Thermal rules

This topic provides thermal rules for the server.

Server models with front drive bays only

This section provides thermal information for server models with front drive bays only.

Max.Temp.: Maximum ambient temperature at sea level; E: entry; S: standard; P: performance

Front drive bays	Max. Temp.	CPU TDP¹ (watts)	Heat sink	Air baffle	Fan type	Max. DIMM Qty.
Front drive bays	Max. Temp.	CPU TDP¹ (watts)	Heat sink	Air baffle	Fan type	DRAM²	PMEM³
8 x 2.5" 16 x 2.5" 8 x 3.5"	45°C	105–165	2U (E)	S	S	32	16
	45°C	185–205	2U (S)	S	S	32	16
	35°C	220–240	2U (S)	S	S	32	16
	30°C	250–270	T-shape (P)	S	P	32	16
24 x 2.5"	30°C	105–165	2U (Entry)	S	S	32	16
	30°C	185–240	2U (S)	S	S	32	16
	30°C	250–270	T-shape (P)	S	P	32	16
12 x 3.5"	30°C	105–165	2U (E)	S	S	32	4
12 x 3.5"	30°C	185–240	2U (S)	S	S	32	4

Note

The following processors have below exceptions:
- The Intel Xeon 6334 HCC 165W processor should use the 2U standard heat sink instead of the 2U entry heat sink.
- The Intel Xeon 8351N XCC 225W processor should follow rules for processors with TDP ranging from 250 watts to 270 watts.
The 256 GB 3DS RDIMMs are supported only in below server models:
- 8 x 2.5"
- 16 x 2.5"
- 8 x 3.5"
When a 256 GB 3DS RDIMM or 512 GB PMEM is installed, the ambient temperature must be limited to 30°C or lower.

This section provides thermal information for server models with middle or rear drive bays.

Max.Temp.: Maximum ambient temperature at sea level; S/S: SAS/SATA; Any: AnyBay; E: entry; S: standard; P: performance; NA: none

Front drive bays	Middle drive bays	Rear drive bays	Max. Temp.	CPU TDP¹ (watts)	Heat sink	Air baffle	Fan type²	Max. DIMM Qty.
Front drive bays	Middle drive bays	Rear drive bays	Max. Temp.	CPU TDP¹ (watts)	Heat sink	Air baffle	Fan type²	DRAM³	PMEM
24 x 2.5" S/S 16 x 2.5" S/S + 8 x Any	NA	4 x 2.5" S/S	30°C	105–165	2U (E)	S	P	32	16
24 x 2.5" S/S 16 x 2.5" S/S + 8 x Any	NA	4 x 2.5" S/S	30°C	185–205	2U (S)	S	P	32	16
24 x 2.5" Any	8 x 2.5" Any	NA	30°C	105–165	1U (S)	NA	P	32	16
24 x 2.5" Any	8 x 2.5" Any	NA	30°C	185–205	T-shape (P)	NA	P	32	16
24 x 2.5" S/S	8 x 2.5" S/S	4 x 2.5" S/S 8 x 2.5" S/S	30°C	105–165	1U (S)	NA	P	32	16
24 x 2.5" S/S	8 x 2.5" S/S	4 x 2.5" S/S 8 x 2.5" S/S	30°C	185–205	T-shape (P)	NA	P	32	16
12 x 3.5" S/S	NA	2 x 3.5" S/S 4 x 2.5" S/S 4 x 3.5" S/S	30°C	105–165	2U (E)	NA	P	32	4
	NA	2 x 3.5" S/S 4 x 2.5" S/S 4 x 3.5" S/S	30°C	185–205	2U (S)	S	P	32	4
	8 x 2.5" Any	NA	30°C	105–165	1U (S)	NA	P	32	4
	8 x 2.5" Any	NA	30°C	185–205	T-shape (P)	NA	P	32	4
	4 x 3.5" S/S	4 x 2.5" S/S 4 x 3.5" S/S	30°C	105–165	1U (S)	NA	P	32	4
	4 x 3.5" S/S	4 x 2.5" S/S 4 x 3.5" S/S	30°C	185–205	T-shape (P)	NA	P	32	4
12 x 3.5" Any	NA	4 x 3.5" S/S	30°C	105–165	2U (E)	S	P	32
	NA	4 x 3.5" S/S	30°C	185–205	2U (S)	S	P	32	4
	4 x 3.5" S/S	4 x 3.5" S/S	30°C	105–165	1U (S)	NA	P	32	4
	4 x 3.5" S/S	4 x 3.5" S/S	30°C	185–205	T-shape (P)	NA	P	32	4

Note

The Intel Xeon 6334 HCC 165W processor is not included. When this processor is used, middle drive bays or rear drive bays are not supported.
When there is only one processor installed, six system fans are needed if a middle drive cage, rear drive cage, or riser 3 is installed.
The 256 GB 3DS RDIMMs are not supported.
For the 12 x 3.5" SAS/SATA (front) + 8 x 2.5" NVMe (middle) configuration, the ambient temperature must be limited to 25°C or lower when the following NVMe SSDs are installed:
- 2.5" U.3 PM1733a 30.72TB RI NVMe SSD
- 2.5" U.3 PM1733a 15.36T RI NVMe SSD
- 2.5" U.2 P5520 7.68TB NVMe SSD
- 2.5" U.2 P5520 15.36TB NVMe SSD
- 2.5" U.2 P5620 6.4 TB NVMe SSD
- 2.5" U.2 P5620 12.8TB NVMe SSD

This section provides thermal information for server models with GPUs.

Category 1: single-wide GPU (<= 75 W): P620, T4, A4, A2, L4
Category 2: single-wide GPU (150 W): A10
Category 3: double-wide GPU (165 W, 250 W, 300 W, 350 W): V100S, A100, A40, A30, A6000, A16, AMD MI210, A800, L40, H100

Max.Temp.: Maximum ambient temperature at sea level; E: entry; S: standard; P: performance; C1/C2/C3: Category 1/2/3

Front drive bays	Max. Temp.	CPU TDP¹ (watts)	Heat sink	Air baffle	Fan type	Max. GPU Qty.			Max. DIMM Qty.
Front drive bays	Max. Temp.	CPU TDP¹ (watts)	Heat sink	Air baffle	Fan type	C1	C2	C3	DRAM²	PMEM
8 x 2.5" 16 x 2.5"³ 8 x 3.5"	30°C	105–165	2U (E)	S	P	8			32	16
	30°C	185–205	2U (S)	S	P	8			32	16
			1U (S)	GPU	P		4		32	16
			1U (S)	GPU	P			3⁵	32	16
	30°C	220–270	T-shape (P)	S	P	8			32	16
				GPU	P		4		32	16
				GPU	P			3⁵	32	16
24 x 2.5"⁴	30°C	105–165	2U (E)	S	P	6			32	4
			1U (S)	GPU	P		4		32	4
			1U (S)	GPU	P			2	32	4
	30°C	185–240	T-shape (P)	S	P	6			32	4
				GPU	P		4		32	4
				GPU	P			2	32	4

Note

The following processors have below exceptions:
- The Intel Xeon 6334 HCC 165W processor should use the 2U standard heat sink instead of the 2U entry heat sink.
- The Intel Xeon 8351N XCC 225W processor should follow rules for processors with TDP ranging from 250 watts to 270 watts.
The 256 GB 3DS RDIMMs are supported only in below server configurations:
- 8 x 2.5"
- 16 x 2.5"
- 8 x 3.5"
For the 16 x 2.5-inch AnyBay configuration, a maximum of two NVIDIA A40 or L40 GPU adapters are supported in PCIe slot 2 and slot 5 when the ambient temperature is 30°C and a maximum of three NVIDIA A40 or L40 GPU adapters are supported in PCIe slot 2, slot 5 and slot 7 when the ambient temperature is 25°C.
The NVIDIA V100S, A40, A100 80G, A800, L40, and H100 adapters are not supported by the 24 x 2.5-inch configuration.
For the AMD MI210 adapter, a maximum of two adapters are supported.

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