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Environmental specifications

Summary of the environmental specifications of server. Depending on the model, some features might not be available, or some specifications might not apply.

Acoustical noise emissions​

Acoustical noise emissions

The server has the following acoustic noise emissions declaration.

ConfigurationTypicalStorageGPU
Sound power levels (LWAd)

  • Idling: 5.6 Bel

  • Operating: 5.6 Bel

  • Idling: 7.3 Bel

  • Operating: 7.3 Bel

  • Idling: 7.3 Bel

  • Operating: 8.9 Bel

Sound pressure level (LpAm)

  • Idling: 41.5 dBA

  • Operating: 41.5 dBA

  • Idling: 60.2 dBA

  • Operating: 60.2 dBA

  • Idling: 60.2 dBA

  • Operating: 74.1 dBA

The declared sound levels are based on the following configurations, which may change depending on configurations or conditions.

ComponentTypical configurationStorage configurationGPU configuration
Chassis (2U)8 x 2.5-inch front drive bays12 x 3.5-inch front drive bays16 x 2.5-inch front drive bays
Fan6 x standard fans6 x high performance fans6 x high performance fans
Processor2 x 205 W CPUs2 x 205 W CPUs2 x 205 W CPUs
Memory8 x 64 GB RDIMMs16 x 64 GB RDIMMs32 x 64 GB RDIMMs
Drive8 x 2.4 TB SAS HDDs20 x 14 TB SAS HDDs16 x 2.4 TB SAS HDDs
RAID adapter1 x RAID 940-8i1 x RAID 940-32i1 x RAID 940-16i
OCP adapter1 x Intel X710-T2L 10GBASE-T 2-port OCP
Power supply2 x 750 W PSUs2 x 1100 W PSUs2 x 1800 W PSUs
GPU adapterNoneNone3 x A100
Note

  • These sound levels were measured in controlled acoustical environments according to procedures specified by ISO7779 and are reported in accordance with ISO 9296.

  • Government regulations (such as those prescribed by OSHA or European Community Directives) may govern noise level exposure in the workplace and may apply to you and your server installation. The actual sound pressure levels in your installation depend upon a variety of factors, including the number of racks in the installation; the size, materials, and configuration of the room; the noise levels from other equipment; the room ambient temperature, and employee's location in relation to the equipment. Further, compliance with such government regulations depends on a variety of additional factors, including the duration of employees' exposure and whether employees wear hearing protection. Lenovo recommends that you consult with qualified experts in this field to determine whether you are in compliance with the applicable regulations.

Environment​

Environment

ThinkSystem SR650 V3 complies with ASHRAE Class A2 specifications with most configurations, and depending on the hardware configuration, also complies with ASHRAE Class A3 and Class A4 specifications. System performance may be impacted when the operating temperature is outside ASHRAE A2 specification.

Depending on the hardware configuration, SR650 V3 server also complies with ASHRAE Class H1 specification. System performance may be impacted when the operating temperature is outside ASHRAE H1 specification.

The restrictions to ASHRAE support are as follows (cooling by air):
  • The ambient temperature must be limited to 35°C or lower if the server has any of the following components:

    • Broadcom 57416 10GBASE-T 2-port OCP

    • Broadcom 57454 10GBASE-T 4-port OCP

    • PCIe network interface card (NIC) at a rate greater than or equal to 100 GB

    • Part with AOC and at the rate of 40 GB

  • The ambient temperature must be limited to 30°C or lower if the server has any of the following components:

    • 24 x 2.5" or 12 x 3.5" front bay with middle bay or rear bay

    • GPU adapters

    • 256 GB 3DS RDIMM

    • 350 W processor

    • part with AOC and at a rate greater than 40 GB

    • 5600 MHz RDIMMs with capacity greater than or equal to 96 GB

    • ThinkSystem 96GB TruDDR5 4800MHz (2Rx4) RDIMM

    • ThinkSystem 128GB TruDDR5 4800MHz (4Rx4) 3DS RDIMM v1

    • 4800 MHz 256 GB RDIMMs (except ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM v1)

  • The ambient temperature must be limited to 25°C or lower if the server has any of the following components or configurations:

    • 350 W processor installed in the chassis with 24 x 2.5" or 12 x 3.5" front drives

    • 350 W processor installed in the 16 x 2.5" + FIO non-GPU configuration

    • processor (270 W <=TDP <= 300 W) installed in the chassis with middle or rear drives

    • GPU adapter installed in the chassis with 24 x 2.5" front drives

    • GPU adapter and processor with TDP rating greater than 300 W installed in the chassis with 16 x 2.5" or 8 x 3.5" front drives

    • drives larger than 3.84 TB installed in Gen 5 rear or middle NVMe drive bays

    • 36 NVMe configuration

    • 16 x 2.5" + FIO GPU configuration

    • ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM v1

    • ThinkSystem 96GB TruDDR5 4800MHz (2Rx4) RDIMM and ThinkSystem 128GB TruDDR5 5600MHz (2Rx4) RDIMM installed in the following configurations:

      • 12 x 3.5" configurations including processors with TDP greater than 250 W and less than or equal to 300 W

      • 12 x 3.5" + middle/rear drive bay configurations including processors with TDP greater than 250 W and less than or equal to 270 W

    • the following NVMe SSDs installed in the front 12 x 3.5" SAS/SATA + middle 8 x 2.5" NVMe or front 12 x 3.5" SAS/SATA + rear 4 x 2.5" NVMe configuration:

      • ThinkSystem 2.5" U.2 P5336 61.44TB Read Intensive NVMe PCIe 4.0 x4 HS SSD

      • ThinkSystem 2.5" U.2 P5336 30.72TB Read Intensive NVMe PCIe 4.0 x4 HS SSD

      • ThinkSystem 2.5" U.2 P5336 15.36TB Read Intensive NVMe PCIe 4.0 x4 HS SSD

    • H100 NVL GPU adapter

The restrictions to ASHRAE support are as follows (cooling by Direct Water Cooling Module (DWCM)):
  • The ambient temperature must be limited to 35°C or lower if the server has any of the following components or configurations:

    • Broadcom 57416 10GBASE-T 2-port OCP

    • Broadcom 57454 10GBASE-T 4-port OCP

    • PCIe network interface card (NIC) at a rate greater than or equal to 100 GB

    • Part with AOC and at the rate of 40 GB

    • GPU adapters (< 300 W) installed in 8 x 3.5" or 16 x 2.5" configurations

    • 64 GB < DIMM < 256 GB

    • 8 x 2.5" GPU configuration

    • storage configuration without middle or rear NVMe backplane

  • The ambient temperature must be limited to 30°C or lower if the server has any of the following components:

    • 256 GB 3DS RDIMM

    • part with AOC and at a rate greater than 40 GB

    • GPU adapters (>= 300 W) installed in 8 x 3.5" or 16 x 2.5" configurations

    • three A40 GPU adapters installed in 24 x 2.5" configurations

    • storage configuration with middle or rear NVMe backplane

    • 5600 MHz RDIMMs with capacity greater than or equal to 96 GB

    • ThinkSystem 96GB TruDDR5 4800MHz (2Rx4) RDIMM

    • ThinkSystem 128GB TruDDR5 4800MHz (4Rx4) 3DS RDIMM v1

    • 4800 MHz 256 GB RDIMMs (except ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM v1)

    • H100 NVL GPU adapter

  • The ambient temperature must be limited to 25°C or lower if the server has any of the following components:

    • three H800/H100 GPU adapters installed in 24 x 2.5" configurations

    • three H800/H100 GPU adapters installed in 16 x 2.5" + FIO configurations

    • ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM v1

    • the following NVMe SSDs installed in the front 12 x 3.5" SAS/SATA + middle 8 x 2.5" NVMe or front 12 x 3.5" SAS/SATA + rear 4 x 2.5" NVMe configuration:

      • ThinkSystem 2.5" U.2 P5336 61.44TB Read Intensive NVMe PCIe 4.0 x4 HS SSD

      • ThinkSystem 2.5" U.2 P5336 30.72TB Read Intensive NVMe PCIe 4.0 x4 HS SSD

      • ThinkSystem 2.5" U.2 P5336 15.36TB Read Intensive NVMe PCIe 4.0 x4 HS SSD

For detailed thermal information, see Thermal rules.
Note
When the ambient temperature is greater than the supported max temperature (ASHARE A4 45°C), the server will shut down. The server will not power on again until the ambient temperature falls within the supported temperature range.

  • Air temperature:

    • Operating:

      • ASHRAE class H1: 5°C to 25°C (41°F to 77°F)

        The maximum ambient temperature decreases by 1°C for every 500 m (1640 ft) increase in altitude above 900 m (2,953 ft)

      • ASHRAE class A2: 10°C to 35°C (50°F to 95°F)

        The maximum ambient temperature decreases by 1°C for every 300 m (984 ft) increase in altitude above 900 m (2,953 ft)

      • ASHRAE class A3: 5°C to 40°C (41°F to 104°F)

        The maximum ambient temperature decreases by 1°C for every 175 m (574 ft) increase in altitude above 900 m (2,953 ft)

      • ASHRAE class A4: 5°C to 45°C (41°F to 113°F)

        The maximum ambient temperature decreases by 1°C for every 125 m (410 ft) increase in altitude above 900 m (2,953 ft)

    • Server off: -10°C to 60°C (14°F to 140°F)

    • Shipment/storage: -40°C to 70°C (-40°F to 158°F)

  • Maximum altitude: 3,050 m (10,000 ft)

  • Relative Humidity (non-condensing):

    • Operating

      • ASHRAE class H1: 8%–80%; maximum dew point: 17°C (62.6°F)

      • ASHRAE class A2: 20%–80%; maximum dew point: 21°C (70°F)

      • ASHRAE class A3: 8%–85%; maximum dew point: 24°C (75°F)

      • ASHRAE class A4: 8%–90%; maximum dew point: 24°C (75°F)

    • Shipment/storage: 8% to 90%

Water requirements​

Water requirements
ThinkSystem SR650 V3 is supported in the following environment:

  • Maximum pressure: 3 bars

  • Water inlet temperature and flow rates:
    Water inlet temperatureWater flow rate
    50°C (122°F)1.5 liters per minute (lpm) per server
    45°C (113°F)1 liter per minute (lpm) per server
    40°C (104°F) or lower0.5 liters per minute (lpm) per server
Note
The water required to initially fill the system side cooling loop must be reasonably clean, bacteria-free water (<100 CFU/ml) such as de-mineralized water, reverse osmosis water, de-ionized water, or distilled water. The water must be filtered with an in-line 50 micron filter (approximately 288 mesh). The water must be treated with anti-biological and anti-corrosion measures.
  • Particulate contamination
    Attention: Airborne particulates (including metal flakes or particles) and reactive gases acting alone or in combination with other environmental factors such as humidity or temperature might pose a risk to the device that is described in this document.