Remove a processor and heat sink
This task has instructions for removing an assembled processor and heat sink, known as a processor-heat-sink module (PHM). This task requires a Torx T30 driver. This procedure must be executed by a trained technician.
About this task
Read Installation Guidelines to ensure that you work safely.
Power off the server and disconnect all power cords for this task.
Prevent exposure to static electricity, which might lead to system halt and loss of data, by keeping static-sensitive components in their static-protective packages until installation, and handling these devices with an electrostatic-discharge wrist strap or other grounding system.
If the server is in a rack, remove it from the rack.
Each processor socket must always contain a cover or a PHM. When removing or installing a PHM, protect empty processor sockets with a cover.
Do not touch the processor socket or processor contacts. Processor-socket contacts are very fragile and easily damaged. Contaminants on the processor contacts, such as oil from your skin, can cause connection failures.
Do not allow the thermal grease on the processor or heat sink to come in contact with anything. Contact with any surface can compromise the thermal grease, rendering it ineffective. Thermal grease can damage components, such as the electrical connectors in the processor socket.
Remove and install only one PHM at a time. If the system board supports multiple processors, install the PHMs starting with the first processor socket.Figure 1. Processor 1 and 2 location on the system boardFigure 2. Processor 3 and 4 location on the processor and memory expansion tray
|1 Heat sink||9 Clips to secure processor in carrier|
|2 Heat sink triangular mark||10 Carrier triangular mark|
|3 Processor identification label||11 Processor ejector handle|
|4 Nut and wire bail retainer||12 Processor heat spreader|
|5 Torx T30 nut||13 Thermal grease|
|6 Anti-tilt wire bail||14 Processor contacts|
|7 Processor carrier||15 Processor triangular mark|
|8 Clips to secure carrier to heat sink|
- Make preparations for this task.
- Remove the top cover. See Remove the top cover.
- Remove both PCIe riser cages or fillers, the chassis air baffle, and the PCIe expansion tray (see Remove a 4U PCIe riser cage, Remove the chassis air baffle, and Remove the 4U PCIe expansion tray).
- Remove the following components depending on the location of the processor that is to be removed:
- If the processor is located on the processor and memory expansion tray, do not remove the expansion tray.Figure 4. Removing the air baffle from the expansion tray
- If the processor is located on the system board:
Figure 5. Removing the expansion tray air baffle
- Remove one of the following components.
- System air baffle (see Remove the system board air baffle)
- Processor and memory expansion tray and expansion tray air baffle (see Remove the processor and memory expansion tray)
- Remove the expansion tray air baffle.
- Remove one of the following components.
- If the processor is located on the processor and memory expansion tray, do not remove the expansion tray.
- If the processor comes with a T-shaped heat sink, fully loosen the two heat sink screws as shown.Figure 6. Loosening T-shaped heat sink screws
- Remove the PHM from the system board.Figure 7. Removing a PHM
- Fully loosen the Torx T30 nuts on the PHM in the removal sequence shown on the heat-sink label.
- Rotate the anti-tilt wire bails inward.
- Carefully lift the PHM from the processor socket. If the PHM cannot be fully lifted out of the socket, further loosen the Torx T30 nuts and try lifting the PHM again.
Do not touch the contacts on the bottom of the processor.
Keep the processor socket clean from any object to prevent possible damages.
After you finish
Each processor socket must always contain a cover or a PHM. Protect empty processor sockets with a cover or install a new PHM.
If you are removing the PHM as part of a system board replacement, set the PHM aside.
If you are reusing the processor or heat sink, separate the processor from its retainer. See Separate the processor from carrier and heat sink
If you are instructed to return the defective component, please package the part to prevent any shipping damage. Reuse the packaging the new part arrived in and follow all packaging instructions.