Remove a memory module
Use this procedure to remove a memory module.
Always wear an electrostatic-discharge strap when removing or installing memory modules. Electrostatic-discharge gloves can also be used.
Never hold two or more memory modules together so that they touch. Do not stack memory modules directly on top of each other during storage.
Never touch the gold memory module connector contacts or allow these contacts to touch the outside of the memory-module connector housing.
Handle memory modules with care: never bend, twist, or drop a memory module.
Before removing a memory module:
If you are removing a DCPMM in App Direct or Mixed Memory Mode, make sure to back up the stored data, and delete any created namespace.
Read the safety information and installation guidelines (see Safety and Installation Guidelines).
Turn off the server and peripheral devices and disconnect the power cords and all external cables (see Power off the server).
If the server is installed in a rack, slide the server out on its rack slide rails to gain access to the top cover, or remove the server from the rack.
Remove the top cover (see Remove the top cover).
If you are removing memory modules from the processor and memory expansion tray, do not remove the expansion tray. Only remove the air baffle that is installed on the expansion tray.
Figure 1. Air baffle removal from the processor and memory expansion tray
If you are removing memory modules from the system board, make sure to remove the expansion tray (see Remove the processor and memory expansion tray) and the air baffle that is installed on the system board.
Figure 2. Air baffle removal from the system board
Complete the following steps to remove a memory module.
If you are instructed to return the component or optional device, follow all packaging instructions, and use any packaging materials for shipping that are supplied to you.
Demo video