Thermal rules for server with 9004 series processors
This topic provides thermal rules for the server with 9004 series processors.
Standard configurations: server models with front drive bays only
Thermal rules for server models installed with PCIe/OCP adapters (≥ 100 GB)
Fan locations and supported quantity for different configurations
The maximum supported DIMM quantity is 12.
cTDP is short for Configurable Thermal Design Power. It refers to the maximum supported power of a processor.
System performance may be impacted when the operating temperature is above 35 °C.
- When a 10 x 2.5" AnyBay backplane is used, only the following two configurations support closed loop heat sink:
10 x 2.5" NVMe (Gen 4)
8 x 2.5" NVMe (Gen 5)
Group B: 200 W ≤ cTDP ≤ 240 W
Group A: 240 W < cTDP ≤ 300 W
Group E: 320 W ≤ cTDP ≤ 400 W
Heat sink types and fan types in the tables are abbreviated as follows:
Air cooling heat sink: AC
Closed loop heat sink: CL
Performance fan: P
Standard fan: S
Standard configurations: server models with front drive bays only
This section provides thermal information for server models with front drive bays only.
Front bays | Max. Ambient Temp. (at sea level) | Processor group (A, B, E) | Heat sink | Fan type |
---|---|---|---|---|
| 35°C | B | AC | S |
35°C | B | AC/CL | P | |
35°C | A | AC/CL | P | |
45°C | B | AC | P | |
40°C | A | AC | P | |
25°C | E (9654/9654P processors only) | AC/CL | P | |
30°C | E | CL | P | |
35°C | E (9654/9654P/9554/9554P/9174F/9474F/9754/9734 processors only) | CL | P | |
16-EDSFF | 30°C | A, B | AC | P |
25°C | E (9654/9654P only) | AC | P | |
Using 10 x 2.5'' chassis
| 35°C | B | AC/CL | P |
45°C | B | AC | P | |
40°C | A | AC | P | |
25°C | E (9554/9554P/9754/9734 processors) | AC/CL | P | |
30°C | E (9174F processors only) | AC/CL | P | |
35°C | E (9654/9654P processors only) | AC/CL | P | |
35°C | E | CL | P | |
Using 4 x 2.5'' chassis
| 45°C | B | AC | P |
40°C | A | AC | P | |
25°C | E (9654/9654P processors only) | AC | P |
Storage configurations: server models with rear bays
This section provides thermal information for the storage configuration when rear drives (except 7mm drives) are installed.
Front bays | Max. Ambient Temp. (at sea level) | Processor group | Heat sink | Fan type |
---|---|---|---|---|
| 30°C | A, B | AC | P |
25°C | E (9654/9654P processors only) | AC | P | |
Using 4 x 2.5" chassis:
| 30°C | A, B | AC | P |
25°C | E (9654 and 9654P processors only) | AC | P |
To support rear 2 x 2.5" SAS/SATA or NVMe (U.2/U.3) drives, the following conditions need to be met:
Gen 4 low-profile riser installed in Riser 1
No Riser 2 installed
No 7mm drives
No PCIe adapter installed in slot 2 and slot 3
10 x 2.5" AnyBay front backplanes support rear NVMe (U.2/U.3) drives but do not support rear SAS/SATA drives.
GPU configurations: server models with GPU adapters
This section provides thermal information for the GPU configuration.
- Low-profile, half-length, single-wide:
NVIDIA® A2
NVIDIA® L4
All GPU configurations require performance fans.
Front bays | Max. Ambient Temp. (at sea level) | Processor group | Heat sink | Max. GPU Qty. | Supported GPU installation slot (s) |
---|---|---|---|---|---|
| 30°C | B | AC | 3 | 1, 2, 3 |
35°C | A | AC | 1 | 1 | |
25°C | E (9654/9654P processors only) | AC | 1 | 1 | |
16-EDSFF | 30°C | A, B | AC | 3 | 1, 2, 3 |
25°C | E (9654/9654P processors only) | AC | 1 | 1 | |
Using 10 x 2.5'' chassis
| 35°C | A, B | AC | 3 | 1, 2, 3 |
30°C | E | CL | 3 | 1, 2, 3 | |
30°C | E (9654/9654P/9174F processors only) | AC | 3 | 1, 2, 3 | |
25°C | E (9554/9554P/9754/9734 processors only) | AC | 3 | 1, 2, 3 | |
Using 4 x 2.5'' chassis
| 30°C | B | AC | 4 | 1, 2, 3, 5 |
35°C | A | AC | 2 | 1, 5 | |
25°C | E (9654/9654P processors only) | AC | 1 | 1 |
Thermal rules for 256 GB 3DS RDIMMS
This section provides thermal information when ThinkSystem 256GB TruDDR5 4800MHz (8Rx4) 3DS RDIMM-A v1 is installed.
Front bays | Max. Ambient Temp. (at sea level) | Processor group | Heat sink | Fan type |
---|---|---|---|---|
| 25°C | A, B | AC | P |
16-EDSFF | 25°C | A, B | AC | P |
Using 10 x 2.5'' chassis
| 30°C | A, B | AC | P |
25°C | A, B and E | CL | P | |
Using 4 x 2.5'' chassis
| 25°C | A, B | AC | P |
Thermal rules for server models installed with PCIe/OCP adapters (≥ 100 GB)
AOC: active optical cables
DAC: direct attach cables
Front bays | Max. Ambient Temp. (at sea level) | Processor | Heat sink | Max. PCIe/OCP Qty | Suggested slots | Cable supported |
---|---|---|---|---|---|---|
| 30°C | A, B | AC | 3 | 1, 2, 3 | AOC/DAC |
25°C | A, B | CL | 3 | 1, 2, 3 | AOC/DAC | |
25°C | E (9654/9654P processors only) | AC/CL | 3 | 1, 2, 3 | without 100G AOC | |
30°C | A, B, and E | CL | 3 | 1, 2, 3 | without 100G AOC | |
16-EDSFF | 30°C | A, B | AC | 3 | 1, 2, 3 | AOC/DAC |
25°C | E (9654/9654P processors only) | AC | 3 | 1, 2, 3 | without 100G AOC | |
Using 10 x 2.5'' chassis
| 30°C | A, B | AC | 3 | 1, 2, 3 | AOC/DAC |
25°C | E | CL | 3 | 1, 2, 3 | AOC/DAC | |
25°C | E (9654/9654P/9174F/9554/9554P/9754/9734 processors only) | AC/CL | 3 | 1, 2, 3 | AOC/DAC | |
30°C | E (9654/9654P/9174F processors only) | AC | 3 | 1, 2, 3 | AOC/DAC | |
30°C | E | CL | 3 | 1, 2, 3 | without 100G AOC | |
Using 4 x 2.5'' chassis
| 30°C | A, B | AC | 5 | 1, 2, 3, 4, 5 | AOC/DAC |
25°C | E (9654/9654P processors only) | AC | 5 | 1, 2, 3, 4, 5 | without 100G AOC |
Fan locations and supported quantity for different configurations
The supported fan quantity and suggested installation slots vary with different configurations. See the following table for details.
Configurations | Limiting conditions | Fan quantity | Fan type | Fan locations (slots) | Fan dummy quantity |
---|---|---|---|---|---|
| N/A | 7 | P | 1, 2, 3, 4, 5, 6, 7 | 1 |
|
| 6 | S | 1, 2, 3, 4, 5, 6 | 2 |
Other scenarios except the above | 6 | P | 1, 2, 3, 4, 5, 6 | 2 |