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Thermal rules

This topic provides thermal rules for the server.

Server models with front drive bays only​

This section provides thermal information for server models with front drive bays only.

Configuration

  • 4 x 2.5'' SAS/SATA

  • 4 x 2.5'' NVMe

  • 4 x 2.5'' AnyBay

  • 4 x 3.5'' SAS/SATA

  • 4 x 3.5'' AnyBay

  • 6 x SAS/SATA + 2 x AnyBay + 2 x NVMe

  • 6 x SAS/SATA + 4 x AnyBay

  • 8 x 2.5'' SAS/SATA

  • 10 x 2.5'' SAS/SATA

  • 4 x 2.5'' SAS/SATA

  • 4 x 2.5'' NVMe

  • 4 x 2.5'' AnyBay

Max. Ambient Temp. (at sea level)45°C35°C30°C
CPU TDP1 (watts)TDP ≤ 165165 < TDP < 205TDP = 205205 < TDP ≤ 300300 < TDP ≤ 350
Heat sinkStandardStandardT-shapeT-shapeT-shape
Air baffle√√xxx
Fan typeStandardPerformancePerformancePerformancePerformance
Max. DIMM Qty.23232323232
Configuration

  • 8 x 2.5'' AnyBay drives with one processor

  • 8 x 2.5'' U.2 drives with one processor

  • 10 x 2.5'' AnyBay

  • 10 x 2.5'' NVMe

  • 16-EDSFF

Max. Ambient Temp. (at sea level)35°C30°C
CPU TDP1 (watts)TDP ≤ 165165 < TDP < 205TDP = 205205 < TDP ≤ 300
Heat sinkStandardStandardT-shapeT-shape
Air baffle√√xx
Fan typePerformancePerformancePerformancePerformance
Max. DIMM Qty.232323232
Note

  1. TDP, short for Thermal Design Power. When processor 5515+ - 165W, 6534 -195W and 6434/6434H - 195W installed, use the T-shape heat sink and performance fans.

  2. When a 256 GB 3DS RDIMM is installed, the ambient temperature must be limited to 30°C or lower and performance fans are required.

Server models with front and rear drive bays​

This section provides thermal information for server models with front and rear drive bays.

Configuration

  • 4 x 2.5'' SAS/SATA

  • 4 x 2.5'' NVMe

  • 4 x 2.5'' AnyBay

  • 4 x 3.5'' SAS/SATA

  • 4 x 3.5'' AnyBay

  • 6 x SAS/SATA + 2 x AnyBay + 2 x NVMe

  • 6 x SAS/SATA + 4 x AnyBay

  • 8 x 2.5'' SAS/SATA

  • 8 x 2.5'' AnyBay drives with one processor

  • 8 x 2.5'' U.2 drives with one processor

  • 10 x 2.5'' SAS/SATA

  • 10 x 2.5'' AnyBay

  • 10 x 2.5'' NVMe

  • Rear 2 x 2.5'' SAS/SATA1

  • Rear 2 x 2.5'' U.21

  • Rear 2 x 2.5'' U.31

Max. Ambient Temp. (at sea level)

35°C with rear SAS/SATA drives

30°C with rear U.2/U.3 drives

CPU TDP2 (watts)TDP ≤ 165165 < TDP < 205TDP = 205
Heat sinkStandardStandardT-shape
Air baffle√√x
Fan typePerformancePerformancePerformance
Max. DIMM Qty.3323232
Note

  1. In the configuration of 10 x 2.5'' AnyBay or 10 x 2.5'' NVMe, rear U.2 or U.3 is supported, but rear SAS/SATA is not supported.

  2. TDP, short for Thermal Design Power. When processor 5515+ - 165W, 6534 -195W and 6434/6434H - 195W installed, use the T-shape heat sink and performance fans.

  3. The 256 GB 3DS RDIMMs are not supported.

Server models with GPU(s)​

This section provides thermal information for server models with GPUs.

GPUs supported: A2 and L4 GPU
Configuration

  • 4 x 2.5'' SAS/SATA

  • 4 x 2.5'' NVMe

  • 4 x 2.5'' AnyBay

  • 4 x 3.5'' SAS/SATA

  • 4 x 3.5'' AnyBay

  • 6 x SAS/SATA + 2 x AnyBay + 2 x NVMe

  • 6 x SAS/SATA + 4 x AnyBay

  • 8 x 2.5'' SAS/SATA

  • 8 x 2.5'' AnyBay drives with one processor

  • 8 x 2.5'' U.2 drives with one processor

  • 10 x 2.5'' SAS/SATA

  • 10 x 2.5'' AnyBay

  • 10 x 2.5'' NVMe

  • 4 x 2.5'' SAS/SATA

  • 4 x 2.5'' NVMe

  • 4 x 2.5'' AnyBay

Max. Ambient Temp. (at sea level)30°C
CPU TDPNote (watts)TDP ≤ 165165 < TDP < 205TDP = 205205 < TDP ≤ 250250 < TDP ≤ 300
Heat sinkStandardStandardT-shapeT-shapeT-shape
Air baffle√√xxx
Fan typePerformancePerformancePerformancePerformancePerformance
Max GPU Qty33333
Max. DIMM Qty.3232323232
Note

TDP, short for Thermal Design Power. When processor 5515+ - 165W, 6534 -195W and 6434/6434H - 195W installed, use the T-shape heat sink and performance fans.

Server models with liquid to air module​

This section provides thermal information for server models installed with the Liquid to Air Module (L2AM).

Configuration1

  • 4 x 2.5'' SAS/SATA2

  • 4 x 2.5'' NVMe2

  • 4 x 2.5'' AnyBay2

  • 6 x SAS/SATA + 2 x AnyBay + 2 x NVMe

  • 6 x SAS/SATA + 4 x AnyBay

  • 8 x 2.5'' SAS/SATA

  • 8 x 2.5'' U.2 drives with one processor

  • 10 x 2.5'' SAS/SATA

  • 10 x 2.5'' NVMe

  • 10 x 2.5'' AnyBay

  • 4 x 2.5'' SAS/SATA2

  • 4 x 2.5'' NVMe2

  • 4 x 2.5'' AnyBay2

Max. Ambient Temp. (at sea level)35°C30°C25°C
CPU TDP (watts)TDP ≤ 205205 < TDP < 300

  • 300 ≤ TDP ≤ 350

  • Processor 6458Q 350W

  • Processor 6558Q 350W

Processor 8470Q 350W
Heat sinkLiquid to Air Module (L2AM)
Air bafflex
Fan typePerformance
Max. DIMM Qty.332
Note

  1. The server models installed with L2AM do not support rear drives or GPUs.

  2. The server models installed with L2AM do not support 4 x 2.5'' front drives with front riser assembly.

  3. The 256 GB 3DS RDIMMs are not supported.

Server models with direct water cooling module​

This section provides thermal information for server models installed with the Direct Water Cooling Module (DWCM).

Configuration

  • 4 x 2.5'' SAS/SATA

  • 4 x 2.5'' NVMe

  • 4 x 2.5'' AnyBay

  • 4 x 3.5'' SAS/SATA

  • 4 x 3.5'' AnyBay

  • 6 x SAS/SATA + 2 x AnyBay + 2 x NVMe

  • 6 x SAS/SATA + 4 x AnyBay

  • 8 x 2.5'' SAS/SATA

  • 8 x 2.5'' AnyBay drives with one processor

  • 8 x 2.5'' U.2 drives with one processor

  • 10 x 2.5'' SAS/SATA

  • 10 x 2.5'' AnyBay

  • 10 x 2.5'' NVMe

  • 16-EDSFF

CPU TDP (watts)TDP ≤ 350

Processor 6458Q/6558Q/8470Q 350W

8593Q1 385W

Max. Ambient Temp. (at sea level)35°C35°C
Max. Coolant inlet Temp. (at sea level)50°C45°C
Heat sinkDirect Water Cooling Module (DWCM)
Air bafflex
Fan typeStandard1,2,3
Max GPU Qty2
Max. DIMM Qty.32
Note

  1. The default fan type for server models with DWCM is standard fan. Use performance fans when the server is installed with 8593Q processors, 256 GB 3DS RDIMMs, A2 or L4 GPU.

  2. When the server is installed with any ConnectX-6/ConnectX-7 adapters with the AOC transceiver:

    • With standard fans, the ambient temperature must be limited to 30°C or lower.

    • With performance fans, the ambient temperature must be limited to 35°C or lower.

  3. When the server has the DWCM and only one processor installed, use standard fans. Other conditions with one processor installed, use performance fans.

Thermal rules for 128/256 GB RDIMMs​

The section provides a side-by-side comparison among below RDIMMs, and their thermal limitations. For more information, see Environment.

  • ThinkSystem 128GB TruDDR5 4800MHz (4Rx4) 3DS RDIMM v1

  • ThinkSystem 128GB TruDDR5 4800MHz (4Rx4) 3DS RDIMM v2

  • ThinkSystem 128GB TruDDR5 5600MHz (4Rx4) 3DS RDIMM

  • ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM v1

  • ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM v2

  • ThinkSystem 128GB TruDDR5 5600MHz (2Rx4) RDIMM

DIMM typeFan typeMax. Ambient TempRear drives and GPUs support

ThinkSystem 128GB TruDDR5 4800MHz (4Rx4) 3DS RDIMM v2

ThinkSystem 128GB TruDDR5 5600MHz (4Rx4) 3DS RDIMM

Standard35°C with standard or performance heat sinks

  • 25°C with L2AM

  • 35°C with DWCM

  • 7mm boot drive

  • Rear 2 x 2.5'' drives

  • Front and rear GPUs

ThinkSystem 128GB TruDDR5 4800MHz (4Rx4) 3DS RDIMM v1

ThinkSystem 128GB TruDDR5 5600MHz (2Rx4) RDIMM

Performance30°C with standard or performance heat sinks

  • 7mm boot drive

  • Front GPUs

ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM v2

  • Does not support L2AM

  • 35°C with DWCM

  • 7mm boot drive

  • Front and rear GPUs

ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM v125°C with standard or performance heat sinks, and 4 x 2.5'' backplane or no backplane installed

  • Does not support L2AM

  • 35°C with DWCM and 4 x 2.5'' backplane or no backplane installed

  • 7mm boot drive

  • Front GPUs

25°C with DWCM but except for 4 x 2.5'' backplane or no backplane installed

7mm boot drive

Note
Table 1. Thermal rules for mixing 4800MHz 128 GB and 256 GB RDIMMs
RDIMMsMixing withFollow rules for
ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM v1ThinkSystem 128GB TruDDR5 4800MHz (4Rx4) 3DS RDIMM v1ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM v1
ThinkSystem 128GB TruDDR5 4800MHz (4Rx4) 3DS RDIMM v2
ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM v2
ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM v2ThinkSystem 128GB TruDDR5 4800MHz (4Rx4) 3DS RDIMM v1ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM v2
ThinkSystem 128GB TruDDR5 4800MHz (4Rx4) 3DS RDIMM v2

Power-supply-unit air baffle application​

Refer to the table to identify if the configuration requires a power-supply-unit air baffle.
ScenariosSpecificationsPower-supply-unit air baffle
Max. Ambient Temp and CPU TDP (watts)35°C and TDP ≤ 150x

  • 40°C – 45°C and TDP ≤ 150

  • TDP > 150

√
Models installed with:

  • Performance heat sink

  • L2AM

  • DWCM

  • Models with only one processor

x
Use performance fans when your server is installed with any of the following adapters:

  • ThinkSystem Broadcom 57454 10GBASE-T 4-port OCP Ethernet Adapter

  • ThinkSystem Broadcom 57508 100GbE QSFP56 2-Port OCP Ethernet Adapter

  • ThinkSystem Broadcom 57508 100GbE QSFP56 2-port PCIe 4 Ethernet Adapter

Use performance fans and the ambient temperature must be limited to 30°C or lower when your server is installed with any of the following adapters:
Note
The ambient temperature must be limited to 30°C or lower when 100/200 GB NIC adapters with active transceivers and fiber cables installed; and 35°C or lower when the adapters use passive copper cables.

  • ThinkSystem Broadcom 57508 100GbE QSFP56 2-port PCIe 4 Ethernet Adapter V2 with Active Fiber cables

  • ThinkSystem Mellanox ConnectX-6 HDR100 IB/100GbE VPI 1-port x16 PCIe 3.0 HCA

  • ThinkSystem Mellanox ConnectX-6 HDR100 IB/100GbE VPI 2-port x16 PCIe 3.0 HCA

  • ThinkSystem Mellanox ConnectX-6 HDR IB/200GbE Single Port x16 PCIe Adapter

  • ThinkSystem Mellanox ConnectX-6 Dx 100GbE QSFP56 2-port PCIe Ethernet Adapter

  • ThinkSystem Mellanox ConnectX-6 Dx 100GbE QSFP56 1-port PCIe Ethernet Adapter

  • ThinkSystem NVIDIA ConnectX-7 NDR400 OSFP 1-port PCIe Gen5 Adapter

  • ThinkSystem Nvidia ConnectX-7 NDR200/HDR QSFP112 2-port PCIe Gen5 x16 InfiniBand Adapter