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Compute node specifications

Features and specifications of the compute node.

Table 1. Compute node specifications
  • Height: 41.0 mm (1.7 inches)
  • Depth: 562.0 mm (22.2 inches)
  • Width: 222.0 mm (8.8 inches)
  • Weight:
    • Minimum weight: 3.5 kg (7.7 lb)
    • Maximum weight: 7.5 kg (16.6 lb)
Processor (depending on the model)
  • Supports up to two Intel Xeon series multi-core processors (one installed)
  • Level-3 cache
  1. Use the Setup utility to determine the type and speed of the processors in the node.
  2. For a list of supported processors, see Lenovo ServerProven website.
  3. Due to lower operational processor temperature requirements, full performance cannot be guaranteed and processor throttling may occur when the ambient temperature is above 27°C or when a fan failure event occurs for the following processor SKUs:
    • 6248R
    • 6258R
  4. Processor 6248R comes with the following limitations:
    • Supported quantity of drives goes up to two.
    • PCIe expansion nodes are not supported when 6248R processors are installed in the compute node.
    • Only the following PCIe adapters are supported:
      • ThinkSystem M.2 Enablement Kit
      • ThinkSystem M.2 with Mirroring Enablement Kit
      • Intel OPA 100 Series Single-port PCIe 3.0 x16 HFA
      • Intel OPA 100 Series Single-port PCIe 3.0 x8 HFA
      • ThinkSystem Mellanox ConnectX-6 HDR100 QSFP56 1-port PCIe InfiniBand Adapter

See Memory module installation order for detailed information about memory configuration and setup.

  • Minimum: 8 GB (single TruDDR4 DRAM DIMM with one processor)

  • Maximum:

    • 512 GB with 16 x 32 GB RDIMM

    • 1,024 GB with 16 x 64 GB LRDIMM

    • 2 TB with DC Persistent Memory Module (DCPMM) and RDIMMs in Memory Mode

  • Memory module types:
    • Double-data-rate 4 (TruDDR4) error correcting code (ECC) 2666 MT/s registered DIMM (RDIMM) or load reduced DIMM (LRDIMM)
    • DC Persistent Memory Module (DCPMM)
  • Capacity (depending on the model):
    • 8 GB, 16 GB, and 32 GB RDIMM
    • 64 GB LRDIMM
    • 128 GB, 256 GB, and 512 GB DCPMM
      DCPMM can be mixed with DRAM DIMMs with capacity of more than 16 GB. See DC Persistent Memory Module (DCPMM) setup for more information.
  • Slots: 16 DIMM slots that support up to
    • 16 DRAM DIMMs
    • Four DCPMMs and 12 DRAM DIMMs

For a list of supported memory modules, see Lenovo ServerProven website.

List of supported memory module is different for 1st generation (Skylake) and 2nd generation (Cascade Lake) Intel Xeon processors. Make sure to install compatible memory modules to avoid system error.
Drive baysSupports up to six 2.5-inch hot-swap SAS/SATA/NVMe drive bays.
As a general consideration, do not mix standard 512-byte and advanced 4-KB format drives in the same RAID array because it might lead to potential performance issues.
Supports the following 2.5-inch hot-swap drive backplanes:
  • Four 2.5-inch hot-swap SAS/SATA backplane

  • Four 2.5-inch NVMe backplane

  • Six 2.5-inch hot-swap SAS/SATA backplane

  • Six 2.5-inch hot-swap SAS/SATA/NVMe backplane

Do not mix nodes with the four-drive backplane and six-drive backplanes in the same enclosure, as it may cause unbalanced cooling.
RAID adapters (depending on the model)
  • Software RAID supports for RAID levels 0, 1, 5, and 10
  • Hardware RAID supports for RAID levels 0, 1, 5, and 10
Video controller (integrated into Lenovo XClarity Controller)
  • SVGA compatible video controller
  • Avocent Digital Video Compression
  • Video memory is not expandable
Maximum video resolution is 1920 x 1200 at 60 Hz.
Ethernet I/O portAccess to a pair of on-board 10Gb connections through two types of optional enclosure level EIOM cards.
  • Two optional EIOM cards:
    • 10Gb 8-port EIOM SFP+

    • 10Gb 8-port EIOM Base-T (RJ45)

  • Minimum networking speed requirement for the EIOM card: 1Gbps

The EIOM card is installed in the enclosure and it provides direct access to LAN functions provided by each node.

Operating SystemSupported and certified operating systems include:
  • Microsoft Windows Server

  • VMware ESXi

  • Red Hat Enterprise Linux

  • SUSE Linux Enterprise Server

EnvironmentThe ThinkSystem SD530 complies with ASHRAE class A2 specifications.

Depending on the hardware configuration, some solution models comply with ASHRAE Class A3 or Class A4 specifications. System performance may be impacted when operating temperature is outside ASHRAE A2 specification or fan failed condition. To comply with ASHRAE Class A3 and Class A4 specifications, the ThinkSystem SD530 needs to meet the following hardware configuration requirements:

  • Lenovo supported processors.

    For unsupported processors, see the following attention for details1.

  • Lenovo supported PCIe adapters.

    For unsupported PCIe adapters, see the following attention for details2.

  • Two power supplies installed for redundancy.

    1100-watt power supplies are not supported.

The ThinkSystem SD530 is supported in the following environment:
  • Air temperature:

    Power on3:
    • ASHRAE Class A2: 10°C - 35°C (50°F - 95°F); Above 900 m (2,953 ft), de-rated maximum air temperature 1°C / 300m (984 ft)
    • ASHRAE Class A3: 5°C - 40°C (41°F - 104°F); Above 900 m (2,953 ft), de-rated maximum air temperature 1°C / 175m (574 ft)
    • ASHRAE Class A4: 5°C - 45°C (41°F - 113°F); Above 900 m (2,953 ft), de-rated maximum air temperature 1°C / 125m (410 ft)

    Power off4: 5°C to 45°C (41°F to 113°F)

  • Maximum altitude: 3,050 m (10,000 ft)

  • Relative Humidity (non-condensing):
    Power on3:
    • ASHRAE Class A2: 8% - 80%, maximum dew point : 21°C (70°F)
    • ASHRAE Class A3: 8% - 85%, maximum dew point : 24°C (75°F)
    • ASHRAE Class A4: 8% - 90%, maximum dew point : 24°C (75°F)

    Shipment/storage: 8% - 90%

  • Particulate contamination:

    Airborne particulates and reactive gases acting alone or in combination with other environmental factors such as humidity or temperature might pose a risk to the solution. For information about the limits for particulates and gases, see Particulate contamination.

Power rating12 V DC, 60 A
  1. The following processors are not supported with ASHRAE Class A3 and Class A4 specifications:
    • 165W processor, 28-core, 26-core or 18-core (Intel Xeon 8176, 8176M, 8170, 8170M, and 6150)

    • 150W processor, 26-core, 24-core, 20-core, 16-core or 12-core (Intel Xeon 8164, 8160, 8160M, 8158, 6148, 6142, 6142M, and 6136)

    • 140W processor, 22-core or 18-core (Intel Xeon 6152, 6140, and 6140M)

    • 140W processor, 14-core (Intel Xeon 6132)

    • 130W processor, 8-core (Intel Xeon 6134 and 6134M)

    • 125W processor, 20-core, 16-core or 12-core (Intel Xeon 6138, 6138T, 6130T, 6126)

    • 115W processor, 6-core (Intel Xeon 6128)

    • 105W processor, 14-core or 4-core (Intel Xeon 8156, 5122, and 5120T)

    • 70W processor, 8-core (Intel Xeon 4109T)

    The listed processors are included but not limited to the above list only.
  2. The following processors are not supported with ASHRAE Class A2, Class A3 and Class A4 specifications. The following processors are provided for special bid configuration only and need customer’s acceptance on the limitation consequence. The limitation includes experiencing power capping and a slight drop in performance when ambient is above 27°C.

    • 205W processor, 28-core or 24-core (Intel Xeon 8180, 8180M and 8168)

    • 200W processor, 18-core (Intel Xeon 6154)

    • 165W processor, 12-core (Intel Xeon 6146)

    • 150W processor, 24-core (Intel Xeon 8160T)

    • 150W processor, 8-core (Intel Xeon 6144)

    • 125W processor, 12-core (Intel Xeon 6126T)

    The listed processors are included but not limited to the above list only.
  3. The following PCIe adapters are not supported with ASHRAE Class A3 and Class A4 specifications:

    • Mellanox NIC with active optical cable

    • PCIe SSD

    • GPGPU card

    The listed PCIe adapters are included but not limited to the above list only.