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Environmental specifications

Summary of the environmental specifications of server. Depending on the model, some features might not be available, or some specifications might not apply.

Acoustical noise emissions​

Acoustical noise emissions
The server has the following acoustic noise emissions declaration:
  • Sound power level (LWAd)
    • Idling: 7.3 Bel (Typical), 7.4 Bel (Max.)
    • Operating 1: 7.3 Bel (Typical), 7.4 Bel (Max.)
    • Operating 2: 7.5 Bel (Typical), 8.3 Bel (Max.)
  • Sound pressure level (LpAm):
    • Idling: 57.1 dBA (Typical), 57.8 dBA (Max.)
    • Operating 1: 57.1 dBA (Typical), 57.8 dBA (Max.)
    • Operating 2: 59.1 dBA (Typical), 66.4 dBA (Max.)
Note
  • These sound levels were measured in controlled acoustical environments according to procedures specified by ISO7779 and are reported in accordance with ISO 9296.
  • Idle mode is the steady state in which the server is powered on but not operating any intended function. Operating mode 1 is 50% of CPU TDP. Operating Mode 2 is 100% of CPU TDP.
  • The declared acoustic sound levels are based on the below-specified configurations, which may change depending on configuration/conditions.
    (with four SD530 V3 nodes installed in the chassis)
    • Typical: four 185-watt processors, thirty-two 64 GB RDIMMs, four E3.S SSDs, four 1GB OCP modules, and two 2700-watt CRPS PSUs
    • Maximum: eight 205-watt processors, sixty-four 64 GB RDIMMs, eight E3.S SSDs, four 1GB OCP modules, four GPU adapters, and three 2700-watt CRPS PSUs
  • Government regulations (such as those prescribed by OSHA or European Community Directives) may govern noise level exposure in the workplace and may apply to you and your server installation. The actual sound pressure levels in your installation depend upon a variety of factors, including the number of racks in the installation; the size, materials, and configuration of the room; the noise levels from other equipment; the room ambient temperature, and employee's location in relation to the equipment. Further, compliance with such government regulations depends on a variety of additional factors, including the duration of employees' exposure and whether employees wear hearing protection. Lenovo recommends that you consult with qualified experts in this field to determine whether you are in compliance with the applicable regulations.

Ambient temperature management​

Ambient temperature management

Adjust ambient temperature when specific components are installed.

Note
  • To avoid throttling, make sure to adopt passive Direct Attach cables when network adapters with 100GbE or higher speed are installed.
  • Two-processor configuration is supported up to 30°C.
  • If PCIe adapter with up to 2 ports is installed, the configuration only supports OCP module with up to 4 ports.
  • If PCIe adapter with up to 4 ports is installed, the configuration only supports OCP module with up to 2 ports.
Warning
When E3.S PM1743 15.36TB drive is installed, the ambient temperature must be limited to 30°C or lower.

  • Keep the ambient temperature to 35°C or lower with the following system configuration:

    Table 1. Configurations with one processor, under 35°C
    Processor configurationConditionally supported componentsCommonly supported components
    • One processor with up to 350-watt TDP
    • Performance heat sink
    • One PCIe Ethernet adapter
    • No OCP module
    • Up to eight 96 GB RDIMMs
    • Up to two E3.S 1T drives
    • Up to two M.2 drives
    • No PCIe adapter
    • One OCP module
    • One processor with up to 300-watt TDP
    • Performance heat sink
    • One PCIe adapter with 2 ports
    • One OCP module
    • Up to eight 96 GB RDIMMs
    • Up to two E3.S 1T drives
    • Up to two M.2 drives
    • One PCIe Ethernet adapter
    • One OCP module with 2 ports
    • One GPU adapter
    • One OCP module
    • One processor with up to 185-watt TDP
    • Standard heat sink
    • Up to eight 128 GB 3DS RDIMMs
    • One PCIe adapter with 2 ports
    • One OCP module
    • Up to two E3.S 1T drives
    • Up to two M.2 drives
    • Up to eight 128 GB 3DS RDIMMs
    • One PCIe Ethernet adapter
    • One OCP module with 2 ports
    • Up to eight 96 GB RDIMMs
    • One GPU adapter
    • One OCP module

  • Keep the ambient temperature to 30°C or lower with the following system configuration:

    Table 2. Configurations with one processor, under 30°C
    Processor configurationConditionally supported componentsCommonly supported components
    • One processor with up to 350-watt TDP
    • Performance heat sink
    • One PCIe adapter with 2 ports
    • One OCP module
    • Up to eight 96 GB RDIMMs
    • Up to two E3.S 1T drives
    • Up to two M.2 drives
    • One PCIe Ethernet adapter
    • One OCP module with 2 ports
    • One GPU adapter
    • One OCP module
    • One processor with up to 300-watt TDP
    • Performance heat sink
    • One PCIe adapter with 2 ports
    • One OCP module
    • Up to eight 128 GB 3DS RDIMMs
    • Up to two E3.S 1T drives
    • Up to two M.2 drives
    • One PCIe Ethernet adapter
    • One OCP module with 2 ports
    Table 3. Configurations with two processors, under 30°C
    Processor configurationConditionally supported componentsCommonly supported components
    • Two processors with up to 150-watt TDP
    • Processor 1 with standard heat sink
    • Processor 2 with performance heat sink
    • One GPU adapter
    • One OCP module
    • Up to sixteen 64 GB RDIMMs
    • Up to two E3.S 1T drives
    • Up to two M.2 drives
    • One PCIe adapter with 2 ports
    • One OCP module
    • One PCIe Ethernet adapter
    • One OCP module with 2 ports

  • Keep the ambient temperature to 25°C or lower with the following system configuration:

    Table 4. Configurations with one processor, under 25°C
    Processor configurationConditionally supported componentsCommonly supported components
    • One processor with up to 350-watt TDP
    • Performance heat sink
    • One PCIe adapter with 2 ports
    • One OCP module
    • Up to eight 128 GB 3DS RDIMMs
    • Up to two E3.S 1T drives
    • Up to two M.2 drives
    • One PCIe Ethernet adapter
    • One OCP module with 2 ports
    Table 5. Configurations with two processors, under 25°C
    Processor configurationConditionally supported componentsCommonly supported components
    • Two processors with up to 205-watt TDP
    • Processor 1 with standard heat sink
    • Processor 2 with performance heat sink
    • One PCIe adapter with 2 ports
    • One OCP module
    • Up to sixteen 64 GB RDIMMs
    • Up to two E3.S 1T drives
    • Up to two M.2 drives
    • One PCIe Ethernet adapter
    • One OCP module with 2 ports
    • One GPU adapter
    • One OCP module

Environment​

Environment

ThinkSystem SD530 V3 complies with ASHRAE Class A2 specifications. System performance may be impacted when operating temperature is outside AHSRAE A2 specification.

Depending on the hardware configuration, SD530 V3 also complies with ASHRAE Class H1 specification. System performance may be impacted when operating temperature is outside ASHRAE H1 specification.

  • Air temperature:
    • Operating
      • ASHRAE Class A2: 10°C to 35°C (50°F to 95°F); the maximum ambient temperature decreases by 1°C for every 300 m (984 ft) increase in altitude above 900 m (2,953 ft).
      • ASHRAE Class H1: 5°C to 25°C (41°F to 77°F); the maximum ambient temperature decreases by 1°C for every 300 m (984 ft) increase in altitude above 900 m (2,953 ft).
    • Server off: 5°C to 45°C (41°F to 113°F)
    • Shipment/storage: -40°C to 60°C (-40°F to 140°F)
  • Maximum altitude: 3,050 m (10,000 ft)
  • Relative Humidity (non-condensing):
    • Operating
      • ASHRAE Class A2: 8% to 80%; maximum dew point: 21°C (70°F)
      • ASHRAE Class H1: 8% to 80%; maximum dew point: 17°C (62.6°F)
    • Shipment/storage: 8% to 90%
  • Particulate contamination
    Attention
    Airborne particulates and reactive gases acting alone or in combination with other environmental factors such as humidity or temperature might pose a risk to the server. For information about the limits for particulates and gases, see Particulate contamination.
Note
The server is designed for standard data center environment and recommended to be placed in industrial data center.
  • Particulate contamination
    Attention: Airborne particulates (including metal flakes or particles) and reactive gases acting alone or in combination with other environmental factors such as humidity or temperature might pose a risk to the device that is described in this document.