Remove an H100/H200 GPU and heat sink module
Follow instructions in this section to remove an H100/H200 GPU and heat sink module. The procedure must be executed by a trained technician.
About this task
Attention
- Read Installation Guidelines and Safety inspection checklist to ensure that you work safely.
- Power off the server and peripheral devices and disconnect the power cords and all external cables. See Power off the server.
- Two people and one lifting device on site that can support up to 400 lb (181 kg) are required to perform this procedure. If you do not already have a lifting device available, Lenovo offers the Genie Lift GL-8 material lift that can be purchased at Data Center Solution Configurator. Make sure to include the Foot-release brake and the Load Platform when ordering the Genie Lift GL-8 material lift.
- Make sure to inspect the connectors and sockets on the GPU and the GPU baseboard. Do not use the GPU or the GPU baseboard if its connectors are damaged or missing, or if there are debris in the sockets. Replace the GPU or the GPU baseboard with a new one before continuing the installation procedure.
- GPU and heat sink is one part. Do not remove the heat sink from the GPU.
- The following illustration shows the GPU and heat sink module numbering and corresponding slot numbering in XCC.
GPU and heat sink module numbering Slot numbering in XCC GPU 1 Slot 21 GPU 2 Slot 24 GPU 3 Slot 22 GPU 4 Slot 23 GPU 5 Slot 17 GPU 6 Slot 20 GPU 7 Slot 18 GPU 8 Slot 19
Note
Make sure you have the required tools listed below available to properly replace the component:
- Torque screwdriver which can be set to 0.6 newton-meters, 5.3 inch-pounds
- Torx T15 extended bit (6-inch long)
Procedure
After you finish
If you are instructed to return the component or optional device, follow all packaging instructions, and use any packaging materials for shipping that are supplied to you.
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