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Thermal rules

This topic provides thermal rules for the server.

Server models with front drive bays only

This section provides thermal information for server models with front drive bays only.

Max.Temp.: Maximum ambient temperature at sea level; E: entry; S: standard; P: performance

Front drive baysMax. Temp.CPU TDP1 (watts)Heat sinkAir baffleFan typeMax. DIMM Qty.
DRAM2PMEM3
  • 8 x 2.5"

  • 16 x 2.5"

  • 8 x 3.5"

45°C105–1652U (E)SS3216
45°C185–2052U (S)SS3216
35°C220–2402U (S)SS3216
30°C250–270T-shape (P)SP3216

24 x 2.5"

30°C105–1652U (Entry)SS3216
30°C185–2402U (S)SS3216
30°C250–270T-shape (P)SP3216

12 x 3.5"

30°C105–1652U (E)SS324
30°C185–2402U (S)SS324
Note
  1. The following processors have below exceptions:

    • The Intel Xeon 6334 HCC 165W processor should use the 2U standard heat sink instead of the 2U entry heat sink.

    • The Intel Xeon 8351N XCC 225W processor should follow rules for processors with TDP ranging from 250 watts to 270 watts.

  2. The 256 GB 3DS RDIMMs are supported only in below server models:

    • 8 x 2.5"

    • 16 x 2.5"

    • 8 x 3.5"

  3. When a 256 GB 3DS RDIMM or 512 GB PMEM is installed, the ambient temperature must be limited to 30°C or lower.

Server models with middle/rear drive bays

This section provides thermal information for server models with middle or rear drive bays.

Max.Temp.: Maximum ambient temperature at sea level; S/S: SAS/SATA; Any: AnyBay; E: entry; S: standard; P: performance; NA: none
Front drive baysMiddle drive baysRear drive baysMax. Temp.CPU TDP1 (watts)Heat sinkAir baffleFan type2Max. DIMM Qty.
DRAM3PMEM

24 x 2.5" S/S

16 x 2.5" S/S + 8 x Any

NA

4 x 2.5" S/S

30°C105–1652U (E)SP3216
30°C185–2052U (S)SP3216

24 x 2.5" Any

8 x 2.5" Any

NA

30°C105–1651U (S)

NA

P3216
30°C185–205T-shape (P)

NA

P3216

24 x 2.5" S/S

8 x 2.5" S/S

4 x 2.5" S/S

8 x 2.5" S/S

30°C105–1651U (S)

NA

P3216
30°C185–205T-shape (P)

NA

P3216

12 x 3.5" S/S

NA

2 x 3.5" S/S

4 x 2.5" S/S

4 x 3.5" S/S

30°C105–1652U (E)

NA

P324
30°C185–2052U (S)SP324

8 x 2.5" Any

NA

30°C105–1651U (S)

NA

P324
30°C185–205T-shape (P)

NA

P324

4 x 3.5" S/S

4 x 2.5" S/S

4 x 3.5" S/S

30°C105–1651U (S)

NA

P324
30°C185–205T-shape (P)

NA

P324

12 x 3.5" Any

NA

4 x 3.5" S/S

30°C105–1652U (E)SP32 
30°C185–2052U (S)SP324

4 x 3.5" S/S

4 x 3.5" S/S

30°C105–1651U (S)

NA

P324
30°C185–205T-shape (P)

NA

P324
Note
  1. The Intel Xeon 6334 HCC 165W processor is not included. When this processor is used, middle drive bays or rear drive bays are not supported.

  2. When there is only one processor installed, six system fans are needed if a middle drive cage, rear drive cage, or riser 3 is installed.

  3. The 256 GB 3DS RDIMMs are not supported.

  4. For the 12 x 3.5" SAS/SATA (front) + 8 x 2.5" NVMe (middle) configuration, the ambient temperature must be limited to 25°C or lower when the following NVMe SSDs are installed:

    • 2.5" U.3 PM1733a 30.72TB RI NVMe SSD

    • 2.5" U.3 PM1733a 15.36T RI NVMe SSD

    • 2.5" U.2 P5520 7.68TB NVMe SSD

    • 2.5" U.2 P5520 15.36TB NVMe SSD

    • 2.5" U.2 P5620 6.4 TB NVMe SSD

    • 2.5" U.2 P5620 12.8TB NVMe SSD

Server models with GPUs

This section provides thermal information for server models with GPUs.

  • Category 1: single-wide GPU (<= 75 W): P620, T4, A4, A2, L4

  • Category 2: single-wide GPU (150 W): A10

  • Category 3: double-wide GPU (165 W, 250 W, 300 W, 350 W): V100S, A100, A40, A30, A6000, A16, AMD MI210, A800, L40, H100

Max.Temp.: Maximum ambient temperature at sea level; E: entry; S: standard; P: performance; C1/C2/C3: Category 1/2/3

Front drive baysMax. Temp.CPU TDP1 (watts)Heat sinkAir baffleFan typeMax. GPU Qty.Max. DIMM Qty.
C1C2C3DRAM2PMEM

8 x 2.5"

16 x 2.5"3

8 x 3.5"

30°C105–1652U (E)SP8  3216
30°C185–2052U (S)SP8  3216
1U (S)GPUP 4 3216
1U (S)GPUP  353216
30°C220–270T-shape (P)SP8  3216
GPUP 4 3216
GPUP  353216

24 x 2.5"4

30°C105–1652U (E)SP6  324
1U (S)GPUP 4 324
1U (S)GPUP  2324
30°C185–240T-shape (P)SP6  324
GPUP 4 324
GPUP  2324
Note
  1. The following processors have below exceptions:

    • The Intel Xeon 6334 HCC 165W processor should use the 2U standard heat sink instead of the 2U entry heat sink.

    • The Intel Xeon 8351N XCC 225W processor should follow rules for processors with TDP ranging from 250 watts to 270 watts.

  2. The 256 GB 3DS RDIMMs are supported only in below server configurations:

    • 8 x 2.5"

    • 16 x 2.5"

    • 8 x 3.5"

  3. For the 16 x 2.5-inch AnyBay configuration, a maximum of two NVIDIA A40 or L40 GPU adapters are supported in PCIe slot 2 and slot 5 when the ambient temperature is 30°C and a maximum of three NVIDIA A40 or L40 GPU adapters are supported in PCIe slot 2, slot 5 and slot 7 when the ambient temperature is 25°C.

  4. The NVIDIA V100S, A40, A100 80G, A800, L40, and H100 adapters are not supported by the 24 x 2.5-inch configuration.

  5. For the AMD MI210 adapter, a maximum of two adapters are supported.