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Specifications

The following information is a summary of the features and specifications of the solution. Depending on the model, some features might not be available, or some specifications might not apply.

Enclosure specifications​

Table 1. Enclosure specifications
SpecificationDescription
Power supplySupports six hot-swap ac power supplies
  • 1300-watt ac
  • 1500-watt ac
  • 2000-watt ac
Important

  1. Power supplies and redundant power supplies in the enclosure must be with the same power rating, wattage or efficiency Level.

  2. Power supplies with 240 V dc are not hot-swappable. To remove the power cord, ensure you have turned off the server or disconnected the dc power sources at the breaker panel.

  3. In order for the ThinkSystem products to operate error free in both a DC or AC electrical environment, a TN-S earthing system which complies to 60364-1 IEC 2005 standard has to be present or installed.

Fan power control (FPC) module

  • Hot-swappable

Size6U enclosure
  • Height: 263.3 mm (10.37 inches)
  • Depth: 914.5 mm (36 inches)
  • Width: 447 mm (17.6 inches)
  • Weight:
    • Fully configured (stand-alone): approximately 135.5 kg (298 lbs)
    • Empty enclosure (with midplane, FPC, and cables): approximately 25 kg (55 lbs)
Acoustical noise emissions
  • Operation: 7.0 bels
  • Idle: 6.5 bels
Note

  • The following readings are worst case for the air cooling. The water cooling results would be significantly less.

  • The declared acoustic noise level are based on specified configurations and they may change depending on configuration/condition changes.

  • The declared acoustic noise levels may increase greatly, if high-power components are installed such as high-power NICs, high-power processors and GPUs.

Heat outputApproximate heat output:
  • Minimum configuration (with one minimal configuration tray): 433 BTU per hour (127 watts)
  • Maximum configuration (with six maximal configuration trays): 40946 BTU per hour (12000 watts)
Electrical input
  • Sine-wave input (50-60 Hz) required

  • Input voltage range:

    • Minimum: 200 V AC
    • Maximum: 240 V AC
Water requirement

  • Minimum water flow rate: 6.0 liters per minute per enclosure, assuming 1.0 lpm per compute tray with 6 trays per enclosure (1 tray consists of 2 compute nodes)

    • For processors below 205 W: 6.0 liters per minute per enclosure, assuming 1.0 lpm per compute tray with 6 trays per enclosure (1 tray consists of 2 compute nodes)

  • Maximum pressure: 4.4 bars

Note
The water required to initially fill the system side cooling loop must be reasonably clean, bacteria- free water (<100 CFU/ml) such as de-mineralized water, reverse osmosis water, de-ionized water, or distilled water. The water must be filtered with an in-line 50 micron filter (approximately 288 mesh). The water must be treated with anti-biological and anti-corrosion measures.

Tray specifications​

Table 2. Tray specifications
SpecificationDescription
SizeTray
  • Height: 41.0 mm (1.6 inches)
  • Depth: 742.0 mm (29.2 inches)
  • Width: 438.0 mm (17.25 inches)
  • Weight estimation: 17.2 kg (38 lb)
EnvironmentThe SD650 tray complies with ASHRAE class A2 specifications.
The SD650 tray is supported in the following environment:
  • Water Temperature:

    • Operating: ASHRAE class W4: 2 - 45°C (35.6 - 113°F)

      Note
      The SD650 tray supports up to 50°C for special configurations and for end-users with sufficient data center operating conditions.Consult your local Lenovo representative for more information.
  • Air temperature:

    • Operating: ASHRAE class A2: 10 - 35°C (50 - 95°F); when the altitude exceeds 900 m (2953 ft), the maximum ambient temperature value decreases by 1°C (1.8°F) with every 300 m (984 ft) of altitude increase.

    • Solution off: 5 - 45°C (41 - 113°F)

    • Shipping/storage: -40 - 60°C (-40 - 140°F)

  • Maximum altitude: 3048 m (10 000 ft)

  • Relative Humidity (non-condensing):

    • Operating:

      • ASHRAE Class A2: 8% - 80%, maximum dew point : 21°C (70°F)

    • Shipment/storage: 8% - 90%

  • Particulate contamination:

    Airborne particulates and reactive gases acting alone or in combination with other environmental factors such as humidity or temperature might pose a risk to the solution. For information about the limits for particulates and gases, see Particulate contamination.

Note
The solution is designed for standard data center environment and recommended to be placed in industrial data center.

Node specifications​

Table 3. Node specifications
SpecificationDescription
Processor (depending on the model)
  • Supports up to two Intel Xeon series multi-core processors per node (1 tray consists of 2 nodes)
  • Level-3 cache
Note
  1. Use the Setup utility to determine the type and speed of the processors in the node.
  2. For a list of supported processors, see Lenovo ServerProven website.

  3. With certain processors installed, if UEFI Boot Mode is set to Legacy then PXE Boot from the onboard Gigabit Ethernet port may not work as expected and is not supported. The affected processors are all processors with embedded Omni Path fabric. These are processors models that have an F at the end of the model name and include (but not limited to) the following processor models:

    • Intel Xeon Gold 6126F Processor

    • Intel Xeon Gold 6130F Processor

    • Intel Xeon Gold 6138F Processor

    • Intel Xeon Gold 6142F Processor

    • Intel Xeon Gold 6148F Processor

    • Intel Xeon Platinum 8160F Processor

    • Intel Xeon Platinum 8176F Processor

Memory

See Memory module installation rules and order for detailed information about memory configuration and setup.

  • Slots: 12 DIMM slots + 4 DC Persistent Memory Module (DCPMM) slots per node (1 tray consists of 2 nodes)

  • Minimum: 8 GB (single DDR4 DIMM per processor)

  • Maximum: 768 GB

    • 384 GB (12 x 32GB RDIMM)

    • 768 GB (12 x 64GB LRDIMM)

  • Maximum: 2.384 TB (4x 512GB (DCPMM + 12x 32GB RDIMM) in Memory Mode

  • Type:
    • PC4-21300 (dual-rank), 2933 MT/s, error correcting code (ECC), double-data-rate 4 (DDR4) registered DIMM (RDIMM) or load reduced DIMM (LRDIMM)

    • DC Persistent Memory Module (DCPMM)

  • Supports (depending on the model):
    • 8 GB, 16 GB, and 32 GB size DIMMs
    • 64 GB LRDIMM

    • 128 GB, 256 GB, and 512 GB DCPMM

Drive baysSupports up to two 2.5-inch simple-swap SATA/NVMe drive bays per node (1 tray consists of 2 nodes).
Attention
As a general consideration, do not mix standard 512-byte and advanced 4-KB format drives in the same RAID array because it might lead to potential performance issues.
Supports the following 2.5-inch simple-swap drive:

  • Two 2.5-inch 7mm SATA solid-state drives per node (1 tray consists of 2 nodes)

  • One 2.5-inch 15mm SATA/NVMe hard disk drive/solid-state drive per node (1 tray consists of 2 nodes)

M.2 drive/backplaneThinkSystem M.2 with Mirroring Enablement Kit contains dual M.2 backplane supports up to two identical M.2 drives.
Supports 2 different physical sizes of M.2 drives:

  • 42 mm (2242)

  • 80 mm (2280)

See Install an M.2 drive into the M.2 backplanefor supported M.2 drive configurations.

RAID
  • Software RAID supports for RAID levels 0 and 1 for SATA storages
  • Integrated on-board Hardware RAID supports for RAID levels 1 for M.2 SSD
Video controller (integrated into Lenovo XClarity Controller)
  • ASPEED
  • SVGA compatible video controller
  • Avocent Digital Video Compression
  • Video memory is not expandable
Note
Maximum video resolution is 1920 x 1200 at 60 Hz.
Input/Output (I/O) features

  • Front panel

  • KVM breakout cable connector

  • One STD USB 3.0 connector with Intel DCI feature

  • One 1GbE Ethernet connector with share-NIC feature for Lenovo XClarity Controller access

  • One 1GbE Ethernet connector dedicated for Lenovo XClarity Controller access

Operating systemsSupported and certified operating systems include:

  • Microsoft Windows Server

  • VMware ESXi

  • Red Hat Enterprise Linux

  • SUSE Linux Enterprise Server

References:
Minimum configuration for debugging

  • One n1200 Enclosure

  • One SD650 Dual Node DWC Tray (contains two computer nodes)

  • One processor on location 1 on specific node

  • One CFF v2 power supply (any type)

  • One DIMM (any type) on specific node

  • One disk (any type)(If OS is needed for debugging)

  • Particulate contamination
    Attention: Airborne particulates (including metal flakes or particles) and reactive gases acting alone or in combination with other environmental factors such as humidity or temperature might pose a risk to the device that is described in this document.