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Environmental specifications

Summary of the environmental specifications of the server. Depending on the model, some features might not be available, or some specifications might not apply.

Acoustical noise emissions​

Acoustical noise emissions

The server has the following acoustic noise emissions declaration:

Table 1. Acoustic noise emissions declaration
ScenarioUsed configurationSound power level (LWAd)Sound pressure level (LpAm):
IdlingOperatingIdlingOperating
Minimal

Two 150 W processors

Thirty two 64 GB RDIMMs

Eight SAS hard disk drives

RAID 440-16i CFF adapter

Intel X710-T2L 10GBASE-T 2-port OCP adapter

Two 750-watt power supply units

5.8 Bel6.4 Bel45 dBA50 dBA
Typical

Two 205 W processors

Thirty two 64 GB RDIMMs

Ten SAS hard disk drives

RAID 940-16i SFF adapter

Intel X710-T2L 10GBASE-T 2-port OCP adapter

Two 1100-watt power supply units

6.7 Bel7.7 Bel54 dBA61 dBA
Storage rich

Two 165 W processors

Thirty two 64 GB RDIMMs

12 SAS hard disk drives

RAID 940-16i SFF adapter

Intel X710-T2L 10GBASE-T 2-port OCP adapter

Two 750-watt power supply units

7.5 Bel7.6 Bel60 dBA61 dBA
GPU rich

Two 205 W processors

Thirty two 64 GB RDIMMs

Ten SAS hard disk drives

RAID 940-16i SFF adapter

Intel X710-T2L 10GBASE-T 2-port OCP adapter

Two 1100-watt power supply units

6.7 Bel8.3 Bel53 dBA68 dBA
Note

  • These sound power levels are measured in controlled acoustical environments according to procedures specified by ISO 7779 and are reported in accordance with ISO 9296.

  • The declared sound levels may change depending on configuration/conditions, for example, with high-power NICs, high-power processors and GPUs, such as ThinkSystem Mellanox ConnectX-6 HDR/200GbE QSFP56 1-port/2-port PCIe Adapter, ThinkSystem Broadcom 57454 10GBASE-T 4-port OCP Ethernet Adapter.

  • Government regulations (such as those prescribed by OSHA or European Community Directives) may govern noise level exposure in the workplace and may apply to you and your server installation. The actual sound pressure levels in your installation depend upon a variety of factors, including the number of racks in the installation; the size, materials, and configuration of the room; the noise levels from other equipment; the room ambient temperature, and employee's location in relation to the equipment. Further, compliance with such government regulations depends on a variety of additional factors, including the duration of employees' exposure and whether employees wear hearing protection. Lenovo recommends that you consult with qualified experts in this field to determine whether you are in compliance with the applicable regulations.

Ambient temperature management​

Ambient temperature management
The server is supported in the following environment:

  • Air temperature:

    • Operating:

      • ASHRAE class H1: 5–25°C (41–77°F); when the altitude exceeds 900 m (2953 ft), the maximum ambient temperature value decreases by 1°C (1.8°F) with every 500 m (1640 ft) of altitude increase.

      • ASHRAE class A2: 10–35°C (50–95°F); when the altitude exceeds 900 m (2953 ft), the maximum ambient temperature value decreases by 1°C (1.8°F) with every 300 m (984 ft) of altitude increase.

      • ASHRAE class A3: 5–40°C (41–104°F); when the altitude exceeds 900 m (2953 ft), the maximum ambient temperature value decreases by 1°C (1.8°F) with every 175 m (574 ft) of altitude increase.

      • ASHRAE class A4: 5–45°C (41–113°F); when the altitude exceeds 900 m (2953 ft), the maximum ambient temperature value decreases by 1°C (1.8°F) with every 125 m (410 ft) of altitude increase.

    • Server off: 5–45°C (41–113°F)

    • Shipping or storage: -40–60°C (-40–140°F)

  • Maximum altitude: 3050 m (10 000 ft)

  • Relative humidity (non-condensing):
    • Operating:

      • ASHRAE Class H1: 8%–80%, maximum dew point: 17°C (62.6°F)

      • ASHRAE Class A2: 8%–80%, maximum dew point: 21°C (70°F)

      • ASHRAE Class A3: 8%–85%, maximum dew point: 24°C (75°F)

      • ASHRAE Class A4: 8%–90%, maximum dew point: 24°C (75°F)

    • Shipment or storage: 8%–90%

  • Particulate contamination

    Attention
    Airborne particulates and reactive gases acting alone or in combination with other environmental factors such as humidity or temperature might pose a risk to the server. For information about the limits for particulates and gases, see Particulate contamination.

Environment​

Environment
ThinkSystem SR630 V3 complies with ASHRAE Class A2 specifications. System performance may be affected when operating temperature is outside of AHSARE A2 specification.
  • Air temperature:
    • Operating
      • ASHARE Class A2: 10°C to 35°C (50°F to 95°F); the maximum ambient temperature decreases by 1°C for every 300 m (984 ft) increase in altitude above 900 m (2,953 ft).
    • Server off: 5°C to 45°C (41°F to 113°F)
    • Shipment/storage: -40°C to 60°C (-40°F to 140°F)
  • Maximum altitude: 3,050 m (10,000 ft)
  • Relative Humidity (non-condensing):
    • Operating
      • ASHRAE Class A2: 8% to 80%; maximum dew point: 21°C (70°F)
    • Shipment/storage: 8% to 90%
  • Particulate contamination
    Attention
    Airborne particulates and reactive gases acting alone or in combination with other environmental factors such as humidity or temperature might pose a risk to the server. For information about the limits for particulates and gases, see Particulate contamination.
Note

The server is designed for standard data center environment and recommended to be placed in industrial data centers.

When the ambient temperature is greater than the supported max temperature (ASHARE A4 45°C), the server will shut down. The server will not power on again until the ambient temperature falls within the supported temperature range.

Depending on hardware configurations, the server complies with ASHRAE Class H1, A2, A3, or A4 specifications with certain thermal restrictions. System performance may be impacted when operating temperature is out of permitted conditions.

The restrictions to ASHRAE support are as follows (cooling by air or Liquid to Air Module (L2AM)) :

  • The ambient temperature must be no more than 25°C if your server meets the following conditions when installing:

    • 300 W ≤ TDP ≤ 350 W

    • L2AM

    • ThinkSystem 128GB TruDDR5 4800MHz (4Rx4) 3DS RDIMM v1, ThinkSystem 128GB TruDDR5 4800MHz (4Rx4) 3DS RDIMM v2, ThinkSystem 128GB TruDDR5 5600MHz (4Rx4) 3DS RDIMM or ThinkSystem 128GB TruDDR5 5600MHz (2Rx4) RDIMM with L2AM

    • ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM v1 and standard or performance heat sinks, and 4 x 2.5'' backplane or no backplane

  • The ambient temperature must be no more than 30°C if your server meets any of the following conditions when installing:

    • 205 W < TDP ≤ 350 W

    • Any rear 2.5-inch NVMe drive

    • A2/L4 GPU on the rear

    • Any ConnectX-6/ConnectX-7 adapters with the AOC transceiver

    • Parts with AOC transceivers and the rate is greater than 25 GB

    • 205 W < TDP < 300 W with the L2AM

    • ThinkSystem 128GB TruDDR5 4800MHz (4Rx4) 3DS RDIMM v1, ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM v2 with standard or performance heat sinks

  • The ambient temperature must be no more than 35°C if your server meets any of the following conditions when installing:

    • 165 W < TDP ≤ 205 W

    • ThinkSystem 128GB TruDDR5 4800MHz (4Rx4) 3DS RDIMM v2, ThinkSystem 128GB TruDDR5 5600MHz (4Rx4) 3DS RDIMM, or ThinkSystem 96GB TruDDR5 5600MHz (2Rx4) 10x4 RDIMM

    • Any front NVMe drive or rear NVMe AIC SSD

    • Any 7mm boot drive

    • Any M.2 NVMe drive

    • Any rear 2.5-inch SAS/SATA drive

    • ThinkSystem Broadcom 57454 10GBASE-T 4-port OCP/ Broadcom 57416 10GBASE-T 2-port OCP

    • PCIe network interface cards (NICs) and OCP modules at a rate greater than or equal to 100 GB

    • Parts with AOC transceivers and at the rate of 25 GB

    • TDP ≤ 205 W with the L2AM

    • A2/L4 GPU on the front

  • The ambient temperature must be no more than 45°C if the processor TDP is equal to or smaller than 185 W.

The restrictions to ASHRAE support are as follows (cooling by Direct Water Cooling Module (DWCM)) :

  • The ambient temperature must be no more than 25°C if your server meets the following conditions when installing:

    • TDP ≤ 350

    • DWCM

    • ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM v1 but except for 4 x 2.5'' backplane or no backplane

  • The ambient temperature must be no more than 30°C if your server meets the following conditions when installing:

    • TDP ≤ 350

    • DWCM

    • Standard fans

    • Any ConnectX-6/ConnectX-7 adapters with the AOC transceiver

  • The ambient temperature must be no more than 35°C if your server meets the following conditions when installing:

    • TDP ≤ 350

    • DWCM

    • A2/L4 GPU and performance fans

    • Any ConnectX-6/ConnectX-7 adapters with the AOC transceiver

    • ThinkSystem 128GB TruDDR5 4800MHz (4Rx4) 3DS RDIMM v1 or ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM v2 with performance fans

    • ThinkSystem 128GB TruDDR5 4800MHz (4Rx4) 3DS RDIMM v2 or ThinkSystem 128GB TruDDR5 5600MHz (4Rx4) 3DS RDIMM with DWCM

    • ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM v1 and 4 x 2.5'' backplane or no backplane

Note
For more thermal information about 128/256 GB RDIMMs, see Thermal rules for 128/256 GB RDIMMs.

Water requirements​

Water requirements
ThinkSystem SR630 V3 is supported in the following environment:

  • Maximum pressure: 3 bars

  • Water inlet temperature and flow rates:
    Water inlet temperatureWater flow rate
    50°C (122°F)1.5 liters per minute (lpm) per server
    45°C (113°F)1 liter per minute (lpm) per server
    40°C (104°F) or lower0.5 liters per minute (lpm) per server
Note
The water required to initially fill the system side cooling loop must be reasonably clean, bacteria-free water (<100 CFU/ml) such as de-mineralized water, reverse osmosis water, de-ionized water, or distilled water. The water must be filtered with an in-line 50 micron filter (approximately 288 mesh). The water must be treated with anti-biological and anti-corrosion measures.
  • Particulate contamination
    Attention: Airborne particulates (including metal flakes or particles) and reactive gases acting alone or in combination with other environmental factors such as humidity or temperature might pose a risk to the device that is described in this document.