Removing and replacing the system-board assembly

Use this information to remove and replace the system-board assembly.

To remove and replace the system-board assembly, complete the following steps:

1. Remove any storage drives, optional drive components, and hard disk drive bay fillers from the defective system-board assembly and set them aside on a static-protective surface. (see Removing a hot-swap hard disk drive).
2. Remove the bezel from the defective system-board assembly and immediately install it on the replacement system-board assembly (see Removing the bezel and Installing the bezel).
   Note

   If your compute node has an RFID tag, it is already attached to the bezel.
3. Remove the covers from both compute nodes (see Removing the compute node cover). Keep the cover that comes with the replacement system-board assembly for reference and re-install it on the defective system-board assembly prior to returning the defective system-board assembly.
4. Remove hard disk drive backplane from the defective system-board assembly and immediately install it in the replacement system-board assembly (see Removing the hard disk drive backplane and Installing the hard disk drive backplane).
   Note

   Install the storage drives in the same bay locations from which they were removed.
5. Install any removed storage drives, optional drive components, and hard disk drive bay fillers into the replacement system-board assembly (see Installing a hot-swap hard disk drive).
6. Remove the DIMM air baffles from defective system-board assembly and set them aside.
7. Remove the USB enablement kit, if one is installed (see Removing the USB enablement kit).
   Attention

   • Remove and install only one microprocessor at a time.
   • When removing or installing a microprocessor, protect the other microprocessor socket with a microprocessor heat sink filler.
   • When transferring a microprocessor to a replacement system-board assembly, install the microprocessor heat sink filler in the defective system-board assembly immediately after installing the microprocessor in the replacement system-board assembly.
8. Transfer microprocessor 1 (rear microprocessor) and its heat sink from the defective system-board assembly to the replacement system-board assembly. Use the microprocessor installation tool that comes with the replacement system-board assembly to remove the microprocessor from the defective system-board assembly and install it immediately in the replacement system-board assembly.
   1. Use a screwdriver to loosen the screw on one side of the heat sink to break the seal with the microprocessor.
   2. Use a screwdriver to loosen the screws on the heat sink, rotating each screw two full turns until each screw is loose.
   3. Gently pull the heat sink from the microprocessor.
      Attention

      Do not touch the thermal material on the bottom of the heat sink. Touching the thermal material will contaminate it.
   4. Identify which release lever is labeled as the first release lever to open, and open it.
      Attention

      Do not use any tools or sharp objects to lift the release levers on the microprocessor socket. Doing so might result in permanent damage to the system board.

      
      
      
   5. Open the second release lever on the microprocessor socket.
   6. Open the microprocessor retainer.
   7. Select the empty installation tool and ensure that the handle is in the open position. If the installation tool handle is not in the open position, 1) lift the interlock latch and hold it up while you 2) twist the microprocessor installation tool handle counterclockwise to the open position, and then release the interlock latch. The following illustration of the installation tool shows the location of the interlock latch and counterclockwise rotation of the handle before loading the microprocessor.
      
      
      
   8. Align the installation tool with the screws, as shown in the following graphic, and lower the installation tool on the microprocessor. The installation tool rests flush on the socket only when it is aligned correctly.
      
      
      
   9. Remove the microprocessor using the installation tool. Gently twist the handle of the installation tool clockwise until it locks in the H or L position, depending on the size of microprocessor, and then lift the microprocessor out of the socket.
      
      
      

      Attention

      Do not touch the connectors on the microprocessor and the microprocessor socket.
   10. Open the packaging that contains the new microprocessor installation tool assembly and carefully remove the installation tool assembly from the package.
       Note

       Do not touch the microprocessor contacts. Contaminants on the microprocessor contacts, such as oil from your skin, can cause connection failures between the contacts and the socket.
   11. Remove the microprocessor protective cover if one is present.
       
       
       
   12. Align the installation tool with the microprocessor socket. The installation tool rests flush on the socket only if it is properly aligned.
       
       
       
   13. Install the microprocessor using the installation tool. Twist the handle of the installation tool assembly counterclockwise until the microprocessor is inserted into the socket, and lift the installation tool out of the socket. The following illustration shows the tool handle in the open position.
       
       
       
       Attention

       • Do not press the microprocessor into the socket.
       • Make sure that the microprocessor is aligned correctly in the socket before you try to close the microprocessor retainer.
       • Do not touch the thermal grease on the bottom of the heat sink or on top of the microprocessor. Touching the thermal grease will contaminate it.
       
       
       
   14. Close the microprocessor retainer on the microprocessor socket.
   15. Identify which release lever is labeled as the first release lever to close, and close it.
   16. Close the second release lever on the microprocessor socket.
       Attention

       • If you are installing a new heat sink, do not set down the heat sink after you remove the plastic cover.
       • Do not touch the thermal material on the bottom of the heat sink. Touching the thermal material will contaminate it.
9. Repeat 8 for microprocessor 2 (front microprocessor), if one is installed.
10. Remove all of the installed components in the following list from the defective system-board assembly; then, immediately install them on the replacement system-board assembly:
    • DIMMs. See Removing a DIMM and Installing a DIMM.
    • Fabric connector. See Removing a fabric connector and Installing a fabric connector.
    • I/O expansion adapters. See Removing an I/O expansion adapter and Installing an I/O expansion adapter.
    • Interposer cable. See Removing an interposer cable and Installing an interposer cable.
11. Install the USB enablement kit in the replacement system-board assembly, if you removed one from the original (defective) system-board assembly (see Installing the USB enablement kit).
    Note

    Retaining clips on the DIMM connectors must be in the closed position to install the USB enablement kit or the air baffles.
12. Install the DIMM air baffles in the replacement system-board assembly. The DIMM air baffles are required to maintain system cooling.
13. Install the cover that you removed from the original (defective) system-board assembly onto the replacement system-board assembly (see Installing the compute node cover for instructions).
    Important

    The heat sink fillers protect the microprocessor socket from potential damage during shipping.
14. Make sure that both microprocessor sockets on defective system-board assembly have heat sink fillers installed; then, install the cover that came with the replacement system-board assembly onto the defective system-board assembly (see Installing the compute node cover for instructions).
    Note

    Retention clips that secure the I/O expansion adapters must be in the closed position to install the cover.
15. If a blank ID label plate is on the replacement system-board assembly, remove it and discard (see Removing the ID label plate).
16. Remove the ID label plate that has machine type and serial number information from the defective system-board assembly bezel and immediately install it on the replacement system-board assembly bezel (see Removing the ID label plate and Installing the ID label plate).
    Note

    If your compute node has an RFID tag, it is already attached to the ID label plate.
17. If an Attention label is on the replacement system-board assembly front panel above the power button, read it; then, remove the label and discard it before turning on the compute node.
18. The replacement system-board assembly comes with a Repair Identification (RID) tag. Using a fine tip indelible ink pen, transfer the machine type and serial number from the defective system-board assembly to the label on the Repair Identification tag; then, place the tag in the recessed area on the bottom of replacement system-board assembly.