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Remove the system board retention clip

Follow instructions in this section to remove the system board retention clip. The procedure must be executed by a trained technician.

About this task

Important
This task must be operated by trained technicians that are certified by Lenovo Service. Do not attempt to remove or install the part without proper training and qualification.
Attention
  • Read Installation Guidelines and Safety inspection checklist to ensure that you work safely.
  • Power off the server and peripheral devices and disconnect the power cords and all external cables. See Power off the server.
  • Two people and one lifting device on site that can support up to 400 lb (181 kg) are required to perform this procedure. If you do not already have a lifting device available, Lenovo offers the Genie Lift GL-8 material lift that can be purchased at Data Center Solution Configurator. Make sure to include the Foot-release brake and the Load Platform when ordering the Genie Lift GL-8 material lift.

Procedure

  1. Remove the following components.
    1. Pull the system shuttle out of the chassis, and place it onto the lift platform. See Remove the system shuttle.
    2. Disconnect all the cables from the system board. As you disconnect the cables, make a list of each cable and record the connectors the cables are connected to, and use the record as a cabling checklist after installing the new system board.
      Attention

      • To avoid damaging the system board, make sure to follow the instructions in Internal cable routing when disconnecting cables from the system board.

      • Before disconnecting the front fan control board power cable from the system board (silkscreened as REAR IO PWR), remove the surrounding MCIO cables and the system I/O board cable. Then, ensure the latch on the connector is fully pressed before lifting the power cable. For more details, see XCC logs multiple front fans "Tach going low" - ThinkSystem SR680a V3 with B200.

    3. Remove the compute tray. See Remove the compute tray.
    4. Remove the heat sinks. See Remove a processor and heat sink.
  2. Loosen the four screws located on the front of the system board.
    Figure 1. Screw removal
    Screw removal
  3. Slightly lift the system board and remove the retention clip.
    Figure 2. System board retention clip removal
    System board retention clip removal

After you finish

If you are instructed to return the component or optional device, follow all packaging instructions, and use any packaging materials for shipping that are supplied to you.