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Specifications

The following information is a summary of the features and specifications of the compute node. Depending on the model, some features might not be available, or some specifications might not apply.

Table 1. Server Specifications
SpecificationDescription
Size
  • Height: 55.5 mm (2.2 in)
  • Depth: 492.7 mm (19.4 in)
  • Width: 435.3 mm (17.1 in)
  • Weight:

    • Minimum: 9.3 kg (20.6 lb)

    • Maximum: 12.3 kg (27.0 lb)

Processor (depending on the model)Support up to four multi-core Intel® Xeon processors. Use the Setup utility to determine the type and speed of the processors in the compute node.

For a list of supported processors, see: Lenovo ServerProven website.

Note
When install the processor models in below, make sure the server environment is not higher than 30°C. Fan error or performance reduction might occur when server is operating in the environment higher than 30°C.

  • Intel Xeon Gold 6126T 12C 125W 2.6GHz Processor

  • Intel Xeon Gold 6144 8C 150W 3.5GHz Processor

  • Intel Xeon Gold 6146 12C 165W 3.2GHz Processor

  • Intel Xeon Platinum 8160T 24C 150W 2.1GHz Processor

  • Intel Xeon Platinum 6244 8C 150W 3.6GHz Processor

Memory

See Memory module installation order for detailed information about memory configuration and setup.

  • Minimum: 16 GB

  • Maximum:

    • 13.8 TB with DC Persistent Memory Module (DCPMM) in Memory Mode

  • Type:

    • Error correcting code (ECC), Low-profile (LP) double-data rate (DDR4) RDIMM, LRDIMM, and 3DS RDIMM (mixing is not supported)

    • DC Persistent Memory Module (DCPMM)

  • Supports (depending on the model):

    • 8 GB, 16 GB, 32 GB, and 64 GB RDIMM

    • 64 GB LRDIMM

    • 128 GB 3DS RDIMM

    • 128 GB, 256 GB, and 512 GB DCPMM

  • Slots: 48 dual inline memory module (DIMM) connectors that support up to:

    • 48 DRAM DIMMs
    • 24 DRAM DIMMs and 24 DCPMMs
Note
List of supported memory module is different for 1st generation (Skylake) and 2nd generation (Cascade Lake) Intel Xeon processors. Make sure to install compatible memory modules to avoid system error.For a list of supported DIMMs, see: Lenovo ServerProven website.
DriveSupport up to four 2.5-inch hot-swap SAS/SATA/NVMe hard disk drive/solid-state drive bays.
Drive backplane

  • SATA backplane

  • SAS/SATA backplane

  • NVMe/SATA backplane

RAID support
  • Software RAID supports for RAID levels 0, 1, 5, and 10
  • Hardware RAID supports:

    • Basic RAID adapter (without flash power module) supports: RAID levels 0, 1, 5, and 10

    • Advance RAID adapter (with flash power module) supports: RAID levels 0, 1, 5, 6, and 10

Integrated functions
  • One baseboard management controller (BMC) with integrated VGA controller
  • Light path diagnostics
  • One external USB 3.2 Gen 1 port
  • Serial over LAN (SOL)
  • Wake on LAN (WOL)
Minimum configuration for debugging

  • Two processors in processor sockets 1 and 2

  • One memory DIMM in slot 5

Predictive Failure Analysis (PFA) alerts
  • Processor
  • Memory
  • Drive
SecurityFully compliant with NIST 800-131A. The security cryptography mode set by the managing device (CMM and Lenovo XClarity Administrator) determines the security mode in which the compute node operates.
Operating systemsSupported and certified operating systems:

  • Microsoft Windows Server

  • VMware ESXi

  • Red Hat Enterprise Linux

  • SUSE Linux Enterprise Server

References:
EnvironmentThe ThinkSystem SN850 compute node complies with ASHRAE Class A2 specifications. Depending on the hardware configuration, some models comply with ASHRAE Class A3 specifications. System performance may be impacted when operating temperature is outside ASHRAE A2 specification or fan failed condition. The ThinkSystem SN850 compute node is supported in the following environment:

  • Air temperature:

    • Operating:

      • ASHRAE Class A2: 10°C to 35°C (50°F to 95°F); decrease the maximum ambient temperature by 1°C for every 300 m (984 ft) increase in altitude above 900 m (2,953 ft)

      • ASHRAE Class A3: 5°C to 40°C (41°F to 104°F); decrease the maximum ambient temperature by 1°C for every 175 m (574 ft) increase in altitude above 900 m (2,953 ft)

    • Compute node off: 5°C to 45°C (41°F to 113°F)

    • Shipment/Storage: -40°C to 60°C (-40°F to 140°F)

  • Maximum altitude: 3,050 m (10,000 ft)

  • Relative Humidity (non-condensing):

    • Operating:

      • ASHRAE Class A2: 8% to 80%, maximum dew point: 21°C (70°F)

      • ASHRAE Class A3: 8% to 85%, maximum dew point: 24°C (75°F)

    • Shipment/Storage: 8% to 90%

  • Particulate contamination
    Attention
    Airborne particulates and reactive gases acting alone or in combination with other environmental factors such as humidity or temperature might pose a risk to the server. For information about the limits for particulates and gases, see Particulate contamination.
Note
The server is designed for standard data center environment and recommended to be placed in industrial data center.

Acoustical noise emissions

Note

  • The declared acoustic noise level are based on specified configurations and they may change depending on configuration/condition changes.

  • The declared acoustic noise levels may increase greatly, if high-power components are installed such as high-power NICs, high-power processors and GPUs.

  1. Chassis is powered on.
  2. A3 - Derate maximum allowable temperature 1°C/175 m above 950 m.
  3. The minimum humidity level for class A3 is the higher (more moisture) of the -12°C dew point and the 8% relative humidity. These intersect at approximately 25°C. Below this intersection (<25°C), the dew point (-12°C) represents the minimum moisture level; above the intersection, relative humidity (8%) is the minimum.
  4. Moisture levels lower than 0.5°C dew point, but not lower -10°C dew point or 8% relative humidity, can be accepted if appropriate control measures are implemented to limit the generation of static electricity on personnel and equipment in the data center. All personnel and mobile furnishings and equipment must be connected to ground via an appropriate static control system. The following items are considered the minimum requirements:
    1. Conductive materials (conductive flooring, conductive footwear on all personnel who go into the datacenter; all mobile furnishings and equipment will be made of conductive or static dissipative materials).
    2. During maintenance on any hardware, a properly functioning wrist strap must be used by any personnel who contacts IT equipment.
  5. 5°C/hr for data centers employing tape drives and 20°C/hr for data centers employing disk drives.
  6. Chassis is removed from original shipping container and is installed but not in use, for example, during repair, maintenance, or upgrade.
  7. The equipment acclimation period is 1 hour per 20°C of temperature change from the shipping environment to the operating environment.
  8. Condensation, but not rain, is acceptable.
  • Particulate contamination
    Attention: Airborne particulates (including metal flakes or particles) and reactive gases acting alone or in combination with other environmental factors such as humidity or temperature might pose a risk to the device that is described in this document.