Separate the processor from carrier and heat sink
This task has instructions for separating a processor and its carrier from an assembled processor and heat sink, known as a processor-heat-sink module (PHM). This procedure must be executed by a trained technician.
About this task
To avoid potential danger, make sure to read and follow the safety information.
Read Installation Guidelines and Safety inspection checklist to make sure that you work safely.
Do not touch the contacts on the processor contacts. Contaminants on the processor contacts, such as oil from your skin, can cause connection failures.
Keep the processor socket clean from any object to prevent possible damages.
Do not allow the thermal grease on the processor or heat sink to come in contact with anything. Contact with any surface can compromise the thermal grease, rendering it ineffective. Thermal grease can damage components, such as the electrical connectors in the processor socket.
The heat sink, processor, and processor carrier for the node might look different from those shown in the illustrations in this section.
Procedure
- Separate the processor from the heat sink and carrier.
- Separate the processor carrier from the heat sink.
After you finish
Install the PHM (see Install a processor and heat sink).
- If you are instructed to return the component or optional device, follow all packaging instructions, and use any packaging materials for shipping that are supplied to you.
Demo video