Server features and specifications

The following information is a summary of the features and specifications of the server. Depending on the model, some features might not be available, or some specifications might not apply.

Microprocessor (depending on the model):

Supports up to two Intel Xeon E5-2600 v4 or Intel Xeon E5-2600 v3 series multi-core microprocessors (one installed)
Two QuickPath Interconnect (QPI) links speed up to 9.6 GT per second

Note

Use the Setup Utility program to determine the type and speed of the microprocessors.
For a list of supported microprocessors, see the Lenovo ServerProven website.
Read guidelines before installing or replacing the microprocessor. See Replacing a microprocessor and heat sink.

Memory (depending on the model):

Minimum: 8 GB
Maximum: 1.5 TB
- 768 GB using registered DIMMs (RDIMMs)
- 1.5 TB using load reduction DIMMs (LRDIMMs)
Type:
- PC4-19200 (DDR4-2400), operating speed depends on memory population
- Single-rank, dual-rank, or quad-rank
- Registered DIMM (RDIMM) or load reduced DIMM (LRDIMM)
Slots: 24 dual inline
Supports (depending on the model):
- 8 GB, 16 GB, and 32 GB RDIMMs
- 64 GB LRDIMMs

Note

If your server comes with 2400 MHz momory modules and a CPU that supports a maximum of 2133 MHz memory, the data rate of your memory modules will be limited to 2133 MHz.

Integrated functions:

Integrated management module 2.1 (IMM2.1), which consolidates multiple management functions in a single chip.
Broadcom BCM5719 Quad Port Gigabit Ethernet controller with Wake on LAN support
Up to six Universal Serial Bus (USB) connectors (depending on the model)
- Three USB 2.0 connectors on the front of the chassis
- Two USB 3.0 connectors on the rear of the chassis
- One internal USB 2.0 connector used for Hypervisor USB key
Four network ports (four 1 Gb Ethernet ports on the system)
Supports one optional ML2 network daughter card
One System Management RJ-45 on the rear to connect to a systems management network. This system management connector is dedicated to the IMM2.1 functions.
Optional serial port

Hard disk drive expansion bays (depending on the model):

2.5-inch models:
- Supports up to sixteen 2.5-inch simple-swap SAS/SATA hard disk drive bays.
- Supports up to twenty-six 2.5-inch hot-swap SAS/SATA hard disk drive bays.
3.5-inch models:
- Supports up to eight 3.5-inch simple-swap SAS/SATA hard disk drive bays.
- Supports up to fourteen 3.5-inch hot-swap and two 2.5-inch hot-swap SAS/SATA hard disk drive bays.

Attention

As a general consideration, do not mix standard 512-byte and advanced 4-KB format drives in the same RAID array because it may lead to potential performance issues.

SATA optical drives (optional):

DVD-ROM
Multi-burner

RAID controllers (depending on the model):

A ServeRAID M1215 SAS/SATA adapter that provides RAID 0, 1, and 10 with optional FoD RAID 5/50 and SED (Self Encrypting Drive) upgrade.
A ServeRAID M5210 SAS/SATA adapter that provides RAID 0, 1, and 10. Optional upgrade:
- RAID 5/50 (1 GB Cache) with optional FoD RAID 6/60 and SED upgrade
- RAID 5/50 (1 GB Flash) with optional FoD RAID 6/60 and SED upgrade
- RAID 5/50 (2 GB Flash) with optional FoD RAID 6/60 and SED upgrade
- RAID 5/50 (4 GB Flash) with optional FoD RAID 6/60 and SED upgrade
- FoD RAID 6/60 Upgrade
- FoD Zero Cache/RAID 5/50
- FoD Performance Accelerator
- FoD SSD Caching Enabler

Video controller (integrated into IMM2.1):

Matrox G200eR2
Note
The maximum video resolution is 1600 x 1200 at 75 Hz.
- SVGA compatible video controller
- DDR3 528 MHz SDRAM video memory controller
- Avocent Digital Video Compression
- 16 MB of video memory (not expandable)

Size (2U):

Height: 86.5 mm (3.406 inch)
Depth: EIA flange to rear - 755 mm (29.724 inch), Overall - 800 mm (31.496 inch)
Width: With top cover - 445.6 mm (17.543 inch), With EIA - 482.0 mm (18.976 inch)
Weight: approximately 28 kg (62 lb) to 34 kg (75 lb) depending upon configuration

PCI expansion slots:

Riser-card assembly 1

Type 1
- Slot 1: PCI Express 3.0 x8 (full-height, full-length)
- Slot 2: PCI Express 3.0 x8 (full-height, full-length)
- Slot 3: PCI Express 3.0 x8 (full-height, half-length)
Type 2
- Slot 1: PCI Express 3.0 x8 (full-height, full-length)
- Slot 2: PCI Express 3.0 x8 (full-height, full-length)
- Slot 3: ML2
Type 3
- Slot 1: PCI Express 3.0 x16 (full-height, full-length)
- Slot 2: Not available
- Slot 3: PCI Express 3.0 x8 (full-height, half-length)
Type 4
- Slot 1: PCI Express 3.0 x16 (full-height, full-length)
- Slot 2: Not available
- Slot 3: ML2

PCI expansion slots 4

Slot 4: PCI Express 3.0 x8 (low-profile)

PCI expansion slots 5

Slot 5: PCI Express 3.0 x16 (low-profile)

Riser-card assembly 2

Type 5
- Slot 6: PCI Express 3.0 x8 (full-height, full-length)
- Slot 7: PCI Express 3.0 x8 (full-height, full-length)
- Slot 8: PCI Express 3.0 x8 (full-height, half-length)
Type 6
- Slot 6: PCI Express 3.0 x16 (full-height, full-length)
- Slot 7: Not available
- Slot 8: PCI Express 3.0 x8 (full-height, half-length)

Electrical input:

Sine-wave AC input (50/60 Hz) required

For 550W/750W/900W AC Platinum power supplies:
- Input voltage low range:
  - Minimum: 100 Vac
  - Maximum: 127 Vac
- Input voltage high range:
  - Minimum: 200 Vac
  - Maximum: 240 Vac
For 750W/1300W Titanium and 1500W Platinum power supplies:
- Input voltage range:
  - Minimum: 200 Vac
  - Maximum: 240 Vac

DC input required

For 900W DC power supply
- Input voltage range:
  - Minimum: -48 Vdc
  - Maximum: -60 Vdc

Maximum Input kilovolt-amperes (kVA), approximately:

The Minimum Configuration: 0.093 kVA
The Maximum Configuration: 1.967 kVA

Note

Power consumption and heat output vary depending on the number and type of optional features installed and the power-management optional features in use.
The noise emission level stated is the declared (upper limit) sound power level, in bels, for a random sample of machines. All measurements are made in accordance with ISO 7779 and reported in conformance with ISO 9296. Actual sound-pressure levels in a given location might exceed the average values stated because of room reflections and other nearby noise sources. The noise emission level stated in the declared (upper limit) sound-power level, in bels, for a random sample of system.

Hot-swap fans:

Your server supports both single-rotor and dual-rotor fans.

One microprocessor: four single-rotor or dual-rotor hot-swap fans
Two microprocessors: six single-rotor or dual-rotor hot-swap fans

Note

Do not mix single-rotor and dual-rotor fans.
On the integrated management module (IMM) Web interface or the ipmitool program interface, the value of Fan xB Tach is only available for dual-rotor fans installed in your server. x represents the fan ID.

Power supply:

Up to two hot-swap power supplies for redundancy support
- 550-watt ac 80 PLUS Platinum
- 750-watt ac 80 PLUS Platinum
- 750-watt ac 80 PLUS Titanium
- 900-watt ac 80 PLUS Platinum
- 900-watt dc
- 1300-watt ac 80 PLUS Titanium
- 1500-watt ac 80 PLUS Platinum

Note

Power supplies and redundant power supplies in the server must be with the same power rating, wattage or level.
You may use the Power Configurator utility to determine current system power consumption. For more information and to download the utility, go to the IBM Power Configurator website.

Acoustical noise emissions:

Sound power, idling: 6.4 bels maximum
Sound power, operating: 6.6 bels maximum

Note

The noise emission level stated is the declared (upper limit) sound power level, in bels, for a random sample of machines. All measurements are made in accordance with ISO 7779 and reported in conformance with ISO 9296.
The PCIe options supported in this system vary greatly in function, power draw, and required cooling. Any increase in cooling required by these options will result in increased fan speed and produced sound power level. The actual sound pressure levels measured in your installation depend upon a variety of factors, including the number of racks in the installation; the size, materials, and configuration of the room; the noise levels from other equipment; the room ambient temperature and pressure, and employees' location in relation to the equipment.

Heat output:

Approximate heat output:

Minimum configuration: 525.45 Btu per hour (AC 154 watts)
Maximum configuration: 6667 Btu per hour (AC 1954 watts)

Environment:

The Lenovo System x3650 M5 compute node complies with ASHRAE class A3 specifications.

Power on:

Temperature: 5°C–40°C (41°F–104°F) up to 950 m (3117 ft). Above 950 m (3117 ft), de-rated maximum air temperature is 1°C (33.8°F) per 175 m (574 ft).
Humidity, non-condensing: -12°C dew point (10.4°F) and 8%–85% relative humidity.
Maximum dew point: 24°C (75°F)
Maximum altitude: 3050 m (10000 ft) and 5°C–28°C (41°F–82°F)
Maximum rate of temperature change: 5°C/hr (41°F/hr) for tape drive, 20°C/hr (68°F/hr) for HDDs

Power off:

Temperature: 5°C–45°C (41°F–113°F)
Relative humidity: 8%–85%
Maximum dew point: 27°C (80.6°F)

Storage (non-operating):

Temperature: 1°C–60°C (33.8°F–140°F)
Altitude: 3050 m (10000 ft)
Relative humidity: 5%–80%
Maximum dew point: 29°C (84.2°F)

Shipment (non-operating):

Temperature: -40°C–60°C (-40°F–140°F)
Altitude: 10,700 m (35105 ft)
Relative humidity: 5%–100%
Maximum dew point: 29°C (84.2°F)

Attention:

Design to ASHRAE Class A3, ambient of 40°C (104°F), with relaxed support:
- Support cloud like workload with no performance degradation acceptable (Turbo-Off).
- Under no circumstance, can any combination of worst case workload and configuration result in system shutdown or design exposure at 40°C (104°F).
Chassis is powered on.
A3 - Derate maximum allowable temperature 1°C (33.8°F) per 175 m (574 ft) above 950 m (3117 ft).
The minimum humidity level for class A3 is the higher (more moisture) of the -12°C (10.4°F) dew point and the 8% relative humidity. These intersect at approximately 25°C (77°F). Below this intersection (~25°C) the dew point (-12°C) represents the minimum moisture level, while above it relative humidity (8%) is the minimum.
Moisture levels lower than 0.5°C (32.9°F) dew point, but not lower -10°C (14°F) dew point or 8% relative humidity, can be accepted if appropriate control measures are implemented to limit the generation of static electricity on personnel and equipment in the data center. All personnel and mobile furnishings and equipment must be connected to ground via an appropriate static control system. The following items are considered the minimum requirements:
- Conductive materials (conductive flooring, conductive footwear on all personnel that go into the datacenter, all mobile furnishings and equipment will be made of conductive or static dissipative materials).
- During maintenance on any hardware, a properly functioning wrist strap must be used by any personnel who contacts IT equipment.
5°C/hr (41°F/hr) for data centers employing tape drives and 20°C/hr (68°F/hr) for data centers employing disk drives.
Chassis is removed from original shipping container and is installed but not in use, for example, during repair, maintenance, or upgrade.
The equipment acclimation period is 1 hour per 20°C (68°F/hr) of temperature change from the shipping environment to the operating environment.
Condensation is acceptable, but not rain.
When the ambient temperature is higher than 36°C (96.8°F), 135-watt and 145-watt microprocessors might face performance degradation when operating a heavy workload.

Your server supports the active graphics processing unit (GPU) only. To support the GPU, observe the following system requirements:

Chassis	GPU wattage	Ambient temperature	CPU wattage	Fan type
3.5-inch-drive chassis	Not exceed 240 watt	Not exceed 35°C (95°F)	No special requirement	Single-rotor
3.5-inch-drive chassis	Above 240 watt	Not exceed 30°C (86°F)	For 300-watt Intel Phi GPU (supported in 3.5-inch-drive chassis only), the CPU wattage must not exceed 120 watt.	Single-rotor
3.5-inch-drive chassis	Above 240 watt	Above 30°C (86°F)	No special requirement	Dual-rotor
2.5-inch-drive chassis	Not exceed 300 watt	Not exceed 35°C (95°F)	No special requirement	Single-rotor

The NVIDIA Quadro M6000 24GB GPU accelerator is supported only in eight 3.5-inch-drive or sixteen 2.5-inch-drive models. The ambient temperature must not exceed 27°C (80.6°F) and the redundant fan function is not supported due to thermal limitation.

To support IO accelerator adapters, observe the following requirements:

Chassis	Ambient temperature	Fan type
3.5-inch-drive chassis	Not exceed 30°C (86°F)	Single-rotor
3.5-inch-drive chassis	Above 30°C (86°F)	Dual-rotor
2.5-inch-drive chassis	Not exceed 35°C (95°F)	Single-rotor

If an ML2 card is installed, you must install a PCIe thermal kit for proper cooling. See Installing a PCIe thermal solution kit.

Particulate contamination: airborne particulates and reactive gases acting alone or in combination with other environmental factors such as humidity or temperature might pose a risk to the server. For information about the limits for particulates and gases, see Particulate contamination.

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