Parts list
Use the parts list to identify each of the components that are available for your solution.
Go to Lenovo Data Center Support and navigate to the support page for your solution.
Click .
Enter the serial number to view a listing of parts for your solution.
It is highly recommended that you check the power summary data for your solution using Lenovo Capacity Planner before purchasing any new parts.
T1: Tier 1 customer replaceable unit (CRU). Replacement of Tier 1 CRUs is your responsibility. If Lenovo installs a Tier 1 CRU at your request with no service agreement, you will be charged for the installation.
T2: Tier 2 customer replaceable unit (CRU). You may install a Tier 2 CRU yourself or request Lenovo to install it, at no additional charge, under the type of warranty service that is designated for your server.
F: Field replaceable unit (FRU). FRUs must be installed only by trained service technicians.
C: Consumable and Structural parts. Purchase and replacement of consumable and structural parts (components, such as a filler or bezel) is your responsibility. If Lenovo acquires or installs a structural component at your request, you will be charged for the service.
SC750 V4 parts list
| Index | Description | Type |
|---|---|---|
For more information about ordering parts:
| ||
| 1 | Top cover | F |
| 2 | Processor board | F |
| 3 | System management sideband cable kit | F |
| 4 | Bus bar connector module | F |
| 5 | Tray for processor board, system I/O board, and front I/O board | F |
| 6 | Cable | F |
| 7 | Leakage sensor module | F |
| 8 | Rear cross brace | F |
| 9 | Front cross brace | F |
| 10 | Foolproof module | F |
| 11 | Power distribution board | F |
| 12 | Processor | F |
| 13 | Memory module | F |
| 14 | DIMM cover | F |
| 15 | Node tray | |
| 16 | VR conduction plate cover | F |
| 17 | VR conduction plate | F |
| 18 | DIMM cooling bar | F |
| 19 | PCIe riser cage | F |
| 20 | PCIe adapter | F |
| 21 | Middle E3.S drive cage | F |
| 22 | Component conduction plate | F |
| 23 | Component gap pad, putty pad, or single-use gap pad | F |
| 24 | Water loop | F |
| 25 | System I/O board (DCSCM) | F |
| 26 | Front I/O board | F |
| 27 | E3.S 1T drive | F |
| 28 | E3.S 2T drive | F |
| 29 | E3.S drive heat sink | F |
| 30 | Front E3.S drive cage | F |
| 31 | Blank bezel filler | F |
| 32 | DIMM tool | F |
| 33 | DIMM comb | F |
| 34 | CMOS battery | F |
| 35 | Screw | F |
| 36 | Water loop service kit | F |
| 37 | Miscellaneous parts kit | F |
| 38 | Water loop gap pad kit | F |