The following information is a summary of the features and specifications of the server. Depending on the model, some features might not be available, or some specifications might not apply.
Table 1. Server Specifications
Specification
Description
Size
4U server
Height: 175.3 mm (6.90 in.)
Depth: 851 mm (33.50 in.)
Width: 447.0 mm (17.6 in.)
Weight
Approximately 32.6 kg (71.9 lbs.) to 58.7 kg (129.4 lbs.) depending on your configuration.
Processor (depending on the model)
Supports multi-core Intel Xeon processors, with integrated memory controller and Ultra Path Interconnect (UPI)
Two processors, minimum (expandable up to eight).
Designed for the LGA 3647-0 socket
Scalable up to 224 cores (with eight processors installed)
If 82xx processors are installed, 60 mm x 38mm, 19K internal hot-swap fans (01PG490) must also be installed to meet CPU cooling requirements at 35°C. If 16K internal hot-swap fans are currently installed, you must validate that the system has version 2 of the ThinkSystem 2-CPU, 24-DIMM, Compute System Board (01CV978) installed in each compute tray before upgrading the fans from 16K to 19K.
Slots: 24 dual inline in each compute tray (96 DIMMs, maximum)
Supports (depending on the model):
16 GB, 32 GB, 64 GB RDIMMs
64 GB LRDIMMs
64 GB, 128 GB, 256 GB 3DS RDIMMs
128 GB, 256 GB, and 512 GB Intel® OptaneTM DC persistent memory modules (DCPMMs)
Note
When Windows Server 2016 or 2019 is installed on the ThinkSystem SR950, the server cannot have greater than 20 TB of system memory installed unless Credential Guard and the Hyper-V role are both disabled. This issue will be addressed on Windows Server 2019 within a Microsoft Update at a future date. Note that Optane DIMMs are only supported on Windows Server 2019 and later.
Note
List of supported memory module is different for 1st generation (Skylake) and 2nd generation (Cascade Lake) Intel Xeon processors. Make sure to install compatible memory modules to avoid system error.For a list of supported DIMMs, see: Lenovo ServerProven website.
Drive expansion
Up to six SAS/SATA/NVMe drive backplanes:
Up to 24 2.5-inch hot-swap drive bays:
Up to 24 SATA/SAS drives (dependent on installed drive backplanes)
Up to 12 NVMe drives (dependent on installed drive backplanes)
Lenovo XClarity Controller, which provides service processor control and monitoring functions, video controller, and remote keyboard, video, mouse, and remote drive capabilities.
Light-path diagnostics
Standard connectors (front of server):
DB-15 VGA port
USB 2.0 ports (two):
USB 2.0 for Lenovo XClarity Controller management
USB 2.0
Standard connectors (rear of server):
DB-15 VGA port
DB-9 serial port
RJ-45 system-management network port. This connector is dedicated for Lenovo XClarity Controller functions and runs at 1 gigabit (Gb) speed.
USB 3.0 ports (two)
RAID controller (depending on the model)
The following RAID options are available for this server:
ThinkSystem 730-8i Value Advanced Hardware RAID 1 GB Cache PCIe Adapter, supports JBOD mode and RAID levels 0/1/5/10/50 (for Chinese Mainland only)
ThinkSystem 730-8i Value Advanced Hardware RAID 2 GB Cache PCIe Adapter, supports JBOD mode and RAID levels 0/1/5/10/50 (for Chinese Mainland only and Asian-Pacific area only)
Up to twelve (60 mm x 38 mm) internal hot-swap system fans (dependent on server configuration)
The six upper fans are not installed for the four-processor-limited server configuration.
Only three upper fans are installed for the storage-rich configuration.
Two types of fans are supported:
60 mm x 38mm, 16K internal hot-swap fans (01CX965)
60 mm x 38mm, 19K internal hot-swap fans (01PG490)
Note
Different fan types cannot be mixed within a system. All fans must be either 16K fans or 19K fans.
Before upgrading fans from 16K to 19K, you must make sure that the system has version 2 of the ThinkSystem 2-CPU, 24DIMM, Compute System Board (01CV978) installed in each compute tray.
Power supplies
This server supports three types of hot-swap power supply units:
1100-watt power supply
input voltage 110V, 220V, or 240V ac
1600-watt power supply
input voltage 220V or 240V ac
2000-watt power supply
input voltage 220V ac
The power subsystem supports balanced N+N redundancy operation, where N = 1 or 2.
CAUTION
240 V dc input (input range: 180-300 V dc) is ONLY supported in Chinese Mainland.
Power supplies with 240 V dc are not hot-swappable. To remove the power cord, ensure you have turned off the server or disconnected the dc power sources at the breaker panel.
In order for the ThinkSystem products to operate error free in both a DC or AC electrical environment, a TN-S earthing system which complies to 60364-1 IEC 2005 standard has to be present or installed.
Minimal configuration for debugging
Two processors in processor socket 1 and 2
Two DRAM DIMMs in slot 8 and 20
One power supply in slot 1
One drive with RAID adapter and backplane (If OS is required for debugging)
Six system fans (fan 1 to 6)
Acoustical noise emissions (base configuration)
Sound power level, idling:
Minimum configuration: 7.0 bels
Typical configuration: 7.0 bels
Maximum configuration: 7.8 bels
Sound power level, operating:
Minimum configuration: 7.0 bels
Typical configuration: 7.2 bels
Maximum configuration: 8.0 bels
Note
These levels were measured in controlled acoustical environments according to procedures specified by ISO 7779 and are reported in accordance with ISO 9296.
The options supported in this server vary in function, power consumption, and required cooling. Any increase in cooling required by these options will increase the fan speed and generated sound level. The actual sound pressure levels measured in your installation depend upon a variety of factors, including: the number of racks in the installation; the size, materials, and configuration of the room; the noise levels of other equipment; the room ambient temperature and barometric pressure; and the location of employees in relation to the equipment.
Heat output
Approximate heat output:
Minimum configuration: 935 BTU, 275 W (in BTU per hour and watts)
Minimum configuration of two microprocessors, two memory modules, one M.2 adapter, and no PCIe adapters.
Maximum configuration: 21837 BTU, 6400 W (in BTU per hour and watts)
Maximum configuration with four 1600-watt power supplies configured for non-redundant operation under maximum loading.
Environment
Air temperature:
Server on: 5° to 45°C (41° to 113°F); altitude: 0 to 3050 m (10,006 ft) derate maximum dry bulb temperature 1°C (33°F) per 125 m (410 ft) above 950 m (3,117 ft). Maximum rate of change 20°C (68°F) per hour
Server off: 5° to 45°C (41° to 113°F)
Shipment: -40°C to 60°C (-40°F to 140°F)
Humidity range (noncondensing):
Server on: Minimum = higher (more moisture) of -12°C (10°F) dew point and 8% to 90% relative humidity; maximum dew point: 24°C (75°F)
Server off: 8% to 90% relative humidity; maximum dew point: 27°C (80°F)
Shipment: 5% to 100%
Note
Particulate contamination
Attention
Airborne particulates and reactive gases acting alone or in combination with other environmental factors such as humidity or temperature might pose a risk to the server. For information about the limits for particulates and gases, see Particulate contamination.
ASHRAE compliance information (see the Operating Environment section of the Lenovo ThinkSystem SR950 Product Guide for specific ASHRAE compliance levels for each server configuration):
The server is designed for thermal compliance in ASHRAE A4 ambient environments. Certain processor and adapter configurations will limit product environmental support to ASHRAE A2 ambient conditions.
If 82xx processors are installed, 60 mm x 38mm, 19K internal hot-swap fans (01PG490) must also be installed to meet CPU cooling requirements at 35°C.
205W processors used in an eight-socket configuration might experience a slight drop in performance under extreme workloads when the ambient temperature is above 30°C.
NVMe devices are supported up to an ambient temperature of 35°C.
Particulate contamination Attention: Airborne particulates (including metal flakes or particles) and reactive gases acting alone or in combination with other environmental factors such as humidity or temperature might pose a risk to the device that is described in this document.