Parts list
Identify each of the components that is available for your server with the parts list.
Go to Lenovo Data Center Support and navigate to the support page for your server.
Click .
Enter the serial number to view a listing of parts for your server.
It is highly recommended that you check the power summary data for your server using Lenovo Capacity Planner before purchasing any new parts.
T1: Tier 1 customer replaceable unit (CRU). Replacement of Tier 1 CRUs is your responsibility. If Lenovo installs a Tier 1 CRU at your request with no service agreement, you will be charged for the installation.
T2: Tier 2 customer replaceable unit (CRU). You may install a Tier 2 CRU yourself or request Lenovo to install it, at no additional charge, under the type of warranty service that is designated for your server.
F: Field replaceable unit (FRU). FRUs must be installed only by trained service technicians.
C: Consumable and Structural parts. Purchase and replacement of consumable and structural parts (components, such as a filler or bezel) is your responsibility. If Lenovo acquires or installs a structural component at your request, you will be charged for the service.
| Description | Type | Description | Type |
|---|---|---|---|
For more information about ordering parts:
| |||
| 1 Front top cover | T1 | 29 Lower processor board (MB) | F |
| 2 UPI module | T1 | 30 Fasteners kit | T1 |
| 3 Ethernet port assembly | T1 | 31 Front operator panel cage | C |
| 4 PCIe riser card | T2 | 32 Front operator panel | T1 |
| 5 Power interposer board | T2 | 33 Front operator panel bracket | C |
| 6 PCIe adapter | T1 | 34 Serial port assembly | T1 |
| 7 Cable management arm | T2 | 35 Support bracket | C |
| 8 Rear top cover | T1 | 36 SCM bracket | C |
| 9 OCP module | T1 | 37 Lower processor board (MB) bracket | C |
| 10 Power supply unit | T1 | 38 Chassis | F |
| 11 Fan module | T1 | 39 Upper processor board (CPU BD) | F |
| 12 OCP cage | T1 | 40 Security bezel | T1 |
| 13 Power distribution board | T2 | 41 2.5-inch drive filler (1-bay) | C |
| 14 Memory module | T1/F* | 42 2.5-inch hot-swap drive | T1 |
| 15 Interposer board | F | 43 2.5-inch drive backplane | T1 |
| 16 System I/O board | F | 44 2.5-inch drive cage | C |
| 17 Firmware and RoT security module | F | 45 E3.S drive cage | C |
| 18 System I/O board and interposer tray | C | 46 Flash power module | T1 |
| 19 Slide rail kit | T2 | 47 E3.S drive | T1 |
| 20 M.2 drive retainer | C | 48 MicroSD card | F |
| 21 M.2 drive | T1 | 49 CMOS battery (CR2032) | C |
| 22 M.2 boot adapter | T1 | 50 E3.S cable assembly | T1 |
| 23 EIA flange | C | 51 Intrusion switch | T1 |
| 24 External diagnostics handset | T1 | 52 Sideband card | T1 |
| 25 Lift handles | C | 53 Processor heat sink and processor carrier | F |
| 26 Processor | F | 54 Air baffle | T1 |
| 27 Cables | T1 | 55 Labels kit | T1 |
| 28 PSU filler | C | ||