Skip to main content

Technical specifications

Summary of the technical specifications of solution. Depending on the model, some features might not be available, or some specifications might not apply.

Note

  • Up to six SD650-N V3 trays can be installed in the DW612S 6U enclosure. For more information on the number of trays in the enclosure, see GPU power and maximum number of trays in the enclosure.

  • SD650-N V3 tray contains one compute node on the right and one GPU node on the left (when viewed from front of the DW612S enclosure)

  • The GPU node contains the NVIDIA HGX H100 4-GPU board and the network board (4 Connect-X 7).

Processor

  • Supports two processors per node. Supported CPUs are:

    • 4th Gen Intel® Xeon® Scalable processors (formerly known as Sapphire Rapids, SPR)

    • 5th Gen Intel® Xeon® Scalable processors (formerly known as Emerald Rapids, EMR)

    • Intel® Xeon® CPU Max processors

  • Supports processors with up to 60 cores, base speeds up to 3.7 GHz, and TDP ratings up to 385W.

  • Supports 3 UPI.

    • UPI links at higher width (x24) and speed: 12.8, 14.4 and 16 GT/s.

  • New Socket Technology (Socket E with PCIe 5.0) LGA4677.

Note
  1. Use the Setup Utility to determine the type and speed of the processors in the node.
  2. For a list of supported processors, see Lenovo ServerProven website.
Memory

See Memory module installation rules and order for detailed information about memory configuration and setup.

  • Slots:

    • 16 DIMM slots per node, 8 DIMMs per processor. SD650-N V3 only supports fully populated DIMM configuration.

  • Memory type and capacity:

    • 4th Gen Intel® Xeon® Scalable processors (Sapphire Rapids, SPR)

      • Lenovo DDR5 at 4800 MT/s

      • 3DS RDIMM at 4800 MT/s

      • Capacity:

        • 32Gb based memory: 32 GB and 64 GB ECC RDIMM

        • 24Gb based memory: 48GB and 96 GB ECC RDIMM (supported by XCC and MCC processors)

        • 128 GB 3DS RDIMM

      Note
      For 4th Gen Intel® Xeon® Scalable processors (Sapphire Rapids, SPR), Intel® Xeon® CPU Max does not support 24Gb based memory.

    • 5th Gen Intel® Xeon® Scalable processors (Emerald Rapids, EMR)

      • Lenovo DDR5 at 5600 MT/s

      • 3DS RDIMM at 5600 MT/s

      • Capacity:

        • 32Gb based memory: 32 GB and 64 GB ECC RDIMM

        • 24Gb based memory: 48GB and 96 GB ECC RDIMM (supported by both MCC and XCC processors)

        • 128 GB 3DS RDIMM

  • Protection:

    • ECC

    • SDDC (for x4-based memory DIMMs)

    • ADDDC (for x4-based memory DIMMs)

  • Minimum capacity per node:

    • 512GB per node with sixteen 32 GB RDIMMs

  • Maximum capacity per node:

    • Up to 1.5 TB memory with sixteen 96 GB RDIMMs

    • Up to 2 TB memory with sixteen 128 GB 3DS RDIMMs

Important

  • The tray only supports fully populated processor and memory configuration (2 processors and 16 DIMMs per node).

  • Mixing DIMM speed is not supported.

  • Before installing 24 Gb DRAM RDIMMs to a system with 4th Gen Intel Xeon processors (codenamed Sapphire Rapids), make sure to update the UEFI firmware to the latest version first, then remove all existing 16 Gb DRAM RDIMMs.

  • ADDDC not supported for 9x4 ECC DIMM (Value)

Storage expansion

  • Supports up to two 7 mm simple-swap NVMe solid-state drives (SSD) per node.

  • Supports up to one 15 mm simple-swap NVMe solid-state drive (SSD) per node.

  • Supports up to two E3.S simple-swap NVMe solid-state drive (SSD) per node.

  • Supports one M.2 drive per node. (Requires the M.2 interposer assembly)

    For a list of supported M.2 drives, see Lenovo ServerProven website.

Attention
As a general consideration, do not mix standard 512-byte and advanced 4-KB format drives in the same RAID array because it might lead to potential performance issues.
Graphics processing unit (GPU)

NVIDIA HGX H100 4-GPU board

Integrated functions and I/O connectors

  • An OSFP module with either two 400Gb or two 800Gb OSFP ports, connecting to four ConnectX-7 chip sets on the network board.

  • Lenovo XClarity Controller (XCC), which provides service processor control and monitoring functions, video controller, and remote keyboard, video, mouse, and remote drive capabilities.

  • Front operator panel

  • KVM breakout cable connector

    The KVM breakout cable includes VGA connector, serial port connector, and USB 3.0 (5 Gbps) / 2.0 connector. XCC mobile management is supported by USB 2.0 connector on the KVM breakout cable only.

    For more information, see KVM breakout cable.

  • External LCD diagnostics handset connector

  • One Gigabit Ethernet port with RJ45 connector, shared between operating system and Lenovo XClarity Controller.

  • Two 25Gb SFP28 ports. One port is shared between operating system and Lenovo XClarity Controller.

    Note

    Lenovo XClarity Controller connection is mutually exclusive between RJ45 Ethernet connector and 25Gb SFP28 Port 1.

  • Video controller (integrated into Lenovo XClarity Controller)
    • ASPEED
    • SVGA compatible video controller
    • Avocent Digital Video Compression
    • Video memory is not expandable
    Note
    Maximum video resolution is 1920 x 1200 at 60 Hz.

  • Hot-swappable System Management Module 2 (SMM2)

    Note
    See SMM2 User Guide for more details about System Management Module.
Network
Compute node

  • An OSFP module with either two 400Gb or two 800Gb OSFP ports, connecting to four ConnectX-7 chip sets on the network board.

  • One Gigabit Ethernet port with RJ45 connector, shared between operating system and Lenovo XClarity Controller.

  • Two 25Gb SFP28 ports. One port is shared between operating system and Lenovo XClarity Controller.

Lenovo XClarity Controller connection is mutually exclusive between RJ45 Ethernet connector and 25Gb SFP28 Port 1.

Storage controllers
PCIe x4 NVMe:

  • Onboard NVMe

  • Intel VROC Premium, supports Raid 0, 1, and 10 based on storage configuration.

Electrical input
SD650-N V3 tray installed in DW612S enclosure
  • Supports nine hot-swap 2600W AC power supplies.

    • Sine-wave input (50-60 Hz) required

    • Input voltage for 2600W power supplies:

      • 200-208 Vac, 240 Vdc (output up to 2400W only)

      • 208-240 Vac, 240 Vdc

    • Nine power supplies: 8+1 without oversubscription

  • Supports three hot-swap DWC 7200W power supplies.

    • Input voltage:

      • 200-208 Vac (work as 6900W)

      • 220-240 Vac, 240 Vdc (work as 7200W)

    • Three DWC PSUs: work as 8+1 without oversubscription

CAUTION

Mixing PSUs manufactured by different vendors is not supported.

Note
Refer to SMM2 web interface for more details of solution power status.
Minimal configuration for debugging

SD650-N V3 tray installed in DW612S enclosure

  • One DW612S Enclosure

  • One SD650-N V3 tray

  • Two processors on the compute node

  • One NVIDIA HGX H100 4-GPU board and network board (4 Connect-X 7)

  • 2 DIMMs per node in slot 4 and slot 13. (one DIMM per processor)

  • Two CFF v4 power supplies or one DWC PSU

  • One drive (any type) (If OS is needed for debugging)

Operating systems
Supported and certified operating systems:

  • Ubuntu Server

  • Red Hat Enterprise Linux

  • SUSE Linux Enterprise Server

References: