Parts list
Use the parts list to identify each of the components that are available for your server.
T1: Tier 1 customer replaceable unit (CRU). Replacement of Tier 1 CRUs is your responsibility. If Lenovo installs a Tier 1 CRU at your request with no service agreement, you will be charged for the installation.
T2: Tier 2 customer replaceable unit (CRU). You may install a Tier 2 CRU yourself or request Lenovo to install it, at no additional charge, under the type of warranty service that is designated for your server.
F: Field replaceable unit (FRU). FRUs must be installed only by trained service technicians.
C: Consumable and Structural parts. Purchase and replacement of consumable and structural parts (components, such as a filler or bezel) is your responsibility. If Lenovo acquires or installs a structural component at your request, you will be charged for the service.
Description | Type | Description | Type |
---|---|---|---|
1 Top cover | T1 | 24 7 mm drive assembly (cage+backplanes) | T1 |
2 Standard air baffle | C | 25 7mm drive | T1 |
3 Riser assembly (LP) | T1 | 26 7mm drive bay filler | C |
4 Riser assembly (LP+LP) | T1 | 27 Security bezel | T1 |
5 Riser assembly (LP+FH) | T1 | 28 4 x 2.5-inch front drive backplane | T1 |
6 Rearwall bracket | C | 29 8 x 2.5-inch front drive backplane | T1 |
7 PCIe adapter | T1 | 30 10 x 2.5-inch front drive backplane | T1 |
8 System board | F | 31 4 x 3.5-inch front drive backplane | T1 |
9 RAID super capacitor holder (on chassis) | C | 32 2 x 2.5-inch rear drive cage | T1 |
10 RAID super capacitor holder (in riser cage) | C | 33 2 x 2.5-inch rear drive backplane | T1 |
11 RAID super capacitor | T1 | 34 Internal RAID module | T1 |
12 OCP 3.0 Ethernet adapter | T1 | 35 Intrusion switch cable | T1 |
13 Power supply unit | T1 | 36 Fan module | T1 |
14 Power supply unit filler | C | 37 Memory module | T1 |
15 Front I/O assembly with diagnostics panel (right) | T1 | 38 Chassis | F |
16 Front I/O assembly | T1 | 39 Standard heat sink | F |
17 LCD diagnostics panel assembly | T1 | 40 Performance heat sink (T-shape) | F |
18 Front I/O assembly with diagnostics panel (top) | T1 | 41 Processor | F |
19 1 x 2.5-inch drive bay filler | C | 42 M.2 drive | T1 |
20 2 x 2 2.5-inch drive bay filler | C | 43 M.2 adapter | T1 |
21 2 x 32.5-inch drive bay filler | C | 44 M.2 retainer clip | T1 |
22 2.5-inch drive | T1 | 45 TPM adapter (for Chinese Mainland only) | F |
23 3.5-inch drive | T1 | 46 CMOS battery (CR2032) | C |