cable | T2 | 47 PCIe cabled riser card | F |
| 18 Intrusion switch bracket | T1 | 48 M.2 riser card | F |
| 19 SMA bracket | F | 49 PCIe riser card | F |
| 20 SMA filler | C | 50 Riser cage (M.2+M.2) | F |
| 21 DC power input board (PIB) module | F | 51 Riser cage (PCIe+PCIe) | F |
| 22 DC power module board (PMB) | F | 52 Riser cage (M.2+PCIe) | F |
| 23 Kensington lock | T1 | 53 Riser cage (PCIe+PCIe+geotracking) | F |
| 24 WLAN antenna | T2 | 54 Riser cage (M.2+PCIe+geotracking) | F |
| 25 Bottom air baffle | T1 | 55 M.2 adapter | F |
| 26 AC power input board (PIB) module | F | 56 M.2 cabled adapter | F |
| 27 Internal power supply unit (AC PMB) | F | 57 7mm drive backplane 2 | F |
| 28 External DC terminal block cable | T1 | 58 7mm drive backplane 1 | F |
| 29 External 300W bridge cable | T1 | 59 Fan (rear-to-front airflow) | T2 |
| 30 Front operator panel | F | 60 Fan (front-to-rear airflow) | T2 |