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Removing and replacing the system-board assembly

Use this information to remove and replace the system-board assembly.

Note
  • This procedure should be performed only by trained service technicians.
  • If possible, back up all compute node settings, including the settings for any options installed in the compute node. You can backup and restore system settings using the Advanced Setup Utility (ASU) (see Advanced Settings Utility (ASU) for Lenovo x86 servers website for information and instructions).
Before you replace the system-board assembly, complete the following steps:
  1. Read Safety and Installation guidelines.
  2. If the compute node is installed in a chassis, remove it (see Removing a compute node from a chassis for instructions).
  3. Carefully lay the replacement system-board assembly (system board FRU) and the defective system-board assembly (defective node) side-by-side on a flat, static-protective surface.
  4. Obtain the following for use during the replacement procedure (see Parts listing, Types 9532 and 2951).
    • Alcohol wipes
    • Thermal grease
Important
When you replace the system-board assembly, you must update the compute node with the latest firmware or restore the preexisting firmware. Make sure that you have the latest firmware or a copy of the preexisting firmware before you proceed. See Updating firmware and device drivers for more information.

See System-board layouts for more information about the locations of the connectors, switches, and LEDs on the system board.

To remove and replace the system-board assembly, complete the following steps:

Important
To avoid damage when replacing a defective system-board assembly, transfer internal components between the defective system-board assembly and the replacement system-board assembly one at a time. Unless otherwise noted, install each internal component in the replacement system-board assembly immediately after removing it from the defective system-board assembly.

  1. Remove any storage drives, optional drive components, and hard disk drive bay fillers from the defective system-board assembly and set them aside on a static-protective surface. (see Removing a hot-swap hard disk drive, Removing a 1.8-inch solid state drive, or Removing a solid state drive mounting sleeve).
  2. Remove the storage drive bezel from the defective system-board assembly and immediately install it on the replacement system-board assembly (see Removing the bezel and Installing the bezel).
  3. Remove the covers from both compute nodes (see Removing the compute node cover). Keep the cover that comes with the replacement system-board assembly for reference and re-install it on the defective system-board assembly prior to returning the defective system-board assembly.
  4. If a ServeRAID controller is installed in the defective system-board assembly, remove it and set it aside on a static-protective surface. (see Removing a ServeRAID M5215 controller).
    Important
    If you are installing a hard disk drive backplane that uses a solid state drive mounting sleeve, remove the mounting sleeve before you remove the backplane and install the backplane before you install the mounting sleeve.
  5. Remove hard disk drive backplane from the defective system-board assembly and immediately install it in the replacement system-board assembly (see Removing a hard disk drive backplane and Installing a hard disk drive backplane).
    Note
    • Install storage drives and solid state drive mounting sleeves in the same bay locations as from which they were removed.
    • Solid state drive mounting sleeves can be moved without removing the solid state drives inside of them.
  6. Install any removed storage drives, optional drive components, and hard disk drive bay fillers into the replacement system-board assembly (see Installing a hot-swap hard disk drive, Installing a solid state drive mounting sleeve, or Installing a 1.8-inch solid state drive)
  7. Remove the DIMM air baffles from defective system-board assembly and set them aside.
    Attention
    • Remove and install only one microprocessor at a time.
    • When removing or installing a microprocessor, protect the other microprocessor socket with a microprocessor heat sink filler.
    • When transferring a microprocessor to a replacement system-board assembly, install the microprocessor heat sink filler in the defective system-board assembly immediately after installing the microprocessor in the replacement system-board assembly.
  8. Transfer microprocessor 1 (rear microprocessor) and its heat sink from the defective system-board assembly to the replacement system-board assembly. Use the microprocessor installation tool that comes with the replacement system-board assembly to remove the microprocessor from the defective system-board assembly and install it immediately in the replacement system-board assembly.
    1. Remove the heat sink from the microprocessor on the defective system-board assembly and set it aside, thermal material side up, on a static-protective surface.
      Attention
      Do not touch the thermal material on the bottom of the heat sink. Touching the thermal material will contaminate it. If the thermal material becomes contaminated, see Thermal grease.
      Important
      The heat sinks for microprocessor 1 and microprocessor 2 are not interchangeable. If both heat sinks are being removed, label them so that they can be reinstalled on the correct microprocessor.
      1. Use a 5 mm (3/16-inch) nut driver to loosen the screw on one side of the heat sink to break the seal with the microprocessor.
      2. Use a 5 mm (3/16-inch) nut driver to loosen the screws on the heat sink, rotating each screw two full turns until each screw is loose.
      3. Gently pull the heat sink from the microprocessor.
    2. Open the microprocessor socket release levers and retainer on the defective system-board assembly.
      Attention
      Do not use any tools or sharp objects to lift the release levers on the microprocessor socket. Doing so might result in permanent damage to the system board.

      Graphic illustrating the microprocessor and retainer
      1. Identify which release lever is labeled as the first release lever to open (labeled on the microprocessor-retention assembly) and open it.
      2. Open the second release lever on the microprocessor socket.
      3. Open the microprocessor retainer.
    3. Remove the heat-sink filler on the replacement system-board assembly and set it aside.
      Attention
      Do not use any tools or sharp objects to lift the release levers on the microprocessor socket. Doing so might result in permanent damage to the system board.
    4. Open the microprocessor socket release levers and retainer on the replacement system-board assembly.

      Graphic illustrating the microprocessor socket and retainer
      1. Identify which release lever is labeled as the first release lever to open (labeled on the microprocessor-retention assembly) and open it.
      2. Open the second release lever on the microprocessor socket.
      3. Open the microprocessor retainer.
    5. Using the microprocessor installation tool, remove the microprocessor from the socket on the defective system-board assembly.
      Attention
      • Dropping the microprocessor during installation or removal can damage the contacts.
      • Do not touch the connectors on the microprocessor and the microprocessor socket; handle the microprocessor by the edges only. Contaminants on the microprocessor contacts, such as oil from your skin, can cause connection failures between the contacts and the socket.
      1. Select the empty installation tool and make sure that the handle is in the open position.

        If the installation tool handle is not in the open position: 1) lift the interlock latch and hold it up while you 2) twist the microprocessor installation tool handle counterclockwise to the open position, and then release the interlock latch. The following illustration of the installation tool shows the location of the interlock latch and counterclockwise rotation of the handle before loading the microprocessor.


        Illustration of the installation tool
      2. Align the installation tool with the screws, as shown in the following graphic, and lower the installation tool on the microprocessor. The installation tool rests flush on the socket only when it is aligned correctly.
        Illustration of installation tool placement
      3. Gently twist the handle of the installation tool clockwise until it locks in the H or L position, depending on the size of microprocessor; then, lift the microprocessor out of the socket.
        Graphic illustrating installation tool use

        Graphic illustrating microprocessor removal
    6. Install the microprocessor in the microprocessor socket on the replacement system-board assembly.
      Attention
      Do not press the microprocessor into the socket.
      1. Align the installation tool with the microprocessor socket on the replacement system-board assembly. The installation tool rests flush on the socket only if it is properly aligned.
        Graphic illustrating installation tool placement
      2. Twist the handle of the installation tool assembly counterclockwise until the microprocessor is inserted into the socket, and lift the installation tool out of the socket.
        Graphic illustrating microprocessor insertion

        The following illustration shows the installation tool handle in the open position, ready for tool removal.


        Installation tool in the open position

        The following illustration shows removing the installation tool handle.


        Installation tool removal
    7. Close the microprocessor socket release retainer and levers on the replacement system-board assembly.
      Attention
      Make sure that the microprocessor is aligned correctly in the socket before you try to close the microprocessor retainer.

      Graphic illustrating the microprocessor and retainer
      1. Close the microprocessor retainer on the microprocessor socket.
      2. Identify which release lever is labeled as the first release lever to close (labeled on the microprocessor-retention assembly) and close it.
      3. Close the second release lever on the microprocessor socket.
    8. Close the microprocessor socket release retainer and levers on the defective system-board assembly.

      Graphic illustrating the microprocessor and retainer
      1. Close the microprocessor retainer on the microprocessor socket.
      2. Identify which release lever is labeled as the first release lever to close (labeled on the microprocessor-retention assembly) and close it.
      3. Close the second release lever on the microprocessor socket.
    9. Install the heat-sink filler that you removed from the replacement system-board assembly on the defective system-board assembly.
    10. Install the heat-sink that you removed from the defective system-board assembly on the replacement system-board assembly.
      Attention
      Do not touch the thermal material on the bottom of the heat sink. Touching the thermal material will contaminate it. If the thermal material becomes contaminated, see Thermal grease.
      Important
      The heat sinks for microprocessor 1 and microprocessor 2 are not interchangeable. Make sure that you install each heat sink on the correct microprocessor. The shorter heat sink installs on microprocessor 2 and the taller heat sink installs on microprocessor 1.
      1. Make sure that the thermal material is still on the bottom of the heat sink and on the top of the microprocessor.
      2. Position the heat sink over the microprocessor. The a notch on the heat sink is keyed to a tab on the light path diagnostics panel to assist with proper alignment.
      3. Align and place the heat sink on top of the microprocessor in the retention bracket, thermal material side down.
      4. Press firmly on the heat sink.
      5. Align the screws on the heat sink with the holes on the heat-sink retention module.
      6. Using a 5 mm (3/16-inch) nut driver, start the first captive screw, as shown on the heat sink label, and tighten it two full revolutions; then, press down on the opposite corner of the heat sink with your finger and tighten the captive screw in that corner two full revolutions.
      7. Press firmly on each of the captive screws and tighten them with a 5 mm (3/16-inch) nut driver, alternating among the screws, as shown on the heat sink label, until they are tight. If possible, each screw should be rotated two full rotations at a time. Repeat until the screws are tight. Do not overtighten the screws by using excessive force. If you are using a torque wrench, tighten the screws to 8 inch-pounds (in-lb) to 10 in-lb (0.9 Newton-meters (Nm) to 1.13 Nm). Refer to the label on the heat sink for more information.
  9. Repeat the previous step for microprocessor 2 (front microprocessor), if one is installed.
  10. Remove all of the installed components in the following list from the defective system-board assembly; then, immediately install them on the replacement system-board assembly:
  11. If a ServeRAID controller was removed from the defective system-board assembly, install it in the replacement system-board assembly (see Installing a ServeRAID M5215 controller).
  12. Install the DIMM air baffles in the replacement system-board assembly. The DIMM air baffles are required to maintain system cooling.
    Note
    Retaining clips on the DIMM connectors must be in the closed position to install the air baffles.
  13. Install the cover that you removed from the original (defective) system-board assembly onto the replacement system-board assembly (see Installing the compute node cover for instructions).
    Important
    The heat sink fillers protect the microprocessor socket from potential damage during shipping.
  14. Make sure that both microprocessor sockets on defective system-board assembly have heat sink fillers installed; then, install the cover that came with the replacement system-board assembly onto the defective system-board assembly (see Installing the compute node cover for instructions).
    Note
    Retention clips that secure the I/O expansion adapters must be in the closed position to install the cover.
  15. If a blank ID label plate is on the replacement system-board assembly, remove it and discard (see Removing the ID label plate).
  16. Remove the ID label plate that has machine type and serial number information from the front panel of the defective system-board assembly and immediately install it on the replacement system-board assembly (see Removing the ID label plate and Installing the ID label plate).
    Note
    If your compute node has an RFID tag, it is already attached to the ID label plate.
  17. The replacement system-board assembly comes with a Repair Identification (RID) tag. Using a fine tip indelible ink pen, transfer the machine type and serial number from the defective system-board assembly to the label on the Repair Identification tag; then, place the tag in the recessed area 1 on the bottom of replacement system-board assembly.

    Repair Identification (RID) tag

After you transfer components to the replacement system-board assembly, complete the following steps:

  1. Install the compute node in the chassis (see Installing a compute node in a chassis for instructions).
  2. Use the CMM Web Interface to restore the IP address of the compute node IMM. See Starting web interface for more information.
    Note
    If you configured static IP addresses, you will not be able to access the node remotely or from a management device until the IP address of the IMM is restored.
  3. Reactivate any Features on Demand features. Instructions for automating the activation of features and installing activation keys is in the Lenovo Features on Demand Users Guide. To download the document, go to the Lenovo Features on Demand website, log in, and click Help.
  4. Update the Universally Unique Identifier (UUID) and DMI/SMBIOS data with new vital product data (VPD). Use the Advanced Settings Utility to update the UUID and DMI/SMBIOS data (see Updating the Universally Unique Identifier (UUID) and DMI/SMBIOS data with vital product data).
  5. Update the compute node with the latest firmware or restore the preexisting firmware (see Updating firmware and device drivers for more information).

If you are instructed to return the defective system-board assembly, follow all packaging instructions, and use any packaging materials for shipping that are supplied to you.

Important
Make sure that both heat-sink fillers are installed on the defective system-board assembly that you are returning, prior to shipment. Use the heat-sink fillers that were removed from the replacement system-board assembly when you installed the microprocessors. Do not install the microprocessor socket dust covers in the defective system-board assembly that you are returning.