Install a processor and heat sink

This task has instructions for installing an assembled processor and heat sink, known as a processor-heat-sink module (PHM). This task requires a Torx T30 driver. This procedure must be executed by a trained technician.

About this task

Attention

• Read Safety inspection checklist and Installation Guidelines to ensure that you work safely.

• Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-sensitive components in their static-protective packages until installation, and handling these devices with an electrostatic-discharge wrist strap or other grounding system.

• Each processor socket must always contain a cover or a PHM. When removing or installing a PHM, protect empty processor sockets with a cover.

• Do not touch the processor socket or processor contacts. Processor-socket contacts are very fragile and easily damaged. Contaminants on the processor contacts, such as oil from your skin, can cause connection failures.

• Do not allow the thermal grease on the processor or heat sink to come in contact with anything. Contact with any surface can compromise the thermal grease, rendering it ineffective. Thermal grease can damage components, such as the electrical connectors in the processor socket.

• Remove and install only one PHM at a time.

• Make sure you have an alcohol cleaning pad (part number 00MP352), thermal grease, and Torx T30 screwdriver available.

• Install the PHM starting from processor socket 1.

Note

1. The compute node supports one I/O expansion adapter when installed with one processor, and two I/O expansion adapters when installed with two processors. At least one I/O expansion adapter should be installed in the compute node.

2. Empty processor socket must always contain a socket cover and a filler before the compute node is powered on.

3. Select processor heat sink according to processor TDP and placement in the compute node.

   • If the processor TDP is lower than or equal to 165 watts, select front or rear standard heat sink.

   • If the processor TDP is higher than 165 watts, select front or rear performance heat sink.

     Note

     When using Intel Xeon Gold 6334 8c 165W 3.6GHz processor, select performance heat sink.

• EDSFF drive support guide regarding processor:

  • EDSFF drive feature requires installing two processors in the compute node.

  • EDSFF drive feature is not supported when the processor TDP is higher than 220 watts.

  • EDSFF drive feature is not supported when Intel Xeon Gold 6334 8c 165W 3.6GHz processor is installed in the compute node.

The following illustration shows the PHM locations on system board.

Figure 1. Location of memory modules and processor sockets

Table 1. Location of memory modules and processors

1 Memory module slots 9–12	4 Memory module slots 1–4
2 Processor socket 2	5 Memory module slots 5–8
3 Processor socket 1	6 Memory module slots 13–16

The following illustration shows the components of the PHM.

Figure 2. PHM components

1 Heat sink	9 Clips to secure processor in carrier
2 Heat sink triangular mark	10 Carrier triangular mark
3 Processor identification label	11 Processor ejector handle
4 Nut and wire bail retainer	12 Processor heat spreader
5 Torx T30 nut	13 Thermal grease
6 Anti-tilt wire bail	14 Processor contacts
7 Processor carrier	15 Processor triangular mark
8 Clips to secure carrier to heat sink

Note

• The heat sink, processor, and processor carrier for your system might be different from those shown in the illustrations.

• PHMs are keyed for the socket where they can be installed and for their orientation in the socket.

• See Lenovo ServerProven website for a list of processors supported for your server. All processors on the system board must have the same speed, number of cores, and frequency.

• Before you install a new PHM or replacement processor, update your system firmware to the latest level. See Update the firmware.

Procedure

1. If you are replacing a processor and reusing the heat sink,
   1. Remove the processor identification label from the heat sink and replace it with the new label that comes with the replacement processor.
   2. If there is any old thermal grease on the heat sink, wipe the thermal grease from the bottom of the heat sink with an alcohol cleaning pad.
   Note

   Afterwards, proceed to Step 3.
2. If you are replacing a heat sink and reusing the processor.
   1. Remove the processor identification label from the old heat sink and place it on the new heat sink in the same location. The label is on the side of the heat sink closest to the triangular alignment mark.
      Note

      If you are unable to remove the label and place it on the new heat sink, or if the label is damaged during transfer, write the processor serial number from the processor identification label on the new heat sink in the same location as the label would be placed using a permanent marker.
   2. Install processor in new carrier.
      Note

      Replacement heat sinks come with both gray and black processor carriers. Make sure to use the carrier with the same color as the one you discarded earlier.

      1. Make sure the handle on the carrier is in the closed position.

      2. Align the processor on the new carrier so that the triangular marks align; then, insert the marked end of the processor into the carrier.

      3. Hold the inserted end of the processor in place; then, pivot the unmarked end of the carrier down and away from the processor.

      4. Press the processor and secure the unmarked end under the clip on the carrier.

      5. Carefully pivot the sides of the carrier down and away from the processor.

      6. Press the processor and secure the sides under the clips on the carrier.

         Note

         To prevent the processor from falling out of the carrier, keep the processor-contact side up and hold the processor-carrier assembly by the sides of the carrier.

      Figure 3. Processor carrier installation
      
      
3. Apply thermal grease.
   1. Carefully place the processor and carrier in the shipping tray with the processor-contact side down. Make sure the triangular mark on the carrier is aligned with the triangular mark in the shipping tray.
   2. If there is any old thermal grease on the processor, gently wipe the top of the processor with an alcohol cleaning pad.
      Note

      Make sure the alcohol has fully evaporated before applying new thermal grease.
   3. Apply the thermal grease on the top of the processor with syringe by forming four uniformly spaced dots, while each dot consists of about 0.1 ml of thermal grease.
      Figure 4. Thermal grease application with processor in shipping tray
      
      
4. Assemble the processor and heat sink.
   1. Turn your heat sink over and place it on a flat surface.
   2. Hold the processor-carrier assembly by the sides of the carrier with the processor-contact side up.
   3. Align the triangular mark on the processor carrier and processor with the triangular mark or notched corner on the heat sink.
   4. Install the processor-carrier assembly onto the heat sink.
   5. Press the carrier into place until the clips at all four corners engage.
   Figure 5. Assembling the PHM
   
   
5. Install the processor-heat-sink module into the system board socket.
   1. Turn over the heat sink. Rotate the anti-tilt wire bails on the heat sink inward.
   2. Align the triangular mark and four Torx T30 nuts on the PHM with the triangular mark and threaded posts of the processor socket; then, insert the PHM into the processor socket.
   3. Rotate the anti-tilt wire bails outward until they engage with the hooks in the socket.
   4. Fully tighten the Torx T30 nuts in the installation sequence shown on the heat-sink label. Tighten the screws until they stop; then, visually inspect to make sure that there is no gap between the screw shoulder beneath the heat sink and the processor socket. (For reference, the torque required for the fasteners to fully tighten is 1.1 newton-meters, 10 inch-pounds).
   Figure 6. PHM installation