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Environmental specifications

Summary of the environmental specifications of server. Depending on the model, some features might not be available, or some specifications might not apply.

Acoustical noise emissions​

Acoustical noise emissions
The server has the following acoustic noise emissions declaration:
  • Sound power level (LWAd)
    • Idling: 7.3 Bel (Typical), 7.4 Bel (Max.)
    • Operating 1: 7.3 Bel (Typical), 7.4 Bel (Max.)
    • Operating 2: 8.3 Bel (Typical), 8.8 Bel (Max.)
  • Sound pressure level (LpAm):
    • Idling: 57.1 dBA (Typical), 57.8 dBA (Max.)
    • Operating 1: 57.1 dBA (Typical), 57.8 dBA (Max.)
    • Operating 2: 66.4 dBA (Typical), 71.4 dBA (Max.)
Note
  • These sound levels were measured in controlled acoustical environments according to procedures specified by ISO7779 and are reported in accordance with ISO 9296.
  • Idle mode is the steady state in which the server is powered on but not operating any intended function. Operating mode 1 is 50% of CPU TDP. Operating Mode 2 is 100% of CPU TDP.
  • The declared acoustic sound levels are based on the below-specified configurations, which may change depending on configuration/conditions.
    (with four SD535 V3 nodes installed in the chassis)
    • Typical: four 300-watt processors (9354P), forty-eight 64 GB RDIMMs, twenty-four SATA SSDs, four 25GB 2-port OCP modules, and two 2700-watt CRPS PSUs
    • Maximum: four 400-watt processors (9554P), forty-eight 64 GB RDIMMs, eight NVMe SSDs, four 1GB 4-port OCP modules, four GPU adapters, and three 2700-watt CRPS PSUs
  • Government regulations (such as those prescribed by OSHA or European Community Directives) may govern noise level exposure in the workplace and may apply to you and your server installation. The actual sound pressure levels in your installation depend upon a variety of factors, including the number of racks in the installation; the size, materials, and configuration of the room; the noise levels from other equipment; the room ambient temperature, and employee's location in relation to the equipment. Further, compliance with such government regulations depends on a variety of additional factors, including the duration of employees' exposure and whether employees wear hearing protection. Lenovo recommends that you consult with qualified experts in this field to determine whether you are in compliance with the applicable regulations.

Ambient temperature management​

Ambient temperature management

Adjust ambient temperature when specific components are installed.

Note
  • To avoid throttling, make sure to adopt passive Direct Attach cables when network adapters with 100GbE or higher speed are installed.
  • If PCIe adapter with up to 2 ports is installed, the configuration only supports OCP module with up to 4 ports.
  • If PCIe adapter with up to 4 ports is installed, the configuration only supports OCP module with up to 2 ports.
  • The thermal rule is the same for Turin and Genoa processor with up to 300-watt TDP.
  • The following processors require a 25°C ambient temperature, and has limited drive and adapter support:
    • ThinkSystem AMD EPYC 9274F 24C 320W 4.05GHz Processor
    • ThinkSystem AMD EPYC 9374F 32C 320W 3.85GHz Processor
    • ThinkSystem AMD EPYC 9474F 48C 360W 3.6GHz Processor
  • The following processors are supported at a 25°C ambient temperature with limited drive and adapter support, however processor performance may be impacted:
    • ThinkSystem AMD EPYC 9184X 16C 320W 3.55GHz Processor
    • ThinkSystem AMD EPYC 9384X 32C 320W 3.1GHz Processor
Keep the ambient temperature to 35°C or lower with the following system configuration:
Processor configurationStorage configurationDIMM capabilityConditionally supported components
Processor with up to 300-watt TDP
  • Up to six 2.5-inch drives
  • Up to two M.2 drives on M.2 boot adapter
  • Up to twelve 64 GB RDIMMs
  • One PCIe RAID adapter
  • One OCP module with 2 ports
  • No 2.5-inch drive and front backplane
  • Up to two M.2 drives on M.2 boot adapter
  • Up to two M.2 drives on system board
  • Up to twelve 96 GB RDIMMs
  • One PCIe Ethernet adapter with up to 4 ports or one PCIe RAID adapter
  • One OCP module
Processor with up to 240-watt TDP
  • Up to six 2.5-inch drives
  • Up to two M.2 drives on M.2 boot adapter
  • Up to two M.2 drives on system board
  • Up to twelve 96 GB RDIMMs
  • One LP GPU adapter
  • One OCP module with 2 ports
  • One PCIe Ethernet adapter with up to 4 ports or one PCIe RAID adapter
  • One OCP module
Keep the ambient temperature to 30°C or lower when the following components are installed:
Processor configurationStorage configurationDIMM capabilityConditionally supported components
Genoa processor with up to 400-watt TDP
Note
Except 9274F/9374F/9474F/9184X/9384X processor
  • No 2.5-inch drive and front backplane
  • Up to two M.2 drives on M.2 boot adapter
  • Up to two M.2 drives on system board
  • Up to twelve 96 GB 4800MHz RDIMMs
  • One PCIe Ethernet adapter with up to 4 ports or one PCIe RAID adapter
  • One OCP module
Turin processor with up to 400-watt TDP
  • Up to twelve 96 GB 6400MHz RDIMMs
Processor with up to 300-watt TDP
  • Up to six 2.5-inch drives
  • Up to two M.2 drives on M.2 boot adapter
  • Up to two M.2 drives on system board
  • Up to twelve 96 GB RDIMMs
  • One PCIe Ethernet adapter with up to 4 ports or one PCIe RAID adapter
  • One OCP module
  • One LP GPU adapter
  • One OCP module with 2 ports
  • No 2.5-inch drive and front backplane
  • Up to two M.2 drives on M.2 boot adapter
  • Up to two M.2 drives on system board
  • Up to twelve 128 GB RDIMMs
  • One PCIe Ethernet adapter with up to 4 ports or one PCIe RAID adapter
  • One OCP module
Keep the ambient temperature to 25°C or lower when the following components are installed:
Processor configurationStorage configurationDIMM capabilityConditionally supported components
Genoa processor with up to 400-watt TDP
Note
Except 9274F/9374F/9474F/9184X/9384X processor
  • Up to two 2.5-inch hot-swap drives
  • Up to two M.2 drives on M.2 boot adapter
  • Up to two M.2 drives on system board
  • Up to twelve 96 GB 4800MHz RDIMMs
  • One PCIe Ethernet adapter with up to 4 ports or one PCIe RAID adapter
  • One OCP module
  • No 2.5-inch drive and front backplane
  • Up to two M.2 drives on M.2 boot adapter
  • Up to two M.2 drives on system board
  • Up to twelve 128 GB 4800MHz RDIMMs
Turin processor with up to 400-watt TDP
  • Up to two 2.5-inch hot-swap drives
  • Up to two M.2 drives on M.2 boot adapter
  • Up to two M.2 drives on system board
  • Up to twelve 128 GB 6400MHz RDIMMs
  • One PCIe Ethernet adapter with up to 4 ports or one PCIe RAID adapter
  • One OCP module
Processor with up to 300-watt TDP
  • Up to two 2.5-inch hot-swap drives
  • Up to two M.2 drives on M.2 boot adapter
  • Up to two M.2 drives on system board
  • Up to twelve 128 GB RDIMMs
  • One PCIe Ethernet adapter with up to 2 ports or one PCIe RAID adapter
  • One OCP module with 2 ports
9274F processor
  • Up to two 2.5-inch hot-swap drives
  • Up to two M.2 drives on M.2 boot adapter
  • Up to two M.2 drives on system board
  • Up to twelve 96 GB RDIMMs
  • One PCIe Ethernet adapter with 2 ports or one OCP module with 2 ports
  • No 2.5-inch drive and front backplane
  • Up to two M.2 drives on M.2 boot adapter
  • Up to two M.2 drives on system board
  • Up to twelve 128 GB RDIMMs
9474F processor
  • No 2.5-inch drive and front backplane
  • Up to two M.2 drives on M.2 boot adapter
  • Up to two M.2 drives on system board
  • Up to twelve 128 GB RDIMMs
  • One OCP module
  • 9374F processor
  • 9184X processor
  • 9384X processor
  • No 2.5-inch drive and front backplane
  • Up to two M.2 drives on M.2 boot adapter
  • Up to two M.2 drives on system board
  • Up to twelve 128 GB RDIMMs
  • One OCP module with 2 ports

Environment​

Environment

ThinkSystem SD535 V3 complies with ASHRAE Class A2 specifications. System performance may be impacted when operating temperature is outside AHSRAE A2 specification.

Depending on the hardware configuration, SD535 V3 also complies with ASHRAE Class H1 specification. System performance may be impacted when operating temperature is outside ASHRAE H1 specification.

  • Air temperature:
    • Operating
      • ASHRAE Class A2: 10°C to 35°C (50°F to 95°F); the maximum ambient temperature decreases by 1°C for every 300 m (984 ft) increase in altitude above 900 m (2,953 ft).
      • ASHRAE Class H1: 5°C to 25°C (41°F to 77°F); the maximum ambient temperature decreases by 1°C for every 300 m (984 ft) increase in altitude above 900 m (2,953 ft).
    • Server off: 5°C to 45°C (41°F to 113°F)
    • Shipment/storage: -40°C to 60°C (-40°F to 140°F)
  • Maximum altitude: 3,050 m (10,000 ft)
  • Relative Humidity (non-condensing):
    • Operating
      • ASHRAE Class A2: 8% to 80%; maximum dew point: 21°C (70°F)
      • ASHRAE Class H1: 8% to 80%; maximum dew point: 17°C (62.6°F)
    • Shipment/storage: 8% to 90%
  • Particulate contamination
    Attention
    Airborne particulates and reactive gases acting alone or in combination with other environmental factors such as humidity or temperature might pose a risk to the server. For information about the limits for particulates and gases, see Particulate contamination.
Note
The server is designed for standard data center environment and recommended to be placed in industrial data center.
  • Particulate contamination
    Attention: Airborne particulates (including metal flakes or particles) and reactive gases acting alone or in combination with other environmental factors such as humidity or temperature might pose a risk to the device that is described in this document.